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LT3090IDD#PBF

Analog Devices · Linear Voltage Regulators (LDO) · TDFN-10-EP(3x3)

LT3090IDD#PBF from Analog Devices, in a TDFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in IN supplies power to the regulator and requires a bypass capacitor of 2.2µF to 4.7µF, with all IN pins tied together and to the exposed pad.
2 IN power_in IN supplies power to the regulator and must be tied together with all other IN pins and the exposed backside pad on the PCB.
3 ILIM passive ILIM programs the current limit through an external resistor to IN, its voltage must not be driven more than 0.3V below IN, and it should be tied to IN if unused.
4 IMONP output IMONP sources current equal to 1/2000 of output current through a resistor to GND for positive current monitoring, must be at least 2V below IMONN, and should be tied to IN if unused.
5 IMONN output IMONN sinks current equal to 1/1000 of output current through a resistor to GND for negative current monitoring, must be at least 2V above IN and IMONP, and should be tied to GND if unused.
6 SHDN input SHDN is a bidirectional shutdown pin with threshold references to GND, turning the output off within ±0.45V of GND and on beyond ±1.4V, and must not be floated.
7 SET input SET is the inverting error amplifier input where a precision 50µA current flows, a resistor to GND programs the output voltage, and it must not be driven more than 0.3V below IN.
8 GND power_in GND supplies the quiescent current and NPN pass transistor drive current and must not be driven more than 0.3V below IN during normal operation or a fault condition.
9 OUT power_out OUT supplies power to the load and requires a minimum 4.7µF output capacitor with ESR below 0.5Ω and a minimum 10µA load current to prevent oscillation.
10 OUT power_out OUT supplies power to the load and all OUT pins should be tied together for best performance.
11 IN power_in The exposed backside pad is an electrical and thermal connection to IN and the device substrate and must be soldered to the PCB.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package TDFN-10-EP(3x3)
Category Power Management ICs
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
IN Pin Voltage with Respect to GND IN -40 0.3 V with respect to GND pin (Note 3 applies) 2
ILIM Pin Voltage with Respect to IN Pin ILIM -0.3 0.7 V with respect to IN pin (Note 3) 2
IMONP Pin Voltage with Respect to IN Pin IMONP -0.3 40 V with respect to IN pin (Note 3) 2
IMONP Pin Voltage with Respect to GND Pin IMONP -40 20 V with respect to GND pin 2
IMONP Pin Voltage with Respect to IMONN Pin IMONP -40 20 V with respect to IMONN pin 2
IMONN Pin Voltage with Respect to IN Pin IMONN -0.3 40 V with respect to IN pin (Note 3) 2
IMONN Pin Voltage with Respect to GND Pin IMONN -40 20 V with respect to GND pin 2
SHDN Pin Voltage with Respect to IN Pin SHDN -0.3 55 V with respect to IN pin (Note 3) 2
SHDN Pin Voltage with Respect to GND Pin SHDN -40 20 V with respect to GND pin 2
SET Pin Voltage with Respect to IN Pin SET -0.3 36 V with respect to IN pin (Note 3) 2
SET Pin Voltage with Respect to GND Pin SET -36 36 V with respect to GND pin (±36V) 2
SET Pin Current ISET -5 5 mA Note 9 2
OUT Pin Voltage with Respect to IN Pin OUT -0.3 36 V with respect to IN pin (Note 3) 2
OUT Pin Voltage with Respect to GND Pin OUT -36 36 V with respect to GND pin (±36V) 2
Storage Temperature Range TSTG -65 150 °C 2
Operating Junction Temperature Range E-, I-Grade TJ -40 125 °C E-, I-Grade 2
Maximum Junction Temperature TJMAX 150 °C DD package 2
Junction-to-Ambient Thermal Resistance θJA 34 °C/W DD package 2
Junction-to-Case Thermal Resistance θJC 5.5 °C/W DD package 2
SET Pin Current (full temperature range) ISET 49 50 51 µA VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5) 3
SET Pin Current (25°C) ISET 49.5 50 50.5 µA VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5) 3
Output Offset Voltage (full temperature range) VOS -2 2 mV VOUT, VSET; VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5) 3
Output Offset Voltage (25°C) VOS -1 1 mV VOUT, VSET; VIN = -1.9V, ILOAD = 1mA, -36V < VIN < -1.9V, 1mA < ILOAD < 600mA (Note 5) 3
Load Regulation: ΔVOS ΔVOS 1.2 2.5 mV ILOAD = 1mA to 600mA, VIN = -1.9V (Note 6) 3
Output Regulation with SET Pin Voltage Change: ΔISET/ΔVSET ΔISET/ΔVSET 0.2 1 nA/V VSET = 0V to -32V, VIN = -36V, ILOAD = 1mA 3
Output Regulation with SET Pin Voltage Change: ΔVOS/ΔVSET ΔVOS/ΔVSET 2.5 30 µV/V VSET = 0V to -32V, VIN = -36V, ILOAD = 1mA 3
GND Pin Current at ILOAD = 10µA IGND 1 1.4 mA VIN = VOUT(NOMINAL), ILOAD = 10µA (Note 8) 3
GND Pin Current at ILOAD = 1mA IGND 1.05 1.4 mA VIN = VOUT(NOMINAL), ILOAD = 1mA (Note 8) 3
GND Pin Current at ILOAD = 100mA IGND 2.6 5 mA VIN = VOUT(NOMINAL), ILOAD = 100mA (Note 8) 3
GND Pin Current at ILOAD = 600mA IGND 11.5 22.5 mA VIN = VOUT(NOMINAL), ILOAD = 600mA (Note 8) 3
Ripple Rejection RR 70 85 dB VIN, VOUT = -1.5V (Avg), VRIPPLE = 500mVP-P, fRIPPLE = 120Hz, ILOAD = 100mA, COUT = 4.7µF, CSET = 0.47µF 3
SHDN Pin Turn-ON Threshold (Positive SHDN Rising) VSHDN 1.14 1.23 1.32 V Positive SHDN Rising 3
SHDN Pin Turn-ON Threshold (Negative SHDN Rising, in Magnitude) VSHDN -1.36 -1.27 -1.18 V Negative SHDN Rising (in Magnitude) 3
Quiescent Current in Shutdown (25°C) IQ 0.1 1 µA VIN = -6V, VSHDN = 0V 3
Quiescent Current in Shutdown (full temperature range) IQ 10 µA VIN = -6V, VSHDN = 0V 3
Programmable Current Limit Programming Scale Factor 460 500 540 A•kΩ -36V < VIN < -1.9V, IOUT > 50mA (Note 14) 3
Max IOUT with RILIM = 20kΩ IOUT 85 100 115 mA VIN = -1.9V, RILIM = 20k 3
Positive Current Monitoring (IMONP) Scale Factor at IOUT = 600mA 280 300 320 mA/A IOUT = 600mA, VIN = -2.5V, VIMONN = 2V, VIMONP = 0V 4
Positive Current Monitoring (IMONP) Current at IOUT = 100mA IMONP 42.5 50 57.5 µA IOUT = 100mA, VIN = -2.5V, VIMONN = 2V, VIMONP = 0V 4
Negative Current Monitoring (IMONN) Scale Factor at IOUT = 600mA 560 600 640 mA/A IOUT = 600mA, VIN = -2.5V, VIMONN = 0V, VIMONP = -2.5V 4
Negative Current Monitoring (IMONN) Current at IOUT = 100mA IMONN 85 100 115 µA IOUT = 100mA, VIN = -2.5V, VIMONN = 0V, VIMONP = -2.5V 4

CAD (KiCad official)

  • Symbol: LT3090IDD#PBF
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: TDFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: lt3090idd-pbf-etched.step / lt3090idd-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3090idd-pbf.step / lt3090idd-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (36 pp, sha256 a02e3baeccf7ef6c, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF