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Contents

README

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TNM2K30K-FX

Shenzhen JingYang · MOSFETs · SOT-23

TNM2K30K-FX from Shenzhen JingYang, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input MOSFET gate terminal of the N-channel 30 V device, with a gate-source voltage rating of ±12 V (VGS) per the maximum ratings table.
2 SOURCE passive MOSFET source terminal of the N-channel device, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 0.5 A (ID) per the maximum ratings table.
3 DRAIN passive MOSFET drain terminal of the N-channel device, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 0.5 A (ID) per the maximum ratings table.

Key specifications

Parameter Value
Manufacturer Shenzhen JingYang
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VDS 30 V VGS = 0V, ID = 10µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 30V, VGS = 0V 2
Gate-Source leakage current IGSS -10 10 µA VGS = ±12V, VDS = 0V 2
Gate Threshold Voltage VGS(th) 0.8 1.1 V VDS = VGS, ID = 250µA 2
Drain-Source On-Resistance RDS(on) 2.8 3.4 Ω VGS = 1.5V, ID = 20mA 2
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -12 12 V 1
Continuous Drain Current ID 0.5 A 1
Power Dissipation PD 0.35 W 1
Operation Junction and Storage Temperature Range TJ,Tstg -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 357 ℃ /W 1

CAD (KiCad official)

  • Symbol: TNM2K30K-FX
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: tnm2k30k-fx-etched.step / tnm2k30k-fx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tnm2k30k-fx.step / tnm2k30k-fx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JingYang datasheet (5 pp, sha256 51da7702320c903f, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF