component

SGM61432XPS8G

Public Made by Adom

by adom

SGMICRO DC-DC Converters, SOIC-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

SGM61432XPS8G

SGMICRO · DC-DC Converters · SOIC-8-EP

SGM61432XPS8G from SGMICRO, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap input for the N-MOSFET gate driver supply; connect a 0.1μF ceramic capacitor to the SW pin, and the MOSFET turns off if the capacitor voltage drops below the BOOT-UVLO level.
2 VIN power_in Supply input for 4V to 40V; decouple to GND close to the catch diode anode and the device with a low ESR ceramic capacitor (X5R or higher grade).
3 EN input Active-high enable input; float or pull up to VIN to enable, pull down below 1.11V to disable, and a resistor divider from VIN can program the input UVLO level.
4 RT/CLK input Resistor timing and external clock input; switching frequency is set by the external RT resistor or an external SYNC clock.
5 FB input Feedback pin for setting the output voltage; regulated to 0.75V, connect a feedback resistor divider tap here.
6 SS passive Soft-start control pin; connect an external capacitor (CSS) between this pin and GND to set the soft-start time.
7 GND power_in Ground pin.
8 SW power_out Switching node of the converter (source of the internal MOSFET); connect to the catch diode cathode, the bootstrap capacitor and the inductor.
9 EP power_in Exposed pad that helps cool the device junction and must be connected to GND for proper operation.

Key specifications

Parameter Value
Manufacturer SGMICRO
Package SOIC-8-EP
Category Power Supply Chip
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operation Input Voltage VIN 4 40 V TJ = -40℃ to +125℃ 4
Under-Voltage Lockout Threshold VUVLO 3.68 3.85 4 V Rising threshold 4
Shutdown Supply Current ISHDN 1.3 3.8 μA TJ = +25℃, 4.0V ≤ VIN ≤ 40V, VEN = 0V 4
EN Threshold Voltage rising VENH 1.19 1.27 V VEN rising 4
EN Threshold Voltage falling VENL 1.05 1.11 V VEN falling 4
Feedback Voltage VFB 0.745 0.75 0.765 V TJ = +25℃ 4
Feedback Voltage VFB 0.739 0.75 0.769 V TJ = -40℃ to +125℃ 4
High-side MOSFET On-Resistance RDSON 93 150 mΩ VIN = 12V, VBOOT to VSW = 5V 4
Current Limit ILIMT 4.4 5.1 5.8 A TJ = +25℃, VIN = 12V, close-loop 4
Switching Frequency fSW 470 500 530 kHz RT = 49.9kΩ, 1% accuracy 4
UVLO Hysteresis VUVLO_HYS 255 mV 4
Quiescent Current IQ 38 μA TJ = +25℃, VIN = 12V, VFB = 1V 4
EN Hysteresis VEN_HYS 80 mV Hysteresis 4
EN Input Current IEN_PIN -4.4 μA Enable threshold +50mV 4
EN Input Current IEN_PIN -1 μA Enable threshold -50mV 4
EN Hysteresis Current IEN_HYS -3.4 μA 4
SS Pin Current ISS 3 μA TJ = +25℃ 4
Thermal Shutdown Threshold TSHDN 175 ℃ 4
Thermal Shutdown Hysteresis THYS 20 ℃ 4
SYNC Clock High Level Threshold VSYNC_HI 1.7 V 4
SYNC Clock Low Level Threshold VSYNC_LO 0.7 V 4
Minimum SYNC Input Pulse Width TSYNC_MIN 30 ns Measured at 500kHz, VSYNC_HI > 3V, VSYNC_LO < 0.3V 4
PLL Lock in Time tLOCK_IN 100 µs Measured at 500kHz 4
Minimum Controllable on Time tON_MIN 85 ns 4
Maximum Duty Cycle DMAX 97 % fSW = 200kHz 4
VIN, EN to GND -0.3 44 V 2
BOOT to GND -0.3 50 V 2
SS to GND -0.3 5 V 2
FB to GND -0.3 6 V 2
RT/CLK to GND -0.3 3.6 V 2
BOOT to SW 6 V 2
SW to GND -0.6 44 V 2
SW to GND (10ns Transient) -3.5 44 V 10ns transient 2
Junction Temperature TJ 150 ℃ 2
Storage Temperature Range -65 150 ℃ 2
Lead Temperature 260 ℃ Soldering, 10s 2
Input Voltage Range VIN 4 40 V 2
Switching Frequency Range at RT Mode fSW 200 2500 kHz RT mode 2
Switching Frequency Range at SYNC Mode fSW 250 2300 kHz SYNC mode 2
Operating Junction Temperature Range TJ -40 125 ℃ 2
Package Thermal Resistance θJA 41 ℃/W SOIC-8 (Exposed Pad) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper  Connect the device GND pin directly to the exposed pad (Power Pad) copper area under the 16

CAD (KiCad official)

  • Symbol: SGM61432XPS8G
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: sgm61432xps8g-etched.step / sgm61432xps8g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm61432xps8g.step / sgm61432xps8g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (20 pp, sha256 8b5a6ba5fae0b0e6, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF