component
BSP48505S
Public Made by Adomby adom
BORN RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBSP48505S
BORN · RS-485 / RS-422 ICs · SOIC-8
BSP48505S from BORN, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver data output: goes high when VID is above VTH+ and low when VID is below VTH-, and is held high (fail-safe) on an open, shorted or idle bus. |
| 2 | REB | input | Receiver enable, active low with an internal pull-up; driving it high (or leaving it open) puts RO in high-impedance and disables the receiver. |
| 3 | DE | input | Driver enable, active high with an internal pull-down; when DE is low or open the driver is disabled and A and B are high-impedance. |
| 4 | DI | input | Driver data input with an internal pull-up to VCC; when the driver is enabled and DI is open, output A is high and B is low. |
| 5 | GND | power_in | Ground reference for all device voltages (VCC, bus, and logic pins are referenced to GND). |
| 6 | A | bidirectional | Bus driver output / receiver input line A, rated for bus voltage -7 V to 12 V with ±20 kV HBM ESD protection to GND. |
| 7 | B | bidirectional | Bus driver output / receiver input line B, rated for bus voltage -7 V to 12 V with ±20 kV HBM ESD protection to GND. |
| 8 | VCC | power_in | Supply voltage referenced to GND, recommended 3.0 V to 5.5 V; place a 100 nF to 220 nF decoupling capacitor as close to this pin as possible. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC supply voltage | VCC | -0.5 | 7 | V | 3 | ||
| Bus voltage A, B | VIO | -8 | 13 | V | 3 | ||
| Bus voltage difference between A and B | VIO_DIF | -8 | 13 | V | 3 | ||
| Logic input voltage DI, DE, REB | VIO | -0.3 | V | 3 | |||
| Logic output voltage RO | VIO | -0.3 | V | 3 | |||
| Junction temperature | TJ | 150 | °C | 3 | |||
| Storage temperature | TSTG | -65 | 150 | °C | 3 | ||
| ESD HBM, bus A, B to GND | VESD | -20 | 20 | kV | HBM per ANSI/ESDA/JEDEC JS-001, bus A, B to GND | 3 | |
| ESD HBM, other pins | VESD | -8 | 8 | kV | HBM per ANSI/ESDA/JEDEC JS-001, other pins | 3 | |
| ESD CDM, other pins | VESD | -2 | 2 | kV | CDM per JEDEC JESD22-C101, all pins; other pins | 3 | |
| ESD IEC 61000-4-2 contact discharge, bus A, B to GND | VESD | -4 | 4 | kV | IEC 61000-4-2 contact discharge, bus A, B to GND | 3 | |
| EFT IEC 61000-4-4, bus A, B to GND | VEFT | -4 | 4 | kV | IEC 61000-4-4, bus A, B to GND | 3 | |
| Supply voltage referenced to GND | VCC | 3 | 5 | 5.5 | V | 3 | |
| Bus input voltage | VIN | -7 | 12 | V | 3 | ||
| High-level input threshold | VIH | 2 | V | 3 | |||
| Low-level input threshold | VIL | 0 | 0.8 | V | 3 | ||
| Differential load resistance | RL | 54 | Ω | 3 | |||
| Data rate | 1/tUI | 0.5 | Mbps | BSP48505x | 3 | ||
| Operating ambient temperature | TA | -40 | 125 | °C | 3 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 3 | ||
| Differential output voltage | /VOD/ | 1.5 | 3.2 | V | RL = 60Ω, -7V≤Vtest≤12V, Fig 18 | 4 | |
| Differential output voltage | /VOD/ | 2.1 | 3.2 | V | RL = 60Ω, -7V≤Vtest≤12V, 4.5V≤VCC≤5.5V, Fig 18 | 4 | |
| Differential output voltage | /VOD/ | 1.8 | 3.6 | V | RL = 100Ω, CL = 50pF, Fig 19 | 4 | |
| Differential output voltage change | /ΔVOD/ | -50 | 50 | mV | RL = 54Ω or 100Ω, CL = 50pF, Fig 19 | 4 | |
| Common-mode output voltage | VOC | 1 | 3.3 | V | RL = 54Ω or 100Ω, CL = 50pF, Fig 19 | 4 | |
| Steady-state common-mode output voltage change | ΔVOC(SS) | -50 | 50 | mV | 4 | ||
| Driver short-circuit output current | /IOS/ | 90 | 150 | mA | DE = VCC, -7V≤VO≤12V or A and B shorted | 4 | |
| Bus input current | II | 70 | 600 | uA | DE=0, VCC=0V, VI=12V or 5.0V | 4 | |
| Bus input current | II | -100 | -40 | uA | DE=0, VCC=0V, VI=-7V | 4 | |
| Bus input impedance | RI | 24 | kΩ | VA = -7V, VB = 12V or VA = 12V, VB = -7V | 4 | ||
| Positive input threshold voltage | VTH+ | -110 | -50 | mV | 4 | ||
| Negative input threshold voltage | VTH− | -200 | -140 | mV | 4 | ||
| Input hysteresis voltage | VHYS | 30 | mV | 4 | |||
| Output low voltage | VOL | 0.2 | 0.4 | V | IOH=4mA (as printed) | 4 | |
| High-impedance output current | IOZR | -1 | 1 | uA | REB=VCC, VO=0V or VCC | 4 | |
| Receiver short-circuit output current | IOSR | 95 | mA | REB=DE=0V, Fig 20 | 4 | ||
| Input current (DI, DE, REB) | IIN | -5 | 5 | uA | 0V≤VIN≤VCC | 4 | |
| Quiescent supply current, driver and receiver enabled | ICC | 0.95 | 1.5 | mA | REB=0V, DE=VCC, no load | 4 | |
| Quiescent supply current, driver enabled, receiver disabled | ICC | 0.55 | 1 | mA | REB=VCC, DE=VCC, no load | 4 | |
| Quiescent supply current, driver disabled, receiver enabled | ICC | 0.7 | 1.1 | mA | REB=0V, DE=0V, no load | 4 | |
| Quiescent supply current, driver and receiver disabled | ICC | 5 | uA | REB=VCC, DE=0V, no load | 4 | ||
| Thermal shutdown temperature | TSD | 200 | °C | 4 | |||
| Thermal shutdown hysteresis | TSD | 25 | °C | 4 | |||
| Driver differential output rise/fall time | tf, tr | 5 | 12 | RL=54Ω, CL=50pF, Fig 21 | 5 | ||
| Driver propagation delay | tPHL, tPLH | 5 | 12 | ns | 5 | ||
| Driver pulse skew | tSK(P) | 3.5 | /tPHL − tPLH/ | 5 | |||
| Driver disable time | tPHZ, tPLZ | 10 | 30 | ns | Fig 22, Fig 23 | 5 | |
| Driver enable time | tPZH, tPZL | 10 | 30 | ns | REB = 0V, Fig 22, Fig 23 | 5 | |
| Driver enable time | tPZH, tPZL | 6 | 12 | us | REB = VCC, Fig 22, Fig 23 | 5 | |
| Receiver output rise/fall time | tf, tr | 4 | 8 | CL=15pF, Fig 24 | 5 | ||
| Receiver propagation delay | tPHL, tPLH | 40 | 80 | ns | 5 | ||
| Receiver pulse skew | tSK(P) | 4 | /tPHL, tPLH/ | 5 | |||
| Receiver disable time | tPHZ, tPLZ | 7 | 20 | ns | Fig 25 | 5 | |
| Receiver enable time | tPZH(1) | 30 | 70 | ns | DE = VCC, Fig 25, Fig 26 | 5 | |
| Receiver enable time | tPZL(1) | 6 | 12 | DE = 0V, Fig 25, Fig 26 | 5 | ||
| Receiver enable time | tPZH(2) | 6 | 12 | us | 5 | ||
| Junction-to-ambient thermal resistance, SOIC8 | RθJA | 120 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
BSP48505S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
bsp48505s-etched.step/bsp48505s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsp48505s.step/bsp48505s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (17 pp, sha256
686ea06ce67651f0, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).