component
MSESD10EMC24
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMSESD10EMC24
MSKSEMI · ESD Protection Devices · DFN1006-2
MSESD10EMC24 from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD per IEC 61000-4-2 (Contact) | VESD | -8 | 8 | kV | ESD per IEC 61000-4-2 (Contact) | 3 | |
| ESD per IEC 61000-4-2 (Air) | VESD | -15 | 15 | kV | ESD per IEC 61000-4-2 (Air) | 3 | |
| Peak Pulse Power (8/20μs) | PPP | 150 | W | 8/20μs | 3 | ||
| Operating Temperature | TOPT | -55 | 125 | ℃ | 3 | ||
| Storage Temperature | TSTG | -55 | 150 | ℃ | 3 | ||
| Lead Soldering Temperature | TL | 260 | ℃ | 10 sec. | 3 | ||
| Reverse Breakdown Voltage | VBR | 26 | 32 | V | IT = 1mA | 3 | |
| Reverse Leakage Current | IR | 1 | μA | VRWM = 24V | 3 | ||
| Clamping Voltage 1 | VC1 | 40 | V | IPP = 1A, tp = 8/20μs | 3 | ||
| Clamping Voltage 2 | VC2 | 50 | V | IPP = 3A, tp = 8/20μs | 3 | ||
| Junction Capacitance | CJ | 8 | 15 | pF | VR = 0V, f = 1MHz | 3 |
CAD (KiCad official)
- Symbol:
MSESD10EMC24 - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
msesd10emc24-etched.step/msesd10emc24-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);msesd10emc24.step/msesd10emc24.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
491c1dc589acd397, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).