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Contents

README

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HDESD12VL2BTQ-7

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SOT-23

HDESD12VL2BTQ-7 from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Diode terminal 1 in the circuit diagram, connected through one TVS diode to common pin 3; the datasheet gives no signal name for it.
2 2 passive Diode terminal 2 in the circuit diagram, connected through the second TVS diode to common pin 3; the datasheet gives no signal name for it.
3 3 passive Common node in the circuit diagram, joining the two TVS diodes; the datasheet gives no signal name for it.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power (tp = 8/20 µs) PPP 400 W tp = 8/20µs, Tamb = 25°C 1
Maximum lead temperature for soldering TL 260 °C during 10 s 1
Storage temperature range Tstg -55 150 °C 1
Operating temperature range Top -55 125 °C 1
Maximum junction temperature Tj 150 °C 1
ESD immunity, air discharge -30 30 kV IEC61000-4-2 air discharge 1
ESD immunity, contact discharge -30 30 kV IEC61000-4-2 contact discharge 1
EFT current 15 A IEC61000-4-4 (EFT) 1
Reverse stand-off voltage VRWM 12 V Device table row for HDESD12VL2BTQ-7 2
Reverse leakage current at VRWM IR 0.5 A @ VRWM, Max column 2
Clamping voltage at maximum IPP VC 27 V @ MAX IPP (Note 2) 2
Peak pulse current IPP 18 A Surge current waveform per Figure 1 (Note 2) 2
Peak pulse power (table) PPK 400 W Surge current waveform per Figure 1 (Note 2) 2

CAD (KiCad official)

  • Symbol: HDESD12VL2BTQ-7
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: hdesd12vl2btq-7-etched.step / hdesd12vl2btq-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hdesd12vl2btq-7.step / hdesd12vl2btq-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 e399ce44197e4f39, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF