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Contents

README

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W25Q64JVSFIQ TR

Winbond Elec · NOR FLASH · SOIC-16-300mil

W25Q64JVSFIQ TR from Winbond Elec, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /HOLD or /RESET (IO3) bidirectional In Standard/Dual SPI mode, this pin is the active-low /HOLD input, which pauses serial communication while /CS is low. When QE=1 (Quad Enable set in Status Register-2), this pin becomes IO3 for Quad SPI instructions. The /HOLD function is not available in Quad I/O mode.
2 VCC power_in Power supply input. Operating range 2.7V to 3.6V. /CS must track VCC at power-up/power-down.
3 /RESET input Dedicated active-low hardware reset input. Driving /RESET low for a minimum of ~1 µs terminates any external or internal operation and returns the device to its power-on state. This pin is dedicated regardless of device settings; if unused, it may be left floating or connected to VCC.
4 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
5 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
6 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
7 /CS input Active-low SPI Chip Select. When high the device is deselected and all data output pins (DO, IO0..IO3) are high-impedance. When low the device is selected and instructions can be written / data read. /CS must track VCC at power-up; a pull-up resistor on /CS can be used.
8 DO (IO1) bidirectional Standard SPI serial data output (DO) - unidirectional, driven on the falling edge of CLK. In Dual/Quad SPI it becomes bidirectional IO1.
9 /WP (IO2) bidirectional Active-low Write Protect input in Standard/Dual SPI - used with the Status Register block-protect and SRP bits to hardware-protect the register. In Quad SPI (QE=1) it becomes bidirectional IO2.
10 GND power_in Ground reference for supply and I/O.
11 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
12 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
13 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
14 NC unconnected No connect. Leave floating or tie to any potential; not internally bonded.
15 DI (IO0) bidirectional Standard SPI serial data input (DI) - unidirectional, sampled on the rising edge of CLK. In Dual/Quad SPI it becomes bidirectional IO0.
16 CLK input SPI serial clock input. Provides the timing reference for all serial I/O; supports up to 133 MHz (266/532 MHz equivalent throughput for Dual/Quad I/O).

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-16-300mil
Category Memory
Pins 16

Ordering variants

Same part, different packaging or reel option.

  • W25Q64JVSFIQ TR
  • W25Q64JVSFIQ TRSFIM
  • W25Q64JVSFIQ TRSSIQ
  • W25Q64JVSFIQ TRSSIG
  • W25Q64JVSFIQ TRSSIM
  • W25Q64JVSFIQ TRZPIQ
  • W25Q64JVSFIQ TRZPIG
  • W25Q64JVSFIQ TRZPIM
  • W25Q64JVSFIQ TRZEIQ
  • W25Q64JVSFIQ TRZEIG
  • W25Q64JVSFIQ TRZEIM
  • W25Q64JVSFIQ TRXGIQ
  • W25Q64JVSFIQ TRXGIG
  • W25Q64JVSFIQ TRXGIM
  • W25Q64JVSFIQ TRTBIQ
  • W25Q64JVSFIQ TRTBIM
  • W25Q64JVSFIQ TRTCIQ
  • W25Q64JVSFIQ TRTCIM
  • W25Q64JVSFIQ TRBYIQ

CAD (KiCad official)

  • Symbol: W25Q64JVSFIQ TR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
w25q64jvsfiq-tr.step 217 KB You want the bare part, or you mark your own boards.
w25q64jvsfiq-tr-etched.step 3.1 MB You want the part with W25Q64JVSFIQ TR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 760 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (78 pp, sha256 452d906c3be0da07, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF