component
BZG03-C91
Public Made by Adomby adom
EIC Semicon Zener Diodes, DO-214AC(SMA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBZG03-C91
EIC Semicon · Zener Diodes · DO-214AC(SMA)
BZG03-C91 from EIC Semicon, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EIC Semicon |
| Package | DO-214AC(SMA) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working voltage | VZ | 85 | 91 | 96 | V | at IZ = 5 mA | 2 |
| Differential resistance | rdiff | 60 | 200 | Ω | at IZ | 2 | |
| Temperature coefficient | SZ | 0.09 | 0.13 | %/K | at IZ | 2 | |
| Maximum reverse leakage current | IR | 1 | mA | @ VR = 68 V | 2 | ||
| Power dissipation | Ptot | 3 | W | Ttp = 100 °C, see Fig. 1 | 1 | ||
| Power dissipation | Ptot | 1.25 | W | Ta = 50 °C, see Fig. 1; device mounted on Al2O3 PCB (Fig. 4) | 1 | ||
| Non-repetitive peak reverse power dissipation | PZSM | 600 | W | tp = 100 µs; square pulse; Tj = 25 °C prior to surge; see Fig. 2 | 1 | ||
| Forward voltage | VF | 1.2 | V | IF = 0.5 A; Tj = 25 °C; see Fig. 3 | 1 | ||
| Junction temperature range | Tj | -65 | 175 | °C | 1 | ||
| Storage temperature range | Tstg | -65 | 175 | °C | 1 | ||
| Thermal resistance junction to tie-point | Rth j-tp | 25 | K/W | 1 | |||
| Thermal resistance junction to ambient | Rth j-a | 100 | K/W | Note 1: device mounted on Al2O3 PCB, 0.7 mm thick, Cu layer >= 35 µm, see Fig. 4 | 1 |
CAD (KiCad official)
- Symbol:
BZG03-C91 - Footprint:
Diode_SMD:D_SMA - 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
- 3D model files:
bzg03-c91-etched.step/bzg03-c91-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzg03-c91.step/bzg03-c91.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: EIC Semicon datasheet (3 pp, sha256
8e02eb1c76b5f781, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).