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MSESD10EMC24

Public Made by Adom

by adom

MSKSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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msesd10emc24-etched.step msesd10emc24: factory component page (tier=lcsc) · Ray 19d ago
msesd10emc24-hero.glb msesd10emc24: hero GLB from the etched model (keeps the MPN mark) · Ray 19d ago
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msesd10emc24.kicad_sym msesd10emc24: KiCad Device:Fuse symbol instead of a box (two-terminal passive) · Ray 12d ago
msesd10emc24.lbr msesd10emc24: KiCad Device:Fuse symbol instead of a box (two-terminal passive) · Ray 12d ago
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MSESD10EMC24

MSKSEMI · ESD Protection Devices · DFN1006-2

MSESD10EMC24 from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package DFN1006-2
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ESD per IEC 61000-4-2 (Contact) VESD -8 8 kV ESD per IEC 61000-4-2 (Contact) 3
ESD per IEC 61000-4-2 (Air) VESD -15 15 kV ESD per IEC 61000-4-2 (Air) 3
Peak Pulse Power (8/20μs) PPP 150 W 8/20μs 3
Operating Temperature TOPT -55 125 ℃ 3
Storage Temperature TSTG -55 150 ℃ 3
Lead Soldering Temperature TL 260 ℃ 10 sec. 3
Reverse Breakdown Voltage VBR 26 32 V IT = 1mA 3
Reverse Leakage Current IR 1 μA VRWM = 24V 3
Clamping Voltage 1 VC1 40 V IPP = 1A, tp = 8/20μs 3
Clamping Voltage 2 VC2 50 V IPP = 3A, tp = 8/20μs 3
Junction Capacitance CJ 8 15 pF VR = 0V, f = 1MHz 3

CAD (KiCad official)

  • Symbol: MSESD10EMC24
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2 (KiCad packages3D, STEP)
  • 3D model files: msesd10emc24-etched.step / msesd10emc24-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); msesd10emc24.step / msesd10emc24.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 491c1dc589acd397, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF