W25Q64JVSFIQ TR
Public Unreviewedby Ray
Winbond Elec W25Q64JVSFIQ TR NOR FLASH, SOIC-16-300mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownW25Q64JVSFIQ TR
Winbond Elec · NOR FLASH · SOIC-16-300mil
W25Q64JVSFIQ TR from Winbond Elec, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /HOLD or /RESET (IO3) | bidirectional | In Standard/Dual SPI mode, this pin is the active-low /HOLD input, which pauses serial communication while /CS is low. When QE=1 (Quad Enable set in Status Register-2), this pin becomes IO3 for Quad SPI instructions. The /HOLD function is not available in Quad I/O mode. |
| 2 | VCC | power_in | Power supply input. Operating range 2.7V to 3.6V. /CS must track VCC at power-up/power-down. |
| 3 | /RESET | input | Dedicated active-low hardware reset input. Driving /RESET low for a minimum of ~1 µs terminates any external or internal operation and returns the device to its power-on state. This pin is dedicated regardless of device settings; if unused, it may be left floating or connected to VCC. |
| 4 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 5 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 6 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 7 | /CS | input | Active-low SPI Chip Select. When high the device is deselected and all data output pins (DO, IO0..IO3) are high-impedance. When low the device is selected and instructions can be written / data read. /CS must track VCC at power-up; a pull-up resistor on /CS can be used. |
| 8 | DO (IO1) | bidirectional | Standard SPI serial data output (DO) - unidirectional, driven on the falling edge of CLK. In Dual/Quad SPI it becomes bidirectional IO1. |
| 9 | /WP (IO2) | bidirectional | Active-low Write Protect input in Standard/Dual SPI - used with the Status Register block-protect and SRP bits to hardware-protect the register. In Quad SPI (QE=1) it becomes bidirectional IO2. |
| 10 | GND | power_in | Ground reference for supply and I/O. |
| 11 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 12 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 13 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 14 | NC | unconnected | No connect. Leave floating or tie to any potential; not internally bonded. |
| 15 | DI (IO0) | bidirectional | Standard SPI serial data input (DI) - unidirectional, sampled on the rising edge of CLK. In Dual/Quad SPI it becomes bidirectional IO0. |
| 16 | CLK | input | SPI serial clock input. Provides the timing reference for all serial I/O; supports up to 133 MHz (266/532 MHz equivalent throughput for Dual/Quad I/O). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-16-300mil |
| Category | Memory |
| Pins | 16 |
Ordering variants
Same part, different packaging or reel option.
W25Q64JVSFIQ TRW25Q64JVSFIQ TRSFIMW25Q64JVSFIQ TRSSIQW25Q64JVSFIQ TRSSIGW25Q64JVSFIQ TRSSIMW25Q64JVSFIQ TRZPIQW25Q64JVSFIQ TRZPIGW25Q64JVSFIQ TRZPIMW25Q64JVSFIQ TRZEIQW25Q64JVSFIQ TRZEIGW25Q64JVSFIQ TRZEIMW25Q64JVSFIQ TRXGIQW25Q64JVSFIQ TRXGIGW25Q64JVSFIQ TRXGIMW25Q64JVSFIQ TRTBIQW25Q64JVSFIQ TRTBIMW25Q64JVSFIQ TRTCIQW25Q64JVSFIQ TRTCIMW25Q64JVSFIQ TRBYIQ
CAD (KiCad official)
- Symbol:
W25Q64JVSFIQ TR - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
w25q64jvsfiq-tr.step |
217 KB | You want the bare part, or you mark your own boards. |
w25q64jvsfiq-tr-etched.step |
3.1 MB | You want the part with W25Q64JVSFIQ TR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 760 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (78 pp, sha256
452d906c3be0da07, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).