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SGM61432XPS8G

SGMICRO · DC-DC Converters · SOIC-8-EP

SGM61432XPS8G from SGMICRO, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	BOOT	passive	Bootstrap input for the N-MOSFET gate driver supply; connect a 0.1μF ceramic capacitor to the SW pin, and the MOSFET turns off if the capacitor voltage drops below the BOOT-UVLO level.
2	VIN	power_in	Supply input for 4V to 40V; decouple to GND close to the catch diode anode and the device with a low ESR ceramic capacitor (X5R or higher grade).
3	EN	input	Active-high enable input; float or pull up to VIN to enable, pull down below 1.11V to disable, and a resistor divider from VIN can program the input UVLO level.
4	RT/CLK	input	Resistor timing and external clock input; switching frequency is set by the external RT resistor or an external SYNC clock.
5	FB	input	Feedback pin for setting the output voltage; regulated to 0.75V, connect a feedback resistor divider tap here.
6	SS	passive	Soft-start control pin; connect an external capacitor (CSS) between this pin and GND to set the soft-start time.
7	GND	power_in	Ground pin.
8	SW	power_out	Switching node of the converter (source of the internal MOSFET); connect to the catch diode cathode, the bootstrap capacitor and the inductor.
9	EP	power_in	Exposed pad that helps cool the device junction and must be connected to GND for proper operation.

Key specifications

Parameter	Value
Manufacturer	SGMICRO
Package	SOIC-8-EP
Category	Power Supply Chip
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Operation Input Voltage	VIN	4		40	V	TJ = -40℃ to +125℃	4
Under-Voltage Lockout Threshold	VUVLO	3.68	3.85	4	V	Rising threshold	4
Shutdown Supply Current	ISHDN		1.3	3.8	μA	TJ = +25℃, 4.0V ≤ VIN ≤ 40V, VEN = 0V	4
EN Threshold Voltage rising	VENH	1.19		1.27	V	VEN rising	4
EN Threshold Voltage falling	VENL	1.05		1.11	V	VEN falling	4
Feedback Voltage	VFB	0.745	0.75	0.765	V	TJ = +25℃	4
Feedback Voltage	VFB	0.739	0.75	0.769	V	TJ = -40℃ to +125℃	4
High-side MOSFET On-Resistance	RDSON		93	150	mΩ	VIN = 12V, VBOOT to VSW = 5V	4
Current Limit	ILIMT	4.4	5.1	5.8	A	TJ = +25℃, VIN = 12V, close-loop	4
Switching Frequency	fSW	470	500	530	kHz	RT = 49.9kΩ, 1% accuracy	4
UVLO Hysteresis	VUVLO_HYS		255		mV		4
Quiescent Current	IQ		38		μA	TJ = +25℃, VIN = 12V, VFB = 1V	4
EN Hysteresis	VEN_HYS		80		mV	Hysteresis	4
EN Input Current	IEN_PIN		-4.4		μA	Enable threshold +50mV	4
EN Input Current	IEN_PIN		-1		μA	Enable threshold -50mV	4
EN Hysteresis Current	IEN_HYS		-3.4		μA		4
SS Pin Current	ISS		3		μA	TJ = +25℃	4
Thermal Shutdown Threshold	TSHDN		175		℃		4
Thermal Shutdown Hysteresis	THYS		20		℃		4
SYNC Clock High Level Threshold	VSYNC_HI		1.7		V		4
SYNC Clock Low Level Threshold	VSYNC_LO		0.7		V		4
Minimum SYNC Input Pulse Width	TSYNC_MIN		30		ns	Measured at 500kHz, VSYNC_HI > 3V, VSYNC_LO < 0.3V	4
PLL Lock in Time	tLOCK_IN		100		µs	Measured at 500kHz	4
Minimum Controllable on Time	tON_MIN		85		ns		4
Maximum Duty Cycle	DMAX		97		%	fSW = 200kHz	4
VIN, EN to GND		-0.3		44	V		2
BOOT to GND		-0.3		50	V		2
SS to GND		-0.3		5	V		2
FB to GND		-0.3		6	V		2
RT/CLK to GND		-0.3		3.6	V		2
BOOT to SW				6	V		2
SW to GND		-0.6		44	V		2
SW to GND (10ns Transient)		-3.5		44	V	10ns transient	2
Junction Temperature	TJ			150	℃		2
Storage Temperature Range		-65		150	℃		2
Lead Temperature				260	℃	Soldering, 10s	2
Input Voltage Range	VIN	4		40	V		2
Switching Frequency Range at RT Mode	fSW	200		2500	kHz	RT mode	2
Switching Frequency Range at SYNC Mode	fSW	250		2300	kHz	SYNC mode	2
Operating Junction Temperature Range	TJ	-40		125	℃		2
Package Thermal Resistance	θJA		41		℃/W	SOIC-8 (Exposed Pad)	2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		 Connect the device GND pin directly to the exposed pad (Power Pad) copper area under the	16

CAD (KiCad official)

Symbol: SGM61432XPS8G
Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
3D model: SOIC-8-EP (KiCad packages3D, STEP)
3D model files: sgm61432xps8g-etched.step / sgm61432xps8g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm61432xps8g.step / sgm61432xps8g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: SGMICRO datasheet (20 pp, sha256 8b5a6ba5fae0b0e6, retrieved 2026-10-22, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF