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ATSAML21E16B-MNT
Public Made by Adomby adom
Microchip Tech Pre-ordered MCUs, QFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownATSAML21E16B-MNT
Microchip Tech · Pre-ordered MCUs · QFN-32-EP(5x5)
ATSAML21E16B-MNT from Microchip Tech, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA00 | bidirectional | General-purpose I/O (VSWOUT-supplied backup pin) with EXTINT[0]/EXTWAKE[0], XIN32 32 kHz crystal input, SERCOM1 PAD[0] and TCC2 WO[0]. |
| 2 | PA01 | bidirectional | General-purpose I/O (VSWOUT-supplied backup pin) with EXTINT[1]/EXTWAKE[1], XOUT32 32 kHz crystal output, SERCOM1 PAD[1] and TCC2 WO[1]. |
| 3 | PA02 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[2]/EXTWAKE[2], ADC AIN[0], PTC Y[0], DAC VOUT[0] and OPAMP OA_NEG[0]. |
| 4 | PA03 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[3]/EXTWAKE[3], external reference VREFA, ADC AIN[1] and PTC Y[1]. |
| 5 | PA04 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[4]/EXTWAKE[4], VREFB, ADC AIN[4], AC AIN[0], OA_OUT[2], SERCOM0 PAD[0] and TCC0 WO[0]. |
| 6 | PA05 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[5]/EXTWAKE[5], ADC AIN[5], AC AIN[1], DAC VOUT[1], OA_POS[2], SERCOM0 PAD[1] and TCC0 WO[1]. |
| 7 | PA06 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[6]/EXTWAKE[6], ADC AIN[6], AC AIN[2], PTC Y[4], OA_POS[0], SERCOM0 PAD[2] and TCC1 WO[0]. |
| 8 | PA07 | bidirectional | General-purpose I/O supplied by VDDANA with EXTINT[7]/EXTWAKE[7], ADC AIN[7], AC AIN[3], OA_OUT[0], SERCOM0 PAD[3] and TCC1 WO[1]. |
| 9 | VDDANA | power_in | Analog supply, 1.6V to 3.6V, with 100nF and 10µF decoupling; on SAM L21E VDDIO is electrically connected to and supplied through VDDANA. |
| 10 | GND | power_in | Ground for the device. |
| 11 | PA08 | bidirectional | High-sink general-purpose I/O with NMI, ADC AIN[16], PTC X[0]/Y[6], SERCOM0/2 PAD[0], TCC0 WO[0] and TCC1 WO[2]; I2C Hs-capable. |
| 12 | PA09 | bidirectional | High-sink general-purpose I/O with EXTINT[9], ADC AIN[17], PTC X[1]/Y[7], SERCOM0/2 PAD[1], TCC0 WO[1] and TCC1 WO[3]; I2C Hs-capable. |
| 13 | PA10 | bidirectional | General-purpose I/O with EXTINT[10], ADC AIN[18], PTC X[2]/Y[8], SERCOM0/2 PAD[2], TCC1 WO[0], TCC0 WO[2] and GCLK_IO[4]. |
| 14 | PA11 | bidirectional | General-purpose I/O with EXTINT[11], ADC AIN[19], PTC X[3]/Y[9], SERCOM0/2 PAD[3], TCC1 WO[1], TCC0 WO[3] and GCLK_IO[5]. |
| 15 | PA14 | bidirectional | General-purpose I/O with EXTINT[14], XOSC XIN crystal/clock input, SERCOM2/4 PAD[2], TC4 WO[0], TCC0 WO[4] and GCLK_IO[0]. |
| 16 | PA15 | bidirectional | General-purpose I/O with EXTINT[15], XOSC XOUT crystal output, SERCOM2/4 PAD[3], TC4 WO[1], TCC0 WO[5] and GCLK_IO[1]. |
| 17 | PA16 | bidirectional | High-sink general-purpose I/O with EXTINT[0], PTC X[4], SERCOM1/3 PAD[0], TCC2 WO[0], TCC0 WO[6] and GCLK_IO[2]; I2C Hs-capable. |
| 18 | PA17 | bidirectional | High-sink general-purpose I/O with EXTINT[1], PTC X[5], SERCOM1/3 PAD[1], TCC2 WO[1], TCC0 WO[7] and GCLK_IO[3]; I2C Hs-capable. |
| 19 | PA18 | bidirectional | General-purpose I/O with EXTINT[2], PTC X[6], SERCOM1/3 PAD[2], TC4 WO[0], TCC0 WO[2] and AC CMP[0]. |
| 20 | PA19 | bidirectional | General-purpose I/O with EXTINT[3], PTC X[7], SERCOM1/3 PAD[3], TC4 WO[1], TCC0 WO[3] and AC CMP[1]. |
| 21 | PA22 | bidirectional | High-sink general-purpose I/O with EXTINT[6], PTC X[10], SERCOM3/5 PAD[0], TC0 WO[0], TCC0 WO[4] and GCLK_IO[6]; I2C Hs-capable. |
| 22 | PA23 | bidirectional | High-sink general-purpose I/O with EXTINT[7], PTC X[11], SERCOM3/5 PAD[1], TC0 WO[1], TCC0 WO[5], USB SOF 1kHz and GCLK_IO[7]; I2C Hs-capable. |
| 23 | PA24 | bidirectional | General-purpose I/O with EXTINT[12], SERCOM3/5 PAD[2], TC1 WO[0], TCC1 WO[2] and USB DM. |
| 24 | PA25 | bidirectional | General-purpose I/O with EXTINT[13], SERCOM3/5 PAD[3], TC1 WO[1], TCC1 WO[3] and USB DP. |
| 25 | PA27 | bidirectional | High-sink general-purpose I/O supplied by VDDIN with EXTINT[15] and GCLK_IO[0]. |
| 26 | RESET | input | Active-low external reset input with internal pull-up; low-level threshold below 0.33VDDIO at 1.6-2.0V and below 0.36VDDIO at 2.7-3.6V. |
| 27 | VSW | power_out | On-chip switching regulator output; connect a 10µH inductor to VDDCORE in switching mode, leave unconnected in linear mode. |
| 28 | GND | power_in | Ground for the device. |
| 29 | VDDCORE | power_out | Core supply of 0.9V to 1.2V typical with 100nF and 1µF decoupling; linear mode output, or switching mode input connected to VSW via inductor. |
| 30 | VDDIN | power_in | Main supply input, 1.6V to 3.6V, with 100nF and 10µF decoupling. |
| 31 | PA30 | bidirectional | General-purpose I/O supplied by VDDIN with EXTINT[10], SERCOM1 PAD[2], TCC1 WO[0], SWCLK (needs 1kΩ pull-up) and GCLK_IO[0]. |
| 32 | PA31 | bidirectional | High-sink general-purpose I/O supplied by VDDIN with EXTINT[11], SERCOM1 PAD[3], TCC1 WO[1] and SWDIO (active only with a debugger present). |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-32-EP(5x5) |
| Category | Embedded Processors & Controllers |
| Pins | 33 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | indium tin oxide (ITO) sensor grids. The PTC requires one pin per X-line and one pin per Y-line. In self-capacitance mode, the PTC requires only one pin (Y-line) for each touch sensor. | 1034 |
CAD (KiCad official)
- Symbol:
ATSAML21E16B-MNT - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
atsaml21e16b-mnt-etched.step/atsaml21e16b-mnt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);atsaml21e16b-mnt.step/atsaml21e16b-mnt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (1158 pp, sha256
c7ade1efde79dc98, retrieved 2026-11-10, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).