component
IRF630N
Public Made by Adomby adom
Minos MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIRF630N
Minos · MOSFETs · TO-220
IRF630N from Minos, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage limited to ±30 V, with threshold voltage of 2.0 to 4.0 V at ID=250µA. |
| 2 | D | passive | Drain, also connected to the mounting tab; drain-to-source voltage rated 200 V and continuous drain current 9 A at TC=25°C. |
| 3 | S | passive | Source; body diode continuous source current is 9 A at TC=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Minos |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 200 | V | 2 | |||
| Continuous Drain Current | ID | 9 | A | 2 | |||
| Continuous Drain Current | ID | 5.5 | A | TC = 100 °C | 2 | ||
| Pulsed Drain Current | IDM | 36 | A | (Note1) | 2 | ||
| Gate-to-Source Voltage | VGS | -30 | 30 | V | 2 | ||
| Single Pulse Avalanche Energy | EAS | 200 | mJ | L=20mH, VDS=50V, Start TJ=25℃ (Note2) | 2 | ||
| Peak Diode Recovery dv/dt | dv/dt | 5 | V/ns | ISD=9A, di/dt ≤100A/us, VDD≤BVDS, Start TJ=25℃ (Note3) | 2 | ||
| Power Dissipation | PD | 75 | W | TO-220, TO-251, TO-252 | 2 | ||
| Derating Factor above 25°C | 0.6 | W/℃ | TO-220, TO-251, TO-252 | 2 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | ℃ | 2 | ||
| Maximum Temperature for Soldering | TL | 300 | ℃ | 2 | |||
| Junction-to-Case Thermal Resistance | RθJC | 1.67 | ℃/W | TO-220, TO-251, TO-252 (No FullPAK) | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 62.5 | ℃/W | TO-220, TO-251, TO-252 (No FullPAK) | 2 | ||
| Drain to Source Breakdown Voltage | VDSS | 200 | V | VGS=0V, ID=250µA | 3 | ||
| Drain to Source Leakage Current | IDSS | 1 | µA | VDS=200V, VGS=0V, Tj=25℃ | 3 | ||
| Drain to Source Leakage Current | IDSS | 100 | µA | VDS=160V, VGS=0V, Tj=125℃ | 3 | ||
| Gate to Source Forward Leakage | IGSS(F) | 100 | nA | VGS=+30V | 3 | ||
| Gate to Source Reverse Leakage | IGSS(R) | 100 | nA | VGS=-30V | 3 | ||
| Drain-to-Source On-Resistance | RDS(ON) | 0.26 | 0.32 | Ω | VGS=10V, ID=4A (Note4) | 3 | |
| Gate Threshold Voltage | VGS(TH) | 2 | 4 | V | VDS=VGS, ID=250µA (Note4) | 3 | |
| Continuous Source Current (Body Diode) | IS | 9 | A | TC=25 °C | 4 | ||
| Maximum Pulsed Current (Body Diode) | ISM | 36 | A | 4 | |||
| Diode Forward Voltage | VSD | 1.2 | V | IS=9A, VGS=0V (Note4) | 4 |
CAD (KiCad official)
- Symbol:
IRF630N - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files:
irf630n-etched.step/irf630n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irf630n.step/irf630n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Minos datasheet (12 pp, sha256
c27090002323ff3d, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).