component
PMEG10030ELP-QX
Public Made by Adomby adom
Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG10030ELP-QX
Nexperia · Schottky Diodes · SOD-128
PMEG10030ELP-QX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky barrier rectifier; the marking bar on the package indicates the cathode. |
| 2 | A | passive | Anode of the Schottky barrier rectifier; the datasheet gives no additional pin-specific limits. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 100 | V | Tj = 25 °C | 2 | ||
| Forward current | IF | 4.2 | A | δ = 1; Tsp = 155 °C | 2 | ||
| Average forward current | IF(AV) | 3 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 55 °C | 2 | ||
| Non-repetitive peak forward current | IFSM | 70 | A | tp = 8.3 ms; half-sine wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 750 | mW | Tamb ≤ 25 °C; device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint [2] | 2 | ||
| Total power dissipation | Ptot | 1250 | mW | Tamb ≤ 25 °C; device mounted on FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [3] | 2 | ||
| Total power dissipation | Ptot | 2500 | mW | Tamb ≤ 25 °C; device mounted on ceramic PCB, Al2O3, standard footprint [1] | 2 | ||
| Junction temperature | Tj | 175 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 175 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 175 | °C | 2 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 200 | K/W | FR4 PCB, single-sided copper, tin-plated, standard footprint [2] | 3 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 120 | K/W | FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [3] | 3 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 60 | K/W | Ceramic PCB, Al2O3, standard footprint [4] | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 12 | K/W | Soldering point of cathode tab [5] | 3 | ||
| Reverse breakdown voltage | V(BR)R | 100 | V | IR = 1 mA; tp = 300 µs; δ = 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | VF | 455 | 510 | mV | IF = 0.1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 535 | 605 | mV | IF = 0.5 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 565 | 640 | mV | IF = 0.7 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 600 | 670 | mV | IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 645 | 720 | mV | IF = 1.6 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 670 | 740 | mV | IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 710 | 770 | mV | IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Forward voltage | VF | 575 | 680 | mV | IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 125 °C | 4 | |
| Reverse current | IR | 110 | 450 | nA | VR = 100 V; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | |
| Reverse current | IR | 220 | 1500 | µA | VR = 100 V; tp ≤ 300 µs; δ ≤ 0.02; Tj = 125 °C | 4 |
CAD (KiCad official)
- Symbol:
PMEG10030ELP-QX - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg10030elp-qx-etched.step/pmeg10030elp-qx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg10030elp-qx.step/pmeg10030elp-qx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (13 pp, sha256
ae0482e542fdd5a1, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).