component

BZG03-C91

Public Made by Adom

by adom

EIC Semicon Zener Diodes, DO-214AC(SMA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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BZG03-C91

EIC Semicon · Zener Diodes · DO-214AC(SMA)

BZG03-C91 from EIC Semicon, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer EIC Semicon
Package DO-214AC(SMA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ 85 91 96 V at IZ = 5 mA 2
Differential resistance rdiff 60 200 Ω at IZ 2
Temperature coefficient SZ 0.09 0.13 %/K at IZ 2
Maximum reverse leakage current IR 1 mA @ VR = 68 V 2
Power dissipation Ptot 3 W Ttp = 100 °C, see Fig. 1 1
Power dissipation Ptot 1.25 W Ta = 50 °C, see Fig. 1; device mounted on Al2O3 PCB (Fig. 4) 1
Non-repetitive peak reverse power dissipation PZSM 600 W tp = 100 µs; square pulse; Tj = 25 °C prior to surge; see Fig. 2 1
Forward voltage VF 1.2 V IF = 0.5 A; Tj = 25 °C; see Fig. 3 1
Junction temperature range Tj -65 175 °C 1
Storage temperature range Tstg -65 175 °C 1
Thermal resistance junction to tie-point Rth j-tp 25 K/W 1
Thermal resistance junction to ambient Rth j-a 100 K/W Note 1: device mounted on Al2O3 PCB, 0.7 mm thick, Cu layer >= 35 µm, see Fig. 4 1

CAD (KiCad official)

  • Symbol: BZG03-C91
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
  • 3D model files: bzg03-c91-etched.step / bzg03-c91-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzg03-c91.step / bzg03-c91.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: EIC Semicon datasheet (3 pp, sha256 8e02eb1c76b5f781, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF