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AT93C66B-XHM-B
Public Made by Adomby adom
Microchip Tech EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownAT93C66B-XHM-B
Microchip Tech · EEPROM · TSSOP-8
AT93C66B-XHM-B from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip Select: the device is selected only when CS is high; when not selected, DI data is not accepted and DO stays in high-impedance. |
| 2 | SK | input | Serial Data Clock: DI is latched on the rising edge of SK and DO is clocked out on the rising edge of SK. |
| 3 | DI | input | Serial Data Input: receives instructions, addresses and data, latched on the rising edge of SK. |
| 4 | DO | tri_state | Serial Data Output: shifts out read data after the SK rising edge and, when CS goes high after an erase or write has started, outputs the Ready/Busy status; high-impedance when not selected. |
| 5 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 6 | ORG | input | Internal Organization select: tied to VCC selects x16 (128/256 words of 16 bits), tied to GND selects x8 (256/512 words of 8 bits); if left unconnected, the internal pull-up selects x16. |
| 7 | NC | unconnected | No Connect pin. |
| 8 | VCC | power_in | Device power supply pin; the device operates from 2.5V to 5.5V, and operation at invalid VCC may produce spurious results. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TSSOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Temperature under bias | -55 | 125 | °C | 8 | |||
| Storage temperature | -65 | 150 | °C | 8 | |||
| VCC (absolute maximum) | VCC | 6.25 | V | 8 | |||
| Voltage on any pin with respect to ground | -1 | 7 | V | 8 | |||
| DC output current | 5 | mA | 8 | ||||
| ESD protection | 2 | kV | 8 | ||||
| Operating Temperature (Case) | -40 | 125 | °C | Automotive Temperature Range | 8 | ||
| VCC Power Supply | VCC | 2.5 | 5.5 | V | Low-Voltage Grade | 8 | |
| Supply Voltage | VCC1 | 2.5 | 5.5 | V | 8 | ||
| Supply Voltage | VCC2 | 4.5 | 5.5 | V | 8 | ||
| Supply Current | ICC1 | 0.5 | 2 | mA | VCC = 5.0V, Read at 1 MHz | 8 | |
| Standby Current (2.5V Option) | ISB1 | 3 | 10 | μA | VCC = 2.5V, CS = 0V | 8 | |
| Standby Current (5.0V Option) | ISB2 | 10 | 15 | μA | VCC = 5.0V, CS = 0V | 8 | |
| Input Leakage Current | IIL | 0.1 | 3 | μA | VIN = 0 to VCC | 8 | |
| Output Leakage Current | ILO | 0.1 | 3 | μA | VOUT = 0 to VCC | 8 | |
| Input Low-Voltage | VIL1 | -0.6 | 0.8 | V | 2.5V ≤ VCC ≤ 5.5V (Note 2) | 8 | |
| Input High-Voltage | VIH1 | 2 | V | 2.5V ≤ VCC ≤ 5.5V (Note 2); max printed as VCC + 1 | 8 | ||
| Output Low-Voltage | VOL1 | 0.4 | V | 2.5V ≤ VCC ≤ 5.5V, IOL = 2.1 mA | 9 | ||
| Output High-Voltage | VOH1 | 2.4 | V | 2.5V ≤ VCC ≤ 5.5V, IOH = -0.4 mA | 9 | ||
| Clock Frequency, SK | fSK | 0 | 2 | MHz | 4.5V ≤ VCC ≤ 5.5V | 9 | |
| Clock Frequency, SK | fSK | 0 | 1 | MHz | 2.5V ≤ VCC ≤ 5.5V | 9 | |
| High Time, SK | tSKH | 250 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| Low Time, SK | tSKL | 250 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| Minimum CS Low Time | tCS | 250 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| CS Setup Time | tCSS | 50 | ns | 2.5V ≤ VCC ≤ 5.5V, Relative to SK | 9 | ||
| DI Setup Time | tDIS | 100 | ns | 2.5V ≤ VCC ≤ 5.5V, Relative to SK | 9 | ||
| CS Hold Time | tCSH | 0 | ns | Relative to SK | 9 | ||
| DI Hold Time | tDIH | 100 | ns | 2.5V ≤ VCC ≤ 5.5V, Relative to SK | 9 | ||
| Output Delay to 1 | tPD1 | 250 | ns | 4.5V ≤ VCC ≤ 5.5V | 9 | ||
| Output Delay to 1 | tPD1 | 500 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| Output Delay to 0 | tPD0 | 250 | ns | 4.5V ≤ VCC ≤ 5.5V | 9 | ||
| Output Delay to 0 | tPD0 | 500 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| CS to Status Valid | tSV | 250 | ns | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| CS to DO in High-impedance | tDF | 100 | ns | 4.5V ≤ VCC ≤ 5.5V, CS = VIL | 9 | ||
| CS to DO in High-impedance | tDF | 150 | ns | 2.5V ≤ VCC ≤ 5.5V, CS = VIL | 9 | ||
| Write Cycle Time | tWP | 5 | ms | 2.5V ≤ VCC ≤ 5.5V | 9 | ||
| Time required after VCC is stable before the device can accept commands | tPUP | 100 | µs | 10 | |||
| Power-on Reset Threshold Voltage | VPOR | 1.5 | V | 10 | |||
| Minimum time at VCC = 0V between power cycles | tPOFF | 500 | ms | 10 | |||
| Output Capacitance (DO) | COUT | 5 | pF | VOUT = 0V, TA = 25°C, F = 1.0 MHz, VCC = +5V | 11 | ||
| Input Capacitance (CS, SK, DI, ORG) | CIN | 5 | pF | VIN = 0V, TA = 25°C, F = 1.0 MHz, VCC = +5V | 11 | ||
| Write Endurance | 1e+06 | Write Cycles | TA = 25°C, VCC = 5.0V | 11 | |||
| Data Retention | 100 | Years | TA = 55°C | 11 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. | 18 |
CAD (KiCad official)
- Symbol:
AT93C66B-XHM-B - Footprint:
Package_SO:TSSOP-8_3x3mm_P0.65mm - 3D model: TSSOP-8 (KiCad packages3D, STEP)
- 3D model files:
at93c66b-xhm-b-etched.step/at93c66b-xhm-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at93c66b-xhm-b.step/at93c66b-xhm-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (27 pp, sha256
b2c92ec7874801eb, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).