component
ESP32-H2-MINI-1-N4
Public Made by Adomby adom
ESPRESSIF IoT/Communication Modules, ESP32-H2-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownESP32-H2-MINI-1-N4
ESPRESSIF · IoT/Communication Modules · ESP32-H2-MINI-1
ESP32-H2-MINI-1-N4 from ESPRESSIF, in a ESP32-H2-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground. |
| 2 | GND | power_in | Ground. |
| 3 | 3V3 | power_in | Power supply; the module operates at VDD33 of 3.0 V to 3.6 V (3.3 V typical). |
| 4 | NC | unconnected | Not connected. |
| 5 | IO2 | bidirectional | GPIO2, multiplexed as FSPIWP, ADC1_CH1 and MTMS. |
| 6 | IO3 | bidirectional | GPIO3, multiplexed as FSPIHD, ADC1_CH2 and MTDO. |
| 7 | NC | unconnected | Not connected. |
| 8 | EN | input | High enables the chip and low powers it off; the pin must not be left floating. |
| 9 | IO0 | bidirectional | GPIO0, multiplexed as FSPIQ. |
| 10 | IO1 | bidirectional | GPIO1, multiplexed as FSPICS0 and ADC1_CH0. |
| 11 | GND | power_in | Ground. |
| 12 | IO13 | bidirectional | GPIO13, multiplexed as XTAL_32K_P. |
| 13 | IO14 | bidirectional | GPIO14, multiplexed as XTAL_32K_N. |
| 14 | GND | power_in | Ground. |
| 15 | VBAT | power_in | Connected to the internal 3V3 supply by default, or to an external battery supply of 3.0 V to 3.6 V. |
| 16 | IO12 | bidirectional | GPIO12. |
| 17 | NC | unconnected | Not connected. |
| 18 | IO4 | bidirectional | GPIO4, multiplexed as FSPICLK, ADC1_CH3 and MTCK. |
| 19 | IO5 | bidirectional | GPIO5, multiplexed as FSPID, ADC1_CH4 and MTDI. |
| 20 | IO10 | bidirectional | GPIO10, multiplexed as ZCD0. |
| 21 | IO11 | bidirectional | GPIO11, multiplexed as ZCD1. |
| 22 | IO8 | bidirectional | GPIO8, which is also a strapping pin for chip boot mode and ROM message printing. |
| 23 | IO9 | bidirectional | GPIO9, which is also a chip boot mode strapping pin with a default weak pull-up. |
| 24 | IO22 | bidirectional | GPIO22. |
| 25 | IO25 | bidirectional | GPIO25, multiplexed as FSPICS3 and used as the JTAG signal source strapping pin. |
| 26 | IO26 | bidirectional | GPIO26, multiplexed as FSPICS4 and USB_D-. |
| 27 | IO27 | bidirectional | GPIO27, multiplexed as FSPICS5 and USB_D+. |
| 28 | NC | unconnected | Not connected. |
| 29 | NC | unconnected | Not connected. |
| 30 | RXD0 | bidirectional | GPIO23, multiplexed as FSPICS1 and U0RXD (UART0 receive). |
| 31 | TXD0 | bidirectional | GPIO24, multiplexed as FSPICS2 and U0TXD (UART0 transmit). |
| 32 | NC | unconnected | Not connected. |
| 33 | NC | unconnected | Not connected. |
| 34 | NC | unconnected | Not connected. |
| 35 | NC | unconnected | Not connected. |
| 36 | GND | power_in | Ground. |
| 37 | GND | power_in | Ground. |
| 38 | GND | power_in | Ground. |
| 39 | GND | power_in | Ground. |
| 40 | GND | power_in | Ground. |
| 41 | GND | power_in | Ground. |
| 42 | GND | power_in | Ground. |
| 43 | GND | power_in | Ground. |
| 44 | GND | power_in | Ground. |
| 45 | GND | power_in | Ground. |
| 46 | GND | power_in | Ground. |
| 47 | GND | power_in | Ground. |
| 48 | GND | power_in | Ground. |
| 49 | GND | power_in | Ground (also labelled EPAD in the peripheral schematic; soldering it to the base board is optional and improves thermal performance). |
| 50 | GND | power_in | Ground. |
| 51 | GND | power_in | Ground. |
| 52 | GND | power_in | Ground. |
| 53 | GND | power_in | Ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ESPRESSIF |
| Package | ESP32-H2-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage (absolute maximum) | VDD33 | -0.3 | 3.6 | V | 24 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 24 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 24 | |
| Current delivered by external power supply | IVDD | 0.35 | A | 24 | |||
| Operating ambient temperature | TA | -40 | 105 | °C | 24 | ||
| High-level input current | IIH | 50 | nA | 24 | |||
| Low-level input current | IIL | 50 | nA | 24 | |||
| Bluetooth LE sensitivity 1 Mbps | -98 | dBm | @30.8% PER | 29 | |||
| Bluetooth LE maximum received signal 1 Mbps | 8 | dBm | @30.8% PER | 29 | |||
| Bluetooth LE sensitivity 2 Mbps | -95 | dBm | @30.8% PER | 29 | |||
| Bluetooth LE maximum received signal 2 Mbps | 8 | dBm | @30.8% PER | 29 | |||
| Bluetooth LE sensitivity 125 Kbps | -105.5 | dBm | @30.8% PER | 30 | |||
| Bluetooth LE maximum received signal 125 Kbps | 8 | dBm | @30.8% PER | 30 | |||
| Bluetooth LE sensitivity 500 Kbps | -101.5 | dBm | @30.8% PER | 30 | |||
| Bluetooth LE maximum received signal 500 Kbps | 8 | dBm | @30.8% PER | 30 | |||
| 802.15.4 sensitivity 250 Kbps | -101.5 | dBm | @1% PER | 31 | |||
| 802.15.4 maximum received signal 250 Kbps | 8 | dBm | @1% PER | 31 | |||
| RF transmit power range (802.15.4) | -24 | 20 | dBm | 31 | |||
| Intermodulation (Bluetooth LE 1 Mbps) | -35 | dBm | 29 | ||||
| Intermodulation (Bluetooth LE 2 Mbps) | -27 | dBm | 30 | ||||
| Crystal oscillator frequency | Y1 | 32 | MHz | 32 | |||
| Crystal oscillator frequency tolerance | Y1 | -10 | 10 | ppm | 32 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-H2-MINI-1-N4 - Footprint:
PCM_Espressif:ESP32-H2-MINI-1 - 3D model: ESP32-H2-MINI-1 (KiCad packages3D, STEP)
- 3D model files:
esp32-h2-mini-1-n4-etched.step/esp32-h2-mini-1-n4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-h2-mini-1-n4.step/esp32-h2-mini-1-n4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ESPRESSIF datasheet (45 pp, sha256
33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).