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AT93C66B-XHM-B

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Microchip Tech EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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AT93C66B-XHM-B

Microchip Tech · EEPROM · TSSOP-8

AT93C66B-XHM-B from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip Select: the device is selected only when CS is high; when not selected, DI data is not accepted and DO stays in high-impedance.
2 SK input Serial Data Clock: DI is latched on the rising edge of SK and DO is clocked out on the rising edge of SK.
3 DI input Serial Data Input: receives instructions, addresses and data, latched on the rising edge of SK.
4 DO tri_state Serial Data Output: shifts out read data after the SK rising edge and, when CS goes high after an erase or write has started, outputs the Ready/Busy status; high-impedance when not selected.
5 GND power_in Ground reference for the power supply, to be connected to system ground.
6 ORG input Internal Organization select: tied to VCC selects x16 (128/256 words of 16 bits), tied to GND selects x8 (256/512 words of 8 bits); if left unconnected, the internal pull-up selects x16.
7 NC unconnected No Connect pin.
8 VCC power_in Device power supply pin; the device operates from 2.5V to 5.5V, and operation at invalid VCC may produce spurious results.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature under bias -55 125 °C 8
Storage temperature -65 150 °C 8
VCC (absolute maximum) VCC 6.25 V 8
Voltage on any pin with respect to ground -1 7 V 8
DC output current 5 mA 8
ESD protection 2 kV 8
Operating Temperature (Case) -40 125 °C Automotive Temperature Range 8
VCC Power Supply VCC 2.5 5.5 V Low-Voltage Grade 8
Supply Voltage VCC1 2.5 5.5 V 8
Supply Voltage VCC2 4.5 5.5 V 8
Supply Current ICC1 0.5 2 mA VCC = 5.0V, Read at 1 MHz 8
Standby Current (2.5V Option) ISB1 3 10 μA VCC = 2.5V, CS = 0V 8
Standby Current (5.0V Option) ISB2 10 15 μA VCC = 5.0V, CS = 0V 8
Input Leakage Current IIL 0.1 3 μA VIN = 0 to VCC 8
Output Leakage Current ILO 0.1 3 μA VOUT = 0 to VCC 8
Input Low-Voltage VIL1 -0.6 0.8 V 2.5V ≤ VCC ≤ 5.5V (Note 2) 8
Input High-Voltage VIH1 2 V 2.5V ≤ VCC ≤ 5.5V (Note 2); max printed as VCC + 1 8
Output Low-Voltage VOL1 0.4 V 2.5V ≤ VCC ≤ 5.5V, IOL = 2.1 mA 9
Output High-Voltage VOH1 2.4 V 2.5V ≤ VCC ≤ 5.5V, IOH = -0.4 mA 9
Clock Frequency, SK fSK 0 2 MHz 4.5V ≤ VCC ≤ 5.5V 9
Clock Frequency, SK fSK 0 1 MHz 2.5V ≤ VCC ≤ 5.5V 9
High Time, SK tSKH 250 ns 2.5V ≤ VCC ≤ 5.5V 9
Low Time, SK tSKL 250 ns 2.5V ≤ VCC ≤ 5.5V 9
Minimum CS Low Time tCS 250 ns 2.5V ≤ VCC ≤ 5.5V 9
CS Setup Time tCSS 50 ns 2.5V ≤ VCC ≤ 5.5V, Relative to SK 9
DI Setup Time tDIS 100 ns 2.5V ≤ VCC ≤ 5.5V, Relative to SK 9
CS Hold Time tCSH 0 ns Relative to SK 9
DI Hold Time tDIH 100 ns 2.5V ≤ VCC ≤ 5.5V, Relative to SK 9
Output Delay to 1 tPD1 250 ns 4.5V ≤ VCC ≤ 5.5V 9
Output Delay to 1 tPD1 500 ns 2.5V ≤ VCC ≤ 5.5V 9
Output Delay to 0 tPD0 250 ns 4.5V ≤ VCC ≤ 5.5V 9
Output Delay to 0 tPD0 500 ns 2.5V ≤ VCC ≤ 5.5V 9
CS to Status Valid tSV 250 ns 2.5V ≤ VCC ≤ 5.5V 9
CS to DO in High-impedance tDF 100 ns 4.5V ≤ VCC ≤ 5.5V, CS = VIL 9
CS to DO in High-impedance tDF 150 ns 2.5V ≤ VCC ≤ 5.5V, CS = VIL 9
Write Cycle Time tWP 5 ms 2.5V ≤ VCC ≤ 5.5V 9
Time required after VCC is stable before the device can accept commands tPUP 100 µs 10
Power-on Reset Threshold Voltage VPOR 1.5 V 10
Minimum time at VCC = 0V between power cycles tPOFF 500 ms 10
Output Capacitance (DO) COUT 5 pF VOUT = 0V, TA = 25°C, F = 1.0 MHz, VCC = +5V 11
Input Capacitance (CS, SK, DI, ORG) CIN 5 pF VIN = 0V, TA = 25°C, F = 1.0 MHz, VCC = +5V 11
Write Endurance 1e+06 Write Cycles TA = 25°C, VCC = 5.0V 11
Data Retention 100 Years TA = 55°C 11

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] © 2017 Microchip Technology Inc. 18

CAD (KiCad official)

  • Symbol: AT93C66B-XHM-B
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: at93c66b-xhm-b-etched.step / at93c66b-xhm-b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at93c66b-xhm-b.step / at93c66b-xhm-b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (27 pp, sha256 b2c92ec7874801eb, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF