Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MBR1660

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-220-2

MBR1660 from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky rectifier (also connected to the mounting tab); 60 V max repetitive reverse voltage for MBR1660.
2 A passive Anode of the Schottky rectifier; 16 A average rectified forward current at Tc=135°C.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package TO-220-2
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage (MBR1660) VRRM, VRWM, VR 60 V 1
Average Rectified Forward Current IF(AV) 16 A 50% duty cycle @Tc=135°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current IFSM 150 A 8.3ms, Half Sine pulse, TC = 25 ℃ 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Forward Voltage Drop VF1 0.75 V @16A, Pulse, TJ = 25 ℃ 2
Forward Voltage Drop VF2 0.65 V @16A, Pulse, TJ = 125 ℃ 2
Reverse Current IR1 1 mA @VR = rated VR TJ = 25 ℃ 2
Reverse Current IR2 50 mA @VR = rated VR TJ = 125 ℃ 2
Voltage Rate of Change dv/dt 10000 V/μs 2
Typical Thermal Resistance Junction to Case RθJC 1.5 C/W DC operation 2
Typical Thermal Resistance Case to Heat Sink RθCS 0.5 C/W Mounting surface, smooth and greased 2

CAD (KiCad official)

  • Symbol: MBR1660
  • Footprint: Package_TO_SOT_THT:TO-220-2_Vertical
  • 3D model: TO-220-2 (KiCad packages3D, STEP)
  • 3D model files: mbr1660-etched.step / mbr1660-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr1660.step / mbr1660.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (5 pp, sha256 314f5d1d706e2692, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF