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ESP32-H2-MINI-1-N4

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ESPRESSIF IoT/Communication Modules, ESP32-H2-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-H2-MINI-1-N4

ESPRESSIF · IoT/Communication Modules · ESP32-H2-MINI-1

ESP32-H2-MINI-1-N4 from ESPRESSIF, in a ESP32-H2-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply; the module operates at VDD33 of 3.0 V to 3.6 V (3.3 V typical).
4 NC unconnected Not connected.
5 IO2 bidirectional GPIO2, multiplexed as FSPIWP, ADC1_CH1 and MTMS.
6 IO3 bidirectional GPIO3, multiplexed as FSPIHD, ADC1_CH2 and MTDO.
7 NC unconnected Not connected.
8 EN input High enables the chip and low powers it off; the pin must not be left floating.
9 IO0 bidirectional GPIO0, multiplexed as FSPIQ.
10 IO1 bidirectional GPIO1, multiplexed as FSPICS0 and ADC1_CH0.
11 GND power_in Ground.
12 IO13 bidirectional GPIO13, multiplexed as XTAL_32K_P.
13 IO14 bidirectional GPIO14, multiplexed as XTAL_32K_N.
14 GND power_in Ground.
15 VBAT power_in Connected to the internal 3V3 supply by default, or to an external battery supply of 3.0 V to 3.6 V.
16 IO12 bidirectional GPIO12.
17 NC unconnected Not connected.
18 IO4 bidirectional GPIO4, multiplexed as FSPICLK, ADC1_CH3 and MTCK.
19 IO5 bidirectional GPIO5, multiplexed as FSPID, ADC1_CH4 and MTDI.
20 IO10 bidirectional GPIO10, multiplexed as ZCD0.
21 IO11 bidirectional GPIO11, multiplexed as ZCD1.
22 IO8 bidirectional GPIO8, which is also a strapping pin for chip boot mode and ROM message printing.
23 IO9 bidirectional GPIO9, which is also a chip boot mode strapping pin with a default weak pull-up.
24 IO22 bidirectional GPIO22.
25 IO25 bidirectional GPIO25, multiplexed as FSPICS3 and used as the JTAG signal source strapping pin.
26 IO26 bidirectional GPIO26, multiplexed as FSPICS4 and USB_D-.
27 IO27 bidirectional GPIO27, multiplexed as FSPICS5 and USB_D+.
28 NC unconnected Not connected.
29 NC unconnected Not connected.
30 RXD0 bidirectional GPIO23, multiplexed as FSPICS1 and U0RXD (UART0 receive).
31 TXD0 bidirectional GPIO24, multiplexed as FSPICS2 and U0TXD (UART0 transmit).
32 NC unconnected Not connected.
33 NC unconnected Not connected.
34 NC unconnected Not connected.
35 NC unconnected Not connected.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground (also labelled EPAD in the peripheral schematic; soldering it to the base board is optional and improves thermal performance).
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer ESPRESSIF
Package ESP32-H2-MINI-1
Category IoT/Communication Modules
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage (absolute maximum) VDD33 -0.3 3.6 V 24
Storage temperature TSTORE -40 105 °C 24
Power supply voltage VDD33 3 3.3 3.6 V 24
Current delivered by external power supply IVDD 0.35 A 24
Operating ambient temperature TA -40 105 °C 24
High-level input current IIH 50 nA 24
Low-level input current IIL 50 nA 24
Bluetooth LE sensitivity 1 Mbps -98 dBm @30.8% PER 29
Bluetooth LE maximum received signal 1 Mbps 8 dBm @30.8% PER 29
Bluetooth LE sensitivity 2 Mbps -95 dBm @30.8% PER 29
Bluetooth LE maximum received signal 2 Mbps 8 dBm @30.8% PER 29
Bluetooth LE sensitivity 125 Kbps -105.5 dBm @30.8% PER 30
Bluetooth LE maximum received signal 125 Kbps 8 dBm @30.8% PER 30
Bluetooth LE sensitivity 500 Kbps -101.5 dBm @30.8% PER 30
Bluetooth LE maximum received signal 500 Kbps 8 dBm @30.8% PER 30
802.15.4 sensitivity 250 Kbps -101.5 dBm @1% PER 31
802.15.4 maximum received signal 250 Kbps 8 dBm @1% PER 31
RF transmit power range (802.15.4) -24 20 dBm 31
Intermodulation (Bluetooth LE 1 Mbps) -35 dBm 29
Intermodulation (Bluetooth LE 2 Mbps) -27 dBm 30
Crystal oscillator frequency Y1 32 MHz 32
Crystal oscillator frequency tolerance Y1 -10 10 ppm 32

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1-N4
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1
  • 3D model: ESP32-H2-MINI-1 (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1-n4-etched.step / esp32-h2-mini-1-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1-n4.step / esp32-h2-mini-1-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ESPRESSIF datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF