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Contents

README

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STF40N60M2

STMicroelectronics · MOSFETs · TO-220-3

STF40N60M2 from STMicroelectronics, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; gate-source voltage is limited to ±25 V (VGS).
2 D passive Drain terminal; drain-source voltage is rated 600 V and continuous drain current 34 A at TC = 25 °C.
3 S passive Source terminal; source-drain diode forward current is rated 34 A continuous (ISD).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package TO-220-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 600 V 2
Gate-source voltage VGS -25 25 V 2
Drain current (continuous) ID 34 A TC = 25 °C 2
Drain current (continuous) ID 22 A TC = 100 °C 2
Drain current (pulsed) IDM 136 A 2
Total power dissipation TO-220FP PTOT 40 W TC = 25 °C 2
Peak diode recovery voltage slope dv/dt 15 V/ns 2
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDD = 480 V 2
Insulation withstand voltage (RMS) TO-220FP VISO 2.5 kV t = 1 s; TC = 25 °C 2
Storage temperature range Tstg -55 150 °C 2
Avalanche current, repetitive or not-repetitive IAR 6 A pulse width limited by TJ max. 2
Single pulse avalanche energy EAS 500 mJ starting TJ = 25 °C, ID = IAR, VDD = 50 V 2
Thermal resistance, junction-to-case TO-220FP RthJC 3.13 °C/W 2
Thermal resistance, junction-to-ambient TO-220FP RthJA 62.5 °C/W 2
Drain-source breakdown voltage V(BR)DSS 600 V ID = 1 mA, VGS = 0 V 3
Zero gate voltage drain current IDSS 1 µA VGS = 0 V, VDS = 600 V 3
Zero gate voltage drain current at TC = 125 °C IDSS 100 µA VGS = 0 V, VDS = 600 V, TC = 125 °C 3
Gate body leakage current IGSS -10 10 µA VDS = 0 V, VGS = ±25 V 3
Gate threshold voltage VGS(th) 2 3 4 V VDS = VGS, ID = 250 µA 3
Static drain-source on-resistance RDS(on) 78 88 Ω VGS = 10 V, ID = 17 A 3
Forward on voltage VSD 1.6 V ISD = 34 A, VGS = 0 V 4
Input capacitance Ciss 2500 pF VDS = 100 V, f = 1 MHz, VGS = 0 V 3
Output capacitance Coss 117 pF VDS = 100 V, f = 1 MHz, VGS = 0 V 3
Reverse transfer capacitance Crss 2.4 pF VDS = 100 V, f = 1 MHz, VGS = 0 V 3
Equivalent capacitance time related Coss eq. 342 pF VDS = 0 to 480 V, VGS = 0 V 3
Total gate charge Qg 57 nC VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V 3
Gate-source charge Qgs 10 nC VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V 3
Gate-drain charge Qgd 25.5 nC VDD = 480 V, ID = 4.5 A, VGS = 0 to 10 V 3
Intrinsic gate resistance Rg 4.4 Ω f = 1 MHz, ID = 0 A 3
Turn-on delay time td(on) 20.5 ns VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V 3
Rise time tr 13.5 ns VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V 3
Turn-off delay time td(off) 96 ns VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V 3
Fall time tf 11 ns VDD = 300 V, ID = 34 A, RG = 4.7 Ω, VGS = 10 V 3
Source-drain current ISD 34 A 4
Source-drain current (pulsed) ISDM 136 A 4
Reverse recovery time trr 440 ns ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V 4
Reverse recovery charge Qrr 8.2 µC ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V 4
Reverse recovery current IRRM 37 A ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V 4
Reverse recovery time at TJ = 150 °C trr 568 ns ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C 4
Reverse recovery charge at TJ = 150 °C Qrr 11.5 µC ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C 4
Reverse recovery current at TJ = 150 °C IRRM 40.5 A ISD = 34 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs Updated title in cover page. Updated Table 2: Absolute maximum ratings, Table 5: On /off states, Table 6: Dynamic and 13

CAD (KiCad official)

  • Symbol: STF40N60M2
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3 (KiCad packages3D, STEP)
  • 3D model files: stf40n60m2-etched.step / stf40n60m2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stf40n60m2.step / stf40n60m2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (15 pp, sha256 f8eb5d4cef832010, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF