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BSP48505S

Public Made by Adom

by adom

BORN RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BSP48505S

BORN · RS-485 / RS-422 ICs · SOIC-8

BSP48505S from BORN, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver data output: goes high when VID is above VTH+ and low when VID is below VTH-, and is held high (fail-safe) on an open, shorted or idle bus.
2 REB input Receiver enable, active low with an internal pull-up; driving it high (or leaving it open) puts RO in high-impedance and disables the receiver.
3 DE input Driver enable, active high with an internal pull-down; when DE is low or open the driver is disabled and A and B are high-impedance.
4 DI input Driver data input with an internal pull-up to VCC; when the driver is enabled and DI is open, output A is high and B is low.
5 GND power_in Ground reference for all device voltages (VCC, bus, and logic pins are referenced to GND).
6 A bidirectional Bus driver output / receiver input line A, rated for bus voltage -7 V to 12 V with ±20 kV HBM ESD protection to GND.
7 B bidirectional Bus driver output / receiver input line B, rated for bus voltage -7 V to 12 V with ±20 kV HBM ESD protection to GND.
8 VCC power_in Supply voltage referenced to GND, recommended 3.0 V to 5.5 V; place a 100 nF to 220 nF decoupling capacitor as close to this pin as possible.

Key specifications

Parameter Value
Manufacturer BORN
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC supply voltage VCC -0.5 7 V 3
Bus voltage A, B VIO -8 13 V 3
Bus voltage difference between A and B VIO_DIF -8 13 V 3
Logic input voltage DI, DE, REB VIO -0.3 V 3
Logic output voltage RO VIO -0.3 V 3
Junction temperature TJ 150 °C 3
Storage temperature TSTG -65 150 °C 3
ESD HBM, bus A, B to GND VESD -20 20 kV HBM per ANSI/ESDA/JEDEC JS-001, bus A, B to GND 3
ESD HBM, other pins VESD -8 8 kV HBM per ANSI/ESDA/JEDEC JS-001, other pins 3
ESD CDM, other pins VESD -2 2 kV CDM per JEDEC JESD22-C101, all pins; other pins 3
ESD IEC 61000-4-2 contact discharge, bus A, B to GND VESD -4 4 kV IEC 61000-4-2 contact discharge, bus A, B to GND 3
EFT IEC 61000-4-4, bus A, B to GND VEFT -4 4 kV IEC 61000-4-4, bus A, B to GND 3
Supply voltage referenced to GND VCC 3 5 5.5 V 3
Bus input voltage VIN -7 12 V 3
High-level input threshold VIH 2 V 3
Low-level input threshold VIL 0 0.8 V 3
Differential load resistance RL 54 Ω 3
Data rate 1/tUI 0.5 Mbps BSP48505x 3
Operating ambient temperature TA -40 125 °C 3
Operating junction temperature TJ -40 150 °C 3
Differential output voltage /VOD/ 1.5 3.2 V RL = 60Ω, -7V≤Vtest≤12V, Fig 18 4
Differential output voltage /VOD/ 2.1 3.2 V RL = 60Ω, -7V≤Vtest≤12V, 4.5V≤VCC≤5.5V, Fig 18 4
Differential output voltage /VOD/ 1.8 3.6 V RL = 100Ω, CL = 50pF, Fig 19 4
Differential output voltage change /ΔVOD/ -50 50 mV RL = 54Ω or 100Ω, CL = 50pF, Fig 19 4
Common-mode output voltage VOC 1 3.3 V RL = 54Ω or 100Ω, CL = 50pF, Fig 19 4
Steady-state common-mode output voltage change ΔVOC(SS) -50 50 mV 4
Driver short-circuit output current /IOS/ 90 150 mA DE = VCC, -7V≤VO≤12V or A and B shorted 4
Bus input current II 70 600 uA DE=0, VCC=0V, VI=12V or 5.0V 4
Bus input current II -100 -40 uA DE=0, VCC=0V, VI=-7V 4
Bus input impedance RI 24 kΩ VA = -7V, VB = 12V or VA = 12V, VB = -7V 4
Positive input threshold voltage VTH+ -110 -50 mV 4
Negative input threshold voltage VTH− -200 -140 mV 4
Input hysteresis voltage VHYS 30 mV 4
Output low voltage VOL 0.2 0.4 V IOH=4mA (as printed) 4
High-impedance output current IOZR -1 1 uA REB=VCC, VO=0V or VCC 4
Receiver short-circuit output current IOSR 95 mA REB=DE=0V, Fig 20 4
Input current (DI, DE, REB) IIN -5 5 uA 0V≤VIN≤VCC 4
Quiescent supply current, driver and receiver enabled ICC 0.95 1.5 mA REB=0V, DE=VCC, no load 4
Quiescent supply current, driver enabled, receiver disabled ICC 0.55 1 mA REB=VCC, DE=VCC, no load 4
Quiescent supply current, driver disabled, receiver enabled ICC 0.7 1.1 mA REB=0V, DE=0V, no load 4
Quiescent supply current, driver and receiver disabled ICC 5 uA REB=VCC, DE=0V, no load 4
Thermal shutdown temperature TSD 200 °C 4
Thermal shutdown hysteresis TSD 25 °C 4
Driver differential output rise/fall time tf, tr 5 12 RL=54Ω, CL=50pF, Fig 21 5
Driver propagation delay tPHL, tPLH 5 12 ns 5
Driver pulse skew tSK(P) 3.5 /tPHL − tPLH/ 5
Driver disable time tPHZ, tPLZ 10 30 ns Fig 22, Fig 23 5
Driver enable time tPZH, tPZL 10 30 ns REB = 0V, Fig 22, Fig 23 5
Driver enable time tPZH, tPZL 6 12 us REB = VCC, Fig 22, Fig 23 5
Receiver output rise/fall time tf, tr 4 8 CL=15pF, Fig 24 5
Receiver propagation delay tPHL, tPLH 40 80 ns 5
Receiver pulse skew tSK(P) 4 /tPHL, tPLH/ 5
Receiver disable time tPHZ, tPLZ 7 20 ns Fig 25 5
Receiver enable time tPZH(1) 30 70 ns DE = VCC, Fig 25, Fig 26 5
Receiver enable time tPZL(1) 6 12 DE = 0V, Fig 25, Fig 26 5
Receiver enable time tPZH(2) 6 12 us 5
Junction-to-ambient thermal resistance, SOIC8 RθJA 120 °C/W 3

CAD (KiCad official)

  • Symbol: BSP48505S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: bsp48505s-etched.step / bsp48505s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bsp48505s.step / bsp48505s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (17 pp, sha256 686ea06ce67651f0, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF