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Contents

README

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EGA10603V24A0

INPAQ · ESD And Surge Protection (TVS/ESD) · 0603

EGA10603V24A0 from INPAQ, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive One terminal of the bidirectional ESD suppressor (interchangeable with the other terminal), rated 24V max with 30V typical clamping and 0.25pF typical capacitance.
2 B passive Second terminal of the bidirectional ESD suppressor (interchangeable with the other terminal), protecting the line to IEC 61000-4-2 8kV contact and 15kV air discharge.

Key specifications

Parameter Value
Manufacturer INPAQ
Package 0603
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Rated voltage (max) 24 V 5
Operating Temperature range -40 85 ℃ 4
Storage Temperature range (on board) -40 85 ℃ on board 4
Capacitance (Cp) Cp 0.25 0.5 pF @1MHz, device capacitance measured with 1Vrms 5
Leakage current 0.01 μA @12VDC 5
Trigger voltage (Vt) Vt 300 V measured by Transmission Line Pulse (TLP) 5
Clamping voltage (Vc) Vc 30 V measured by Transmission Line Pulse (TLP) 5
Response time 1 ns printed as <1ns 5
ESD pulse withstand times 1000 times 5
Leakage current IL after bias humidity test IL 10 µA 85%RH, 85 ℃, rated voltage 12VDC, 1000 hrs (MIL-STD-202 Method 103) 4
Leakage current IL after thermal shock cycle IL 10 µA -40 to 85 ℃, 30 min, 5 cycles (JIS C 0025) 4
Leakage current IL after high temperature load voltage test IL 10 µA Rated voltage, 85 ℃, 1000 hrs (MIL-STD-202G Method 108) 4
Leakage current IL after solder leach resistance test IL 10 µA 260 ℃, 10s (MIL-STD-202G Method 210F) 4
Leakage current IL after vibration test IL 10 µA 10~55Hz, 1.5mm amplitude, 2 hours each X, Y, Z (MIL-STD-202G Method 201A) 4
Taping storage temperature 5 40 ℃ taping package storage condition 10
Taping storage relative humidity 65 %RH taping package storage condition 10
Taping storage time 12 months taping package storage condition 10
Soldering gun tip temperature 280 ℃ within 3 s, soldering gun under 30 W 9
Heat shock during soldering 100 ℃ heat shock during soldering process 8
Reflow peak temperature (Tp) Tp 260 ℃ Pb-free reflow; printed tolerance +0/-5 ℃ 9
Reflow average ramp rate (Ts max to Tp) 3 ℃/second Pb-free reflow, IPC-020c-5-1 reference 9
Reflow time maintained above TL tL 60 150 seconds TL = 217 ℃, Pb-free reflow 9
Reflow time within 5 ℃ of actual peak temperature 20 40 seconds Pb-free reflow 9
Reflow ramp-down rate 6 ℃/second Pb-free reflow 9
Reflow time 25 ℃ to peak temperature 8 minutes Pb-free reflow 9
Solder cream print thickness 0.15 0.2 mm reflow solder cream printing mask 8

CAD (KiCad official)

  • Symbol: EGA10603V24A0
  • Footprint: Diode_SMD:D_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: ega10603v24a0-etched.step / ega10603v24a0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ega10603v24a0.step / ega10603v24a0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: INPAQ datasheet (10 pp, sha256 126750fcfe335d68, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF