LT3090IDD#PBF from Analog Devices, in a TDFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN	power_in	IN supplies power to the regulator and requires a bypass capacitor of 2.2µF to 4.7µF, with all IN pins tied together and to the exposed pad.
2	IN	power_in	IN supplies power to the regulator and must be tied together with all other IN pins and the exposed backside pad on the PCB.
3	ILIM	passive	ILIM programs the current limit through an external resistor to IN, its voltage must not be driven more than 0.3V below IN, and it should be tied to IN if unused.
4	IMONP	output	IMONP sources current equal to 1/2000 of output current through a resistor to GND for positive current monitoring, must be at least 2V below IMONN, and should be tied to IN if unused.
5	IMONN	output	IMONN sinks current equal to 1/1000 of output current through a resistor to GND for negative current monitoring, must be at least 2V above IN and IMONP, and should be tied to GND if unused.
6	SHDN	input	SHDN is a bidirectional shutdown pin with threshold references to GND, turning the output off within ±0.45V of GND and on beyond ±1.4V, and must not be floated.
7	SET	input	SET is the inverting error amplifier input where a precision 50µA current flows, a resistor to GND programs the output voltage, and it must not be driven more than 0.3V below IN.
8	GND	power_in	GND supplies the quiescent current and NPN pass transistor drive current and must not be driven more than 0.3V below IN during normal operation or a fault condition.
9	OUT	power_out	OUT supplies power to the load and requires a minimum 4.7µF output capacitor with ESR below 0.5Ω and a minimum 10µA load current to prevent oscillation.
10	OUT	power_out	OUT supplies power to the load and all OUT pins should be tied together for best performance.
11	IN	power_in	The exposed backside pad is an electrical and thermal connection to IN and the device substrate and must be soldered to the PCB.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	TDFN-10-EP(3x3)
Category	Power Management ICs
Pins	11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
IN Pin Voltage with Respect to GND	IN	-40		0.3	V	with respect to GND pin (Note 3 applies)	2
ILIM Pin Voltage with Respect to IN Pin	ILIM	-0.3		0.7	V	with respect to IN pin (Note 3)	2
IMONP Pin Voltage with Respect to IN Pin	IMONP	-0.3		40	V	with respect to IN pin (Note 3)	2
IMONP Pin Voltage with Respect to GND Pin	IMONP	-40		20	V	with respect to GND pin	2
IMONP Pin Voltage with Respect to IMONN Pin	IMONP	-40		20	V	with respect to IMONN pin	2
IMONN Pin Voltage with Respect to IN Pin	IMONN	-0.3		40	V	with respect to IN pin (Note 3)	2
IMONN Pin Voltage with Respect to GND Pin	IMONN	-40		20	V	with respect to GND pin	2
SHDN Pin Voltage with Respect to IN Pin	SHDN	-0.3		55	V	with respect to IN pin (Note 3)	2
SHDN Pin Voltage with Respect to GND Pin	SHDN	-40		20	V	with respect to GND pin	2
SET Pin Voltage with Respect to IN Pin	SET	-0.3		36	V	with respect to IN pin (Note 3)	2
SET Pin Voltage with Respect to GND Pin	SET	-36		36	V	with respect to GND pin (±36V)	2
SET Pin Current	ISET	-5		5	mA	Note 9	2
OUT Pin Voltage with Respect to IN Pin	OUT	-0.3		36	V	with respect to IN pin (Note 3)	2
OUT Pin Voltage with Respect to GND Pin	OUT	-36		36	V	with respect to GND pin (±36V)	2
