component
ESP32-H2-MINI-1U-N2
Public Made by Adomby adom
Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownESP32-H2-MINI-1U-N2
Espressif Systems · RF and Wireless · 61-SMD Module
ESP32-H2-MINI-1U-N2 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground. |
| 2 | GND | power_in | Ground. |
| 3 | 3V3 | power_in | Module power supply, 3.0 to 3.6 V. |
| 4 | NC | unconnected | No connection. |
| 5 | IO2 | bidirectional | GPIO2, also FSPIWP, ADC1_CH1 and JTAG MTMS. |
| 6 | IO3 | bidirectional | GPIO3, also FSPIHD, ADC1_CH2 and JTAG MTDO. |
| 7 | NC | unconnected | No connection. |
| 8 | EN | input | High enables the chip, low powers it off; must not be left floating. |
| 9 | IO0 | bidirectional | GPIO0, also FSPIQ. |
| 10 | IO1 | bidirectional | GPIO1, also FSPICS0 and ADC1_CH0. |
| 11 | GND | power_in | Ground. |
| 12 | IO13 | bidirectional | GPIO13, also XTAL_32K_P (32 kHz crystal). |
| 13 | IO14 | bidirectional | GPIO14, also XTAL_32K_N (32 kHz crystal). |
| 14 | GND | power_in | Ground. |
| 15 | VBAT | power_in | Connected to internal 3V3 supply by default, or to an external battery supply of 3.0 to 3.6 V. |
| 16 | IO12 | bidirectional | GPIO12. |
| 17 | NC | unconnected | No connection. |
| 18 | IO4 | bidirectional | GPIO4, also FSPICLK, ADC1_CH3 and JTAG MTCK. |
| 19 | IO5 | bidirectional | GPIO5, also FSPID, ADC1_CH4 and JTAG MTDI. |
| 20 | IO10 | bidirectional | GPIO10, also ZCD0 (analog comparator pad). |
| 21 | IO11 | bidirectional | GPIO11, also ZCD1 (analog comparator pad). |
| 22 | IO8 | bidirectional | GPIO8; strapping pin for boot mode and ROM message printing, floating by default. |
| 23 | IO9 | bidirectional | GPIO9; strapping pin for boot mode, weak pull-up by default (1 = SPI boot, 0 = download boot). |
| 24 | IO22 | bidirectional | GPIO22. |
| 25 | IO25 | bidirectional | GPIO25 and FSPICS3; strapping pin for JTAG signal source, floating by default. |
| 26 | IO26 | bidirectional | GPIO26, also FSPICS4 and USB D-. |
| 27 | IO27 | bidirectional | GPIO27, also FSPICS5 and USB D+. |
| 28 | NC | unconnected | No connection. |
| 29 | NC | unconnected | No connection. |
| 30 | RXD0 | bidirectional | GPIO23, also FSPICS1 and U0RXD (UART0 receive). |
| 31 | TXD0 | bidirectional | GPIO24, also FSPICS2 and U0TXD (UART0 transmit). |
| 32 | NC | unconnected | No connection. |
| 33 | NC | unconnected | No connection. |
| 34 | NC | unconnected | No connection. |
| 35 | NC | unconnected | No connection. |
| 36 | GND | power_in | Ground. |
| 37 | GND | power_in | Ground. |
| 38 | GND | power_in | Ground. |
| 39 | GND | power_in | Ground. |
| 40 | GND | power_in | Ground. |
| 41 | GND | power_in | Ground. |
| 42 | GND | power_in | Ground. |
| 43 | GND | power_in | Ground. |
| 44 | GND | power_in | Ground. |
| 45 | GND | power_in | Ground. |
| 46 | GND | power_in | Ground. |
| 47 | GND | power_in | Ground. |
| 48 | GND | power_in | Ground. |
| 49 | GND | power_in | Ground; shown as EPAD in the schematic, soldering it to base-board ground is optional and improves thermal performance. |
| 50 | GND | power_in | Ground. |
| 51 | GND | power_in | Ground. |
| 52 | GND | power_in | Ground. |
| 53 | GND | power_in | Ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 61-SMD Module |
| Category | RF and Wireless |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 24 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 24 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 24 | |
| Current delivered by external power supply | IVDD | 0.35 | A | 24 | |||
| Operating ambient temperature | TA | -40 | 105 | °C | 24 | ||
| High-level input current | IIH | 50 | nA | 24 | |||
| Low-level input current | IIL | 50 | nA | 24 | |||
| Center frequency range of operating channel (Bluetooth LE) | 2402 | 2480 | MHz | 27 | |||
| RF transmit power range (Bluetooth LE) | -24 | 20 | dBm | 27 | |||
| Center frequency range of operating channel (802.15.4) | 2405 | 2480 | MHz | 31 | |||
| RF transmit power range (802.15.4) | -24 | 20 | dBm | 31 | |||
| Sensitivity 1 Mbps | -98 | dBm | @30.8% PER | 29 | |||
| Sensitivity 2 Mbps | -95 | dBm | @30.8% PER | 29 | |||
| Sensitivity 125 Kbps | -105.5 | dBm | @30.8% PER | 30 | |||
| Sensitivity 500 Kbps | -101.5 | dBm | @30.8% PER | 30 | |||
| Sensitivity 802.15.4 250 Kbps | -101.5 | dBm | @1% PER | 31 | |||
| Crystal frequency tolerance (Y1, 32 MHz) | -10 | 10 | ppm | Y1 32MHz crystal in module schematic | 32 | ||
| Pin capacitance | CIN | 2 | pF | 24 | |||
| Pull-up resistor | RPU | 45 | kΩ | 24 | |||
| Pull-down resistor | RPD | 45 | kΩ | 24 | |||
| High-level source current | IOH | 40 | mA | VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 24 | ||
| Low-level sink current | IOL | 28 | mA | VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 24 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-H2-MINI-1U-N2 - Footprint:
PCM_Espressif:ESP32-H2-MINI-1U - 3D model: 61-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-h2-mini-1u-n2-etched.step/esp32-h2-mini-1u-n2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-h2-mini-1u-n2.step/esp32-h2-mini-1u-n2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (45 pp, sha256
33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).