component
MBR1660
Public Made by Adomby adom
SMC Sangdest Microelectronicstronic Nanjing Schottky Diodes, TO-220-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMBR1660
SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-220-2
MBR1660 from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky rectifier (also connected to the mounting tab); 60 V max repetitive reverse voltage for MBR1660. |
| 2 | A | passive | Anode of the Schottky rectifier; 16 A average rectified forward current at Tc=135°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SMC Sangdest Microelectronicstronic Nanjing |
| Package | TO-220-2 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage (MBR1660) | VRRM, VRWM, VR | 60 | V | 1 | |||
| Average Rectified Forward Current | IF(AV) | 16 | A | 50% duty cycle @Tc=135°C, rectangular wave form | 1 | ||
| Peak One Cycle Non-Repetitive Surge Current | IFSM | 150 | A | 8.3ms, Half Sine pulse, TC = 25 ℃ | 1 | ||
| Junction Temperature | TJ | -55 | 150 | C | 2 | ||
| Storage Temperature | Tstg | -55 | 150 | C | 2 | ||
| Forward Voltage Drop | VF1 | 0.75 | V | @16A, Pulse, TJ = 25 ℃ | 2 | ||
| Forward Voltage Drop | VF2 | 0.65 | V | @16A, Pulse, TJ = 125 ℃ | 2 | ||
| Reverse Current | IR1 | 1 | mA | @VR = rated VR TJ = 25 ℃ | 2 | ||
| Reverse Current | IR2 | 50 | mA | @VR = rated VR TJ = 125 ℃ | 2 | ||
| Voltage Rate of Change | dv/dt | 10000 | V/μs | 2 | |||
| Typical Thermal Resistance Junction to Case | RθJC | 1.5 | C/W | DC operation | 2 | ||
| Typical Thermal Resistance Case to Heat Sink | RθCS | 0.5 | C/W | Mounting surface, smooth and greased | 2 |
CAD (KiCad official)
- Symbol:
MBR1660 - Footprint:
Package_TO_SOT_THT:TO-220-2_Vertical - 3D model: TO-220-2 (KiCad packages3D, STEP)
- 3D model files:
mbr1660-etched.step/mbr1660-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mbr1660.step/mbr1660.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (5 pp, sha256
314f5d1d706e2692, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).