Storage Temperature Range	TSTG	-65		150	°C		2
Operating Junction Temperature Range E-, I-Grade	TJ	-40		125	°C	E-, I-Grade	2
Maximum Junction Temperature	TJMAX			150	°C	DD package	2
Junction-to-Ambient Thermal Resistance	θJA		34		°C/W	DD package	2
Junction-to-Case Thermal Resistance	θJC		5.5		°C/W	DD package	2
SET Pin Current (full temperature range)	ISET	49	50	51	µA	VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5)	3
SET Pin Current (25°C)	ISET	49.5	50	50.5	µA	VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5)	3
Output Offset Voltage (full temperature range)	VOS	-2		2	mV	VOUT, VSET; VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5)	3
Output Offset Voltage (25°C)	VOS	-1		1	mV	VOUT, VSET; VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5)	3
Load Regulation: ΔVOS	ΔVOS		1.2	2.5	mV	ILOAD = 1mA to 600mA, VIN = -1.9V (Note 6)	3
Output Regulation with SET Pin Voltage Change: ΔISET/ΔVSET	ΔISET/ΔVSET		0.2	1	nA/V	VSET = 0V to -32V, VIN = -36V, ILOAD = 1mA	3
Output Regulation with SET Pin Voltage Change: ΔVOS/ΔVSET	ΔVOS/ΔVSET		2.5	30	µV/V	VSET = 0V to -32V, VIN = -36V, ILOAD = 1mA	3
GND Pin Current at ILOAD = 10µA	IGND		1	1.4	mA	VIN = VOUT(NOMINAL), ILOAD = 10µA (Note 8)	3
GND Pin Current at ILOAD = 1mA	IGND		1.05	1.4	mA	VIN = VOUT(NOMINAL), ILOAD = 1mA (Note 8)	3
GND Pin Current at ILOAD = 100mA	IGND		2.6	5	mA	VIN = VOUT(NOMINAL), ILOAD = 100mA (Note 8)	3
GND Pin Current at ILOAD = 600mA	IGND		11.5	22.5	mA	VIN = VOUT(NOMINAL), ILOAD = 600mA (Note 8)	3
Ripple Rejection	RR	70	85		dB	VIN, VOUT = -1.5V (Avg), VRIPPLE = 500mVP-P, fRIPPLE = 120Hz, ILOAD = 100mA, COUT = 4.7µF, CSET = 0.47µF	3
SHDN Pin Turn-ON Threshold (Positive SHDN Rising)	VSHDN	1.14	1.23	1.32	V	Positive SHDN Rising	3
SHDN Pin Turn-ON Threshold (Negative SHDN Rising, in Magnitude)	VSHDN	-1.36	-1.27	-1.18	V	Negative SHDN Rising (in Magnitude)	3
Quiescent Current in Shutdown (25°C)	IQ		0.1	1	µA	VIN = -6V, VSHDN = 0V	3
Quiescent Current in Shutdown (full temperature range)	IQ			10	µA	VIN = -6V, VSHDN = 0V	3
Programmable Current Limit Programming Scale Factor		460	500	540	A•kΩ	-36V < VIN < -1.9V, IOUT > 50mA (Note 14)	3
Max IOUT with RILIM = 20kΩ	IOUT	85	100	115	mA	VIN = -1.9V, RILIM = 20k	3
Positive Current Monitoring (IMONP) Scale Factor at IOUT = 600mA		280	300	320	mA/A	IOUT = 600mA, VIN = -2.5V, VIMONN = 2V, VIMONP = 0V	4
Positive Current Monitoring (IMONP) Current at IOUT = 100mA	IMONP	42.5	50	57.5	µA	IOUT = 100mA, VIN = -2.5V, VIMONN = 2V, VIMONP = 0V	4
Negative Current Monitoring (IMONN) Scale Factor at IOUT = 600mA		560	600	640	mA/A	IOUT = 600mA, VIN = -2.5V, VIMONN = 0V, VIMONP = -2.5V	4
Negative Current Monitoring (IMONN) Current at IOUT = 100mA	IMONN	85	100	115	µA	IOUT = 100mA, VIN = -2.5V, VIMONN = 0V, VIMONP = -2.5V	4

CAD (KiCad official)

Symbol: LT3090IDD#PBF
Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
3D model: TDFN-10-EP(3x3) (KiCad packages3D, STEP)
3D model files: lt3090idd-pbf-etched.step / lt3090idd-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3090idd-pbf.step / lt3090idd-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (36 pp, sha256 a02e3baeccf7ef6c, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

LT3090IDD#PBF

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3D Model

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