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Contents

README

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BST563A055V

BORN · ESD And Surge Protection (TVS/ESD) · SOT-563

BST563A055V from BORN, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO1 passive ESD-protected data/power line I/O 1, steered by a diode to GND pin 2, with VRWM 5.0 V, VBR 6.0 V min at 1 mA and clamping 12 V max at IPP = 7.5 A (8/20 µs).
2 GND power_in Common ground return for all protection diodes in the array; I/O-to-GND junction capacitance is 40 pF at VR = 0 V, f = 1 MHz.
3 IO2 passive ESD-protected data/power line I/O 2, steered by a diode to GND pin 2, with VRWM 5.0 V and IEC 61000-4-2 protection of ±8 kV contact and ±15 kV air.
4 IO3 passive ESD-protected data/power line I/O 3, steered by a diode to GND pin 2, with VRWM 5.0 V and 500 nA max leakage at 5 V, 25 °C.
5 IO4 passive ESD-protected data/power line I/O 4, steered by a diode to GND pin 2, with 90 W peak pulse power (8/20 µs) and 7.5 A peak pulse current.
6 IO5 passive ESD-protected data/power line I/O 5, steered by a diode to GND pin 2, with VRWM 5.0 V and I/O-to-I/O capacitance of 20 pF at VR = 0 V, f = 1 MHz.

Key specifications

Parameter Value
Manufacturer BORN
Package SOT-563
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Stand-Off Voltage VRWM 5 V 2
Reverse Breakdown Voltage VBR 6 V IT=1mA 2
Reverse Leakage Current IR 50 500 nA VRWM=5V, T=25℃ 2
Clamping Voltage VC 12 V IPP=7.5A, tp=8/20μs 2
Junction Capacitance IO to IO Cj 20 pF VR = 0V, f = 1MHz, IO to IO 2
Junction Capacitance IO to GND Cj 40 pF VR = 0V, f = 1MHz, IO to GND 2
Peak Pulse Power PPP 90 Watts tp = 8/20μs 2
Peak Pulse Current Ipp 7.5 A tp = 8/20μs (note 1) 2
ESD per IEC 61000-4-2 (Air) VESD 15 kV IEC 61000-4-2 air discharge 2
ESD per IEC 61000-4-2 (Contact) VESD 8 kV IEC 61000-4-2 contact discharge 2
Lead Soldering Temperature TL 260 ℃ 10 seconds 2
Junction Temperature TJ -55 125 ℃ 2
Storage Temperature Tstg -55 125 ℃ 2

CAD (KiCad official)

  • Symbol: BST563A055V
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: bst563a055v-etched.step / bst563a055v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bst563a055v.step / bst563a055v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (4 pp, sha256 8ed88b0d5deb3f0e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF