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Generated by kicad-footprint-generator · KiCad file format 20260206

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bst563a055v-etched.step	bst563a055v: factory component page (tier=lcsc) · Ray	17d ago
bst563a055v-hero.glb	bst563a055v: hero GLB from the etched model (keeps the MPN mark) · Ray	17d ago
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BST563A055V

BORN · ESD And Surge Protection (TVS/ESD) · SOT-563

BST563A055V from BORN, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IO1	passive	ESD-protected data/power line I/O 1, steered by a diode to GND pin 2, with VRWM 5.0 V, VBR 6.0 V min at 1 mA and clamping 12 V max at IPP = 7.5 A (8/20 µs).
2	GND	power_in	Common ground return for all protection diodes in the array; I/O-to-GND junction capacitance is 40 pF at VR = 0 V, f = 1 MHz.
3	IO2	passive	ESD-protected data/power line I/O 2, steered by a diode to GND pin 2, with VRWM 5.0 V and IEC 61000-4-2 protection of ±8 kV contact and ±15 kV air.
4	IO3	passive	ESD-protected data/power line I/O 3, steered by a diode to GND pin 2, with VRWM 5.0 V and 500 nA max leakage at 5 V, 25 °C.
5	IO4	passive	ESD-protected data/power line I/O 4, steered by a diode to GND pin 2, with 90 W peak pulse power (8/20 µs) and 7.5 A peak pulse current.
6	IO5	passive	ESD-protected data/power line I/O 5, steered by a diode to GND pin 2, with VRWM 5.0 V and I/O-to-I/O capacitance of 20 pF at VR = 0 V, f = 1 MHz.

Key specifications

Parameter	Value
Manufacturer	BORN
Package	SOT-563
Category	Circuit Protection
Pins	6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Reverse Stand-Off Voltage	VRWM			5	V		2
Reverse Breakdown Voltage	VBR	6			V	IT=1mA	2
Reverse Leakage Current	IR		50	500	nA	VRWM=5V, T=25℃	2
Clamping Voltage	VC			12	V	IPP=7.5A, tp=8/20μs	2
Junction Capacitance IO to IO	Cj		20		pF	VR = 0V, f = 1MHz, IO to IO	2
Junction Capacitance IO to GND	Cj		40		pF	VR = 0V, f = 1MHz, IO to GND	2
Peak Pulse Power	PPP			90	Watts	tp = 8/20μs	2
Peak Pulse Current	Ipp			7.5	A	tp = 8/20μs (note 1)	2
ESD per IEC 61000-4-2 (Air)	VESD			15	kV	IEC 61000-4-2 air discharge	2
ESD per IEC 61000-4-2 (Contact)	VESD			8	kV	IEC 61000-4-2 contact discharge	2
Lead Soldering Temperature	TL			260	℃	10 seconds	2
Junction Temperature	TJ	-55		125	℃		2
Storage Temperature	Tstg	-55		125	℃		2

CAD (KiCad official)

Symbol: BST563A055V
Footprint: Package_TO_SOT_SMD:SOT-563
3D model: SOT-563 (KiCad packages3D, STEP)
3D model files: bst563a055v-etched.step / bst563a055v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bst563a055v.step / bst563a055v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: BORN datasheet (4 pp, sha256 8ed88b0d5deb3f0e, retrieved 2026-10-17, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF