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ESP32-H2-MINI-1U-N2

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-H2-MINI-1U-N2

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1U-N2 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Module power supply, 3.0 to 3.6 V.
4 NC unconnected No connection.
5 IO2 bidirectional GPIO2, also FSPIWP, ADC1_CH1 and JTAG MTMS.
6 IO3 bidirectional GPIO3, also FSPIHD, ADC1_CH2 and JTAG MTDO.
7 NC unconnected No connection.
8 EN input High enables the chip, low powers it off; must not be left floating.
9 IO0 bidirectional GPIO0, also FSPIQ.
10 IO1 bidirectional GPIO1, also FSPICS0 and ADC1_CH0.
11 GND power_in Ground.
12 IO13 bidirectional GPIO13, also XTAL_32K_P (32 kHz crystal).
13 IO14 bidirectional GPIO14, also XTAL_32K_N (32 kHz crystal).
14 GND power_in Ground.
15 VBAT power_in Connected to internal 3V3 supply by default, or to an external battery supply of 3.0 to 3.6 V.
16 IO12 bidirectional GPIO12.
17 NC unconnected No connection.
18 IO4 bidirectional GPIO4, also FSPICLK, ADC1_CH3 and JTAG MTCK.
19 IO5 bidirectional GPIO5, also FSPID, ADC1_CH4 and JTAG MTDI.
20 IO10 bidirectional GPIO10, also ZCD0 (analog comparator pad).
21 IO11 bidirectional GPIO11, also ZCD1 (analog comparator pad).
22 IO8 bidirectional GPIO8; strapping pin for boot mode and ROM message printing, floating by default.
23 IO9 bidirectional GPIO9; strapping pin for boot mode, weak pull-up by default (1 = SPI boot, 0 = download boot).
24 IO22 bidirectional GPIO22.
25 IO25 bidirectional GPIO25 and FSPICS3; strapping pin for JTAG signal source, floating by default.
26 IO26 bidirectional GPIO26, also FSPICS4 and USB D-.
27 IO27 bidirectional GPIO27, also FSPICS5 and USB D+.
28 NC unconnected No connection.
29 NC unconnected No connection.
30 RXD0 bidirectional GPIO23, also FSPICS1 and U0RXD (UART0 receive).
31 TXD0 bidirectional GPIO24, also FSPICS2 and U0TXD (UART0 transmit).
32 NC unconnected No connection.
33 NC unconnected No connection.
34 NC unconnected No connection.
35 NC unconnected No connection.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground; shown as EPAD in the schematic, soldering it to base-board ground is optional and improves thermal performance.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 24
Storage temperature TSTORE -40 105 °C 24
Power supply voltage VDD33 3 3.3 3.6 V 24
Current delivered by external power supply IVDD 0.35 A 24
Operating ambient temperature TA -40 105 °C 24
High-level input current IIH 50 nA 24
Low-level input current IIL 50 nA 24
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 27
RF transmit power range (Bluetooth LE) -24 20 dBm 27
Center frequency range of operating channel (802.15.4) 2405 2480 MHz 31
RF transmit power range (802.15.4) -24 20 dBm 31
Sensitivity 1 Mbps -98 dBm @30.8% PER 29
Sensitivity 2 Mbps -95 dBm @30.8% PER 29
Sensitivity 125 Kbps -105.5 dBm @30.8% PER 30
Sensitivity 500 Kbps -101.5 dBm @30.8% PER 30
Sensitivity 802.15.4 250 Kbps -101.5 dBm @1% PER 31
Crystal frequency tolerance (Y1, 32 MHz) -10 10 ppm Y1 32MHz crystal in module schematic 32
Pin capacitance CIN 2 pF 24
Pull-up resistor RPU 45 kΩ 24
Pull-down resistor RPD 45 kΩ 24
High-level source current IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 24
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 24

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1U-N2
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1U
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1u-n2-etched.step / esp32-h2-mini-1u-n2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1u-n2.step / esp32-h2-mini-1u-n2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF