component
UM6K34NTCN
Public Made by Adomby adom
ROHM Semicon MOSFETs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownUM6K34NTCN
ROHM Semicon · MOSFETs · SOT-363
UM6K34NTCN from ROHM Semicon, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of Tr1 (Nch MOSFET, VDSS 50V, ID ±200mA). |
| 2 | G1 | input | Gate of Tr1; VGSS maximum ±8V, 0.9V drive, VGS(th) 0.3 to 0.8V, with ESD protection diode. |
| 3 | D2 | passive | Drain of Tr2 (Nch MOSFET, VDSS 50V, ID ±200mA). |
| 4 | S2 | passive | Source of Tr2 (Nch MOSFET). |
| 5 | G2 | input | Gate of Tr2; VGSS maximum ±8V, 0.9V drive, VGS(th) 0.3 to 0.8V, with ESD protection diode. |
| 6 | D1 | passive | Drain of Tr1 (Nch MOSFET, VDSS 50V, ID ±200mA). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOT-363 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain - Source voltage | VDSS | 50 | V | 1 | |||
| Continuous drain current | ID | -200 | 200 | mA | 1 | ||
| Pulsed drain current | IDP | -800 | 800 | mA | Pw≦10μs, Duty cycle≦1% | 1 | |
| Gate - Source voltage | VGSS | -8 | 8 | V | 1 | ||
| Power dissipation total | PD | 150 | mW | Each terminal mounted on a reference land | 1 | ||
| Power dissipation element | PD | 120 | mW | Each terminal mounted on a reference land | 1 | ||
| Junction temperature | Tj | 150 | ℃ | 1 | |||
| Operating junction and storage temperature range | Tstg | -55 | 150 | ℃ | 1 | ||
| Thermal resistance, junction - ambient total | RthJA | 833 | ℃/W | Each terminal mounted on a reference land | 2 | ||
| Thermal resistance, junction - ambient element | RthJA | 1042 | ℃/W | 2 | |||
| Drain - Source breakdown voltage | V(BR)DSS | 50 | V | VGS = 0V, ID = 1mA | 2 | ||
| Zero gate voltage drain current | IDSS | 1 | μA | VDS = 50V, VGS = 0V | 2 | ||
| Gate - Source leakage current | IGSS | -10 | 10 | μA | VDS = 0V, VGS = ±8V | 2 | |
| Gate threshold voltage | VGS(th) | 0.3 | 0.8 | V | VDS = 10V, ID = 1mA | 2 | |
| Static drain - source on-state resistance | RDS(on) | 1.6 | 2.2 | Ω | VGS = 4.5V, ID = 200mA | 2 | |
| Static drain - source on-state resistance | RDS(on) | 1.7 | 2.4 | Ω | VGS = 2.5V, ID = 200mA | 2 | |
| Static drain - source on-state resistance | RDS(on) | 2 | 2.8 | Ω | VGS = 1.5V, ID = 200mA | 2 | |
| Static drain - source on-state resistance | RDS(on) | 2.2 | 3.3 | Ω | VGS = 1.2V, ID = 100mA | 2 | |
| Static drain - source on-state resistance | RDS(on) | 3 | 9 | Ω | VGS = 0.9V, ID = 10mA | 2 | |
| Forward transfer admittance | /Yfs/ | 200 | mS | VDS = 10V, ID = 200mA | 2 | ||
| Breakdown voltage temperature coefficient | ΔV(BR)DSS | 53.7 | mV/℃ | ID = 1mA, ΔTj referenced to 25℃ | 2 | ||
| Gate threshold voltage temperature coefficient | ΔVGS(th) | -1.4 | mV/℃ | ID = 1mA, ΔTj referenced to 25℃ | 2 | ||
| Input capacitance | Ciss | 26 | pF | VGS = 0V | 3 | ||
| Output capacitance | Coss | 6 | pF | VDS = 10V | 3 | ||
| Reverse transfer capacitance | Crss | 3 | pF | f = 1MHz | 3 | ||
| Turn-on delay time | td(on) | 5 | ns | VDD ⋍ 25V, VGS = 4.5V | 3 | ||
| Rise time | tr | 8 | ns | ID = 100mA | 3 | ||
| Turn-off delay time | td(off) | 17 | ns | RL = 250Ω | 3 | ||
| Fall time | tf | 43 | ns | RG = 10Ω | 3 | ||
| Continuous forward current | IS | 125 | mA | Ta = 25℃ | 3 | ||
| Pulse forward current | ISP | 800 | mA | Pw≦10μs, Duty cycle≦1% | 3 | ||
| Forward voltage | VSD | 1.2 | V | VGS = 0V, IS = 200mA | 3 |
CAD (KiCad official)
- Symbol:
UM6K34NTCN - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
um6k34ntcn-etched.step/um6k34ntcn-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);um6k34ntcn.step/um6k34ntcn.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (12 pp, sha256
186e95641dcaab15, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).