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Contents

Pinout
Key specifications
Electrical characteristics
CAD (KiCad official)
Provenance

README

markdown

ESP32-H2FH2

Espressif Systems · RF and Wireless · 32-VFQFN Exposed Pad

ESP32-H2FH2 from Espressif Systems, in a 32-VFQFN Exposed Pad. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD3P3	power_in	Analog power domain supply input; the voltage limits are given in Section 5 of the datasheet and are not in the extracted text.
2	VDD3P3	power_in	Analog power domain supply input; the voltage limits are given in Section 5 of the datasheet and are not in the extracted text.
3	GPIO0	bidirectional	General-purpose I/O powered from VDDPST1, with SPI2 FSPIQ data signal available via IO MUX function F3.
4	GPIO1	bidirectional	General-purpose I/O powered from VDDPST1, with ADC1_CH0 analog input and SPI2 FSPICS0 available via IO MUX.
5	MTMS	bidirectional	JTAG test mode select on IO MUX function F0, with input enabled at reset; alternatively GPIO2 or ADC1_CH1.
6	MTDO	bidirectional	JTAG test data out on IO MUX function F0, with input enabled at reset; alternatively GPIO3 or ADC1_CH2.
7	MTCK	bidirectional	JTAG test clock on IO MUX function F0, with weak pull-up enabled at reset depending on EFUSE_DIS_PAD_JTAG; alternatively GPIO4 or ADC1_CH3.
8	MTDI	bidirectional	JTAG test data in on IO MUX function F0, with input enabled at reset; alternatively GPIO5 or ADC1_CH4.
9	VDDPST1	power_in	IO power domain supply input for the digital IO and LP IO pins.
10	GPIO8	bidirectional	LP GPIO powered from VDDPST1 with input enabled at reset.
11	GPIO9	bidirectional	LP GPIO powered from VDDPST1 with input enabled and internal weak pull-up enabled at reset.
12	GPIO10	bidirectional	LP GPIO powered from VDDPST1, also usable as analog pad voltage comparator input ZCD0.
13	GPIO11	bidirectional	LP GPIO powered from VDDPST1, also usable as analog pad voltage comparator input ZCD1.
14	GPIO12	bidirectional	LP GPIO powered from VDDA_PMU/VBAT.
15	XTAL_32K_P	bidirectional	Positive 32 kHz clock signal connected to the chip's oscillator or crystal, powered from VDDA_PMU/VBAT.
16	XTAL_32K_N	bidirectional	Negative 32 kHz clock signal for 32 kHz external clock input/output, powered from VDDA_PMU/VBAT.
17	CHIP_EN	input	Chip enable: high enables the chip (powered up) and low disables it (powered down); do not leave this pin floating.
18	VBAT	power_in	Analog power domain or battery power supply input.
19	VDDA_PMU	power_in	Analog power domain supply input for GPIO12 and the 32 kHz crystal pins.
20	VDDPST2	power_in	IO power domain supply input for the digital IO pins.
21	GPIO22	bidirectional	Digital GPIO powered from VDDPST2.
22	U0RXD	bidirectional	UART0 receive data on IO MUX function F0, with input enabled and weak pull-up enabled at reset; alternatively GPIO23.
23	U0TXD	bidirectional	UART0 transmit data on IO MUX function F0, with input enabled and weak pull-up enabled at reset; alternatively GPIO24.
24	GPIO25	bidirectional	Digital GPIO powered from VDDPST2 with input enabled at reset and after reset.
25	GPIO26	bidirectional	Digital GPIO powered from VDDPST2 with input enabled; USB_D- by default, with default drive strength of 40 mA.
26	GPIO27	bidirectional	Digital GPIO powered from VDDPST2; USB_D+ by default with USB pull-up enabled, and default drive strength of 40 mA.
27	VDD3P3	power_in	Analog power domain supply input; the voltage limits are given in Section 5 of the datasheet and are not in the extracted text.
28	XTAL_N	passive	External clock input/output connected to the chip's crystal or oscillator.
29	XTAL_P	passive	Positive side of the differential external clock connected to the chip's crystal or oscillator.
30	VDD3P3	power_in	Analog power domain supply input; the voltage limits are given in Section 5 of the datasheet and are not in the extracted text.
31	VDD3P3	power_in	Analog power domain supply input; the voltage limits are given in Section 5 of the datasheet and are not in the extracted text.
32	ANT	bidirectional	RF LNA input/output signals for the antenna connection.
33	GND	power_in	External ground connection, which is the exposed pad of the QFN32 package.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	32-VFQFN Exposed Pad
Category	RF and Wireless
Pins	33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Recommended input voltage		3	3.3	3.6	V	VDD3P3, VBAT, VDDA_PMU, VDDPST1, VDDPST2	53
Cumulative input current	IVDD	0.35			A		53
Ambient temperature	TA	-40		105	°C		53
Allowed input voltage		-0.3		3.6	V	Input power pins	53
Cumulative IO output current	Ioutput			1.3	A		53
Storage temperature	TSTORE	-40		150	°C		53
High-level input current	IIH			50	nA		53
Low-level input current	IIL			50	nA		53
ADC differential nonlinearity	DNL	-8		12	LSB		54
ADC integral nonlinearity	INL	-10		10	LSB		54
ADC sampling rate				100	kSPS		54
ADC total error		-7		7	mV	ATTEN0, effective measurement range of 0 ~ 1000	54
ADC total error		-8		8	mV	ATTEN1, effective measurement range of 0 ~ 1300	54
ADC total error		-12		12	mV	ATTEN2, effective measurement range of 0 ~ 1900	54
ADC total error		-23		23	mV	ATTEN3, effective measurement range of 0 ~ 3300	54
Bluetooth LE RF transmit power range		-24		20	dBm		58
Bluetooth LE sensitivity 1 Mbps				-99	dBm	@30.8% PER	60
Bluetooth LE maximum received signal 1 Mbps				8	dBm	@30.8% PER	60
Bluetooth LE sensitivity 2 Mbps				-96	dBm	@30.8% PER	60
Bluetooth LE sensitivity 125 Kbps				-106.5	dBm	@30.8% PER	61
Bluetooth LE sensitivity 500 Kbps				-102.5	dBm	@30.8% PER	61
802.15.4 RF transmit power range		-24		20	dBm		62
802.15.4 sensitivity 250 Kbps				-102.5	dBm	@1% PER	62
802.15.4 maximum received signal 250 Kbps				8	dBm	@1% PER	62
Pin capacitance	CIN		2		pF		53
High-level source current	IOH		40		mA	VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3	54
Low-level sink current	IOL		28		mA	VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3	54
Internal weak pull-up resistor	RPU		45		kΩ		54
Internal weak pull-down resistor	RPD		45		kΩ		54
Bluetooth LE TX peak current			140		mA	Bluetooth LE @ 20.0 dBm	55
Bluetooth LE RX peak current			24		mA	Bluetooth LE	55
Light-sleep current			85		µA	CPU and wireless communication modules powered down, peripheral clocks disabled, all GPIOs high-impedance	56
Deep-sleep current			7		µA	RTC timer and LP memory powered on	56
Power off current			1		µA	CHIP_EN set to low level, chip powered off	56

CAD (KiCad official)

Symbol: ESP32-H2FH2
Footprint: PCM_Espressif:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
3D model: 32-VFQFN Exposed Pad (KiCad packages3D, STEP)
3D model files: esp32-h2fh2-etched.step / esp32-h2fh2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2fh2.step / esp32-h2fh2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (69 pp, sha256 2cb42839833eac06, retrieved 2026-10-27, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF