Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

AD5755ACPZ

Analog Devices · Digital To Analog Converters (DACs) · LFCSP-64(9x9)

AD5755ACPZ from Analog Devices, in a LFCSP-64(9x9). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RSET_B passive An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_B temperature drift performance.
2 RSET_A passive An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_A temperature drift performance.
3 REFGND power_in Ground reference point for the internal reference.
4 REFGND power_in Ground reference point for the internal reference.
5 AD0 input Address decode for the device under test on the board.
6 AD1 input Address decode for the device under test on the board; it is not recommended to tie both AD1 and AD0 low when using PEC.
7 SYNC input Active low frame synchronization input for the serial interface; data is transferred in on the falling edge of SCLK while SYNC is low.
8 SCLK input Serial clock input; data is clocked into the input shift register on the falling edge, at clock speeds of up to 30 MHz.
9 SDIN input Serial data input; data must be valid on the falling edge of SCLK.
10 SDO output Serial data output used to clock data from the serial register in readback mode.
11 DVDD power_in Digital supply with a voltage range from 2.7 V to 5.5 V.
12 DGND power_in Digital ground.
13 LDAC input Active low load DAC input that updates the DAC outputs; it must not be left unconnected.
14 CLEAR input Active high, edge sensitive input that sets the output current and voltage to the preprogrammed clear code; the DAC output register cannot be written while CLEAR is active.
15 ALERT output Active high output asserted when there has been no SPI activity on the interface pins for a predetermined time.
16 FAULT output Active low, open-drain output asserted on an open circuit in current mode, a short circuit in voltage mode, a PEC error, or an overtemperature.
17 POC input Power-on condition pin read during power-on or after a device reset; POC = 0 powers up the voltage and current channels in tristate, POC = 1 powers up the voltage channel with a 30 kΩ pull-down to ground.
18 RESET input Active low hardware reset input.
19 AVDD power_in Positive analog supply with a voltage range from 9 V to 33 V.
20 COMPLV_A passive Optional compensation capacitor connection for the VOUT_A output buffer; a 220 pF capacitor to VOUT_A allows the voltage output to drive up to 2 µF at the cost of increased settling time.
21 -VSENSE_A input Sense connection for the negative voltage output load of VOUT_A, which must stay within ±3.0 V of AGND for specified operation.
22 +VSENSE_A input Sense connection for the positive voltage output load of VOUT_A.
23 COMPDCDC_A passive DC-to-DC compensation capacitor for the Channel A converter, where a 10 nF capacitor is connected from this pin to ground.
24 VBOOST_A power_in Supply for the Channel A current output stage, which is also the supply for the VOUT_x stage regulated to 15 V by the dc-to-dc converter.
25 VOUT_A output Buffered analog output voltage for DAC Channel A.
26 IOUT_A output Current output pin for DAC Channel A.
27 AVSS power_in Negative analog supply with a voltage range from −10.8 V to −26.4 V.
28 COMPLV_B passive Optional compensation capacitor connection for the VOUT_B output buffer; a 220 pF capacitor to VOUT_B allows the voltage output to drive up to 2 µF at the cost of increased settling time.
29 -VSENSE_B input Sense connection for the negative voltage output load of VOUT_B, which must stay within ±3.0 V of AGND for specified operation.
30 +VSENSE_B input Sense connection for the positive voltage output load of VOUT_B.
31 VOUT_B output Buffered analog output voltage for DAC Channel B.
32 COMPDCDC_B passive DC-to-DC compensation capacitor for the Channel B converter, where a 10 nF capacitor is connected from this pin to ground.
33 IOUT_B output Current output pin for DAC Channel B.
34 VBOOST_B power_in Supply for the Channel B current output stage, which is also the supply for the VOUT_x stage regulated to 15 V by the dc-to-dc converter.
35 AGND power_in Ground reference point for analog circuitry, which must be connected to 0 V.
36 SWB output Switching output for the Channel B dc-to-dc circuitry.
37 GNDSWB power_in Ground connection for the Channel B dc-to-dc switching circuit, which should always be connected to ground.
38 GNDSWA power_in Ground connection for the Channel A dc-to-dc switching circuit, which should always be connected to ground.
39 SWA output Switching output for the Channel A dc-to-dc circuitry.
40 AVSS power_in Negative analog supply with a voltage range from −10.8 V to −26.4 V.
41 SWD output Switching output for the Channel D dc-to-dc circuitry.
42 GNDSWD power_in Ground connection for the Channel D dc-to-dc switching circuit, which should always be connected to ground.
43 GNDSWC power_in Ground connection for the Channel C dc-to-dc switching circuit, which should always be connected to ground.
44 SWC output Switching output for the Channel C dc-to-dc circuitry.
45 AVCC power_in Supply for the dc-to-dc circuitry.
46 VBOOST_C power_in Supply for the Channel C current output stage, which is also the supply for the VOUT_x stage regulated to 15 V by the dc-to-dc converter.
47 IOUT_C output Current output pin for DAC Channel C.
48 COMPDCDC_C passive DC-to-DC compensation capacitor for the Channel C converter, where a 10 nF capacitor is connected from this pin to ground.
49 VOUT_C output Buffered analog output voltage for DAC Channel C.
50 +VSENSE_C input Sense connection for the positive voltage output load of VOUT_C.
51 -VSENSE_C input Sense connection for the negative voltage output load of VOUT_C, which must stay within ±3.0 V of AGND for specified operation.
52 COMPLV_C passive Optional compensation capacitor connection for the VOUT_C output buffer; a 220 pF capacitor to VOUT_C allows the voltage output to drive up to 2 µF at the cost of increased settling time.
53 AVSS power_in Negative analog supply pin.
54 IOUT_D output Current output pin for DAC Channel D.
55 VOUT_D output Buffered analog output voltage for DAC Channel D.
56 VBOOST_D power_in Supply for the Channel D current output stage, which is also the supply for the VOUT_x stage regulated to 15 V by the dc-to-dc converter.
57 COMPDCDC_D passive DC-to-DC compensation capacitor for the Channel D converter, where a 10 nF capacitor is connected from this pin to ground.
58 +VSENSE_D input Sense connection for the positive voltage output load of VOUT_D.
59 -VSENSE_D input Sense connection for the negative voltage output load of VOUT_D, which must stay within ±3.0 V of AGND for specified operation.
60 COMPLV_D passive Optional compensation capacitor connection for the VOUT_D output buffer; a 220 pF capacitor to VOUT_D allows the voltage output to drive up to 2 µF at the cost of increased settling time.
61 REFIN input External reference voltage input.
62 REFOUT output Internal reference voltage output; it is recommended to place a 0.1 µF capacitor between REFOUT and REFGND.
63 RSET_D passive An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_D temperature drift performance.
64 RSET_C passive An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_C temperature drift performance.
65 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-64(9x9)
Category ADC/DAC/Data Conversion
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Total Unadjusted Error (TUE) TUE -0.25 0.25 % FSR A Version; AVSS = −15 V, loaded and unloaded 4
Total Unadