component
TNM2K30K-FX
Public Made by Adomby adom
Shenzhen JingYang MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTNM2K30K-FX
Shenzhen JingYang · MOSFETs · SOT-23
TNM2K30K-FX from Shenzhen JingYang, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | input | MOSFET gate terminal of the N-channel 30 V device, with a gate-source voltage rating of ±12 V (VGS) per the maximum ratings table. |
| 2 | SOURCE | passive | MOSFET source terminal of the N-channel device, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 0.5 A (ID) per the maximum ratings table. |
| 3 | DRAIN | passive | MOSFET drain terminal of the N-channel device, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 0.5 A (ID) per the maximum ratings table. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 30 | V | VGS = 0V, ID = 10µA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 30V, VGS = 0V | 2 | ||
| Gate-Source leakage current | IGSS | -10 | 10 | µA | VGS = ±12V, VDS = 0V | 2 | |
| Gate Threshold Voltage | VGS(th) | 0.8 | 1.1 | V | VDS = VGS, ID = 250µA | 2 | |
| Drain-Source On-Resistance | RDS(on) | 2.8 | 3.4 | Ω | VGS = 1.5V, ID = 20mA | 2 | |
| Drain-Source Voltage | VDS | 30 | V | 1 | |||
| Gate-Source Voltage | VGS | -12 | 12 | V | 1 | ||
| Continuous Drain Current | ID | 0.5 | A | 1 | |||
| Power Dissipation | PD | 0.35 | W | 1 | |||
| Operation Junction and Storage Temperature Range | TJ,Tstg | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 357 | ℃ /W | 1 |
CAD (KiCad official)
- Symbol:
TNM2K30K-FX - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
tnm2k30k-fx-etched.step/tnm2k30k-fx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tnm2k30k-fx.step/tnm2k30k-fx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JingYang datasheet (5 pp, sha256
51da7702320c903f, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).