component
STF40N60M2
Public Made by Adomby adom
STMicroelectronics MOSFETs, TO-220-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSTF40N60M2
STMicroelectronics · MOSFETs · TO-220-3
STF40N60M2 from STMicroelectronics, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-source voltage is limited to ±25 V (VGS). |
| 2 | D | passive | Drain terminal; drain-source voltage is rated 600 V and continuous drain current 34 A at TC = 25 °C. |
| 3 | S | passive | Source terminal; source-drain diode forward current is rated 34 A continuous (ISD). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-220-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 600 | V | 2 | |||
| Gate-source voltage | VGS | -25 | 25 | V | 2 | ||
| Drain current (continuous) | ID | 34 | A | TC = 25 °C | 2 | ||
| Drain current (continuous) | ID | 22 | A | TC = 100 °C | 2 | ||
| Drain current (pulsed) | IDM | 136 | A | 2 | |||
| Total power dissipation TO-220FP | PTOT | 40 | W | TC = 25 °C | 2 | ||
| Peak diode recovery voltage slope | dv/dt | 15 | V/ns | 2 | |||
| MOSFET dv/dt ruggedness | dv/dt | 50 | V/ns | VDD = 480 V | 2 | ||
| Insulation withstand voltage (RMS) TO-220FP | VISO | 2.5 | kV | t = 1 s; TC = 25 °C | 2 | ||
| Storage temperature range | Tstg | -55 | 150 | °C | 2 | ||
| Avalanche current, repetitive or not-repetitive | IAR | 6 | A | pulse width limited by TJ max. | 2 | ||
| Single pulse avalanche energy | EAS | 500 | mJ | starting TJ = 25 °C, ID = IAR, VDD = 50 V | 2 | ||
| Thermal resistance, junction-to-case TO-220FP | RthJC | 3.13 | °C/W | 2 | |||
| Thermal resistance, junction-to-ambient TO-220FP | RthJA | 62.5 | °C/W | 2 | |||
| Drain-source breakdown voltage | V(BR)DSS | 600 | V | ID = 1 mA, VGS = 0 V | 3 | ||
| Zero gate voltage drain current | IDSS | 1 | µA | VGS = 0 V, VDS = 600 V | 3 | ||
| Zero gate voltage drain current at TC = 125 °C | IDSS | 100 | µA | VGS = 0 V, VDS = 600 V, TC = 125 °C | 3 | ||
| Gate body leakage current | IGSS | -10 | 10 | µA | VDS = 0 V, VGS = ±25 V | 3 | |
| Gate threshold voltage | VGS(th) | 2 | 3 | 4 | V | VDS = VGS, ID = 250 µA | 3 |
| Static drain-source on-resistance | RDS(on) | 78 | 88 | Ω | VGS = 10 V, ID = 17 A | 3 | |
| Forward on voltage | VSD | 1.6 | V | ISD = 34 A, VGS = 0 V | 4 | ||
| Input capacitance | Ciss | 2500 | pF | VDS = 100 V, f = 1 MHz, VGS = 0 V | 3 | ||
| Output capacitance | Coss | 117 | pF | VDS = 100 V, f = 1 MHz, VGS = 0 V | 3 | ||
| Reverse transfer capacitance | Crss | 2.4 | pF | VDS = 100 V, f = 1 MHz, VGS = 0 V | 3 | ||
| Equivalent capacitance time related | Coss eq. | 342 | pF | VDS = 0 to 480 V, VGS = 0 V | 3 | ||
| Total gate charge | Qg | 57 | nC | VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V | 3 | ||
| Gate-source charge | Qgs | 10 | nC | VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V | 3 | ||
| Gate-drain charge | Qgd | 25.5 | nC | VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V | 3 | ||
| Intrinsic gate resistance | Rg | 4.4 | Ω | f = 1 MHz, ID = 0 A | 3 | ||
| Turn-on delay time | td(on) | 20.5 | ns | VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V | 3 | ||
| Rise time | tr | 13.5 | ns | VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V | 3 | ||
| Turn-off delay time | td(off) | 96 | ns | VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V | 3 | ||
| Fall time | tf | 11 | ns | VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V | 3 | ||
| Source-drain current | ISD | 34 | A | 4 | |||
| Source-drain current (pulsed) | ISDM | 136 | A | 4 | |||
| Reverse recovery time | trr | 440 | ns | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery charge | Qrr | 8.2 | µC | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery current | IRRM | 37 | A | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery time at TJ = 150 °C | trr | 568 | ns | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Reverse recovery charge at TJ = 150 °C | Qrr | 11.5 | µC | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Reverse recovery current at TJ = 150 °C | IRRM | 40.5 | A | ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | Abs | Updated title in cover page. Updated Table 2: Absolute maximum ratings, Table 5: On /off states, Table 6: Dynamic and | 13 |
CAD (KiCad official)
- Symbol:
STF40N60M2 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files:
stf40n60m2-etched.step/stf40n60m2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stf40n60m2.step/stf40n60m2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (15 pp, sha256
f8eb5d4cef832010, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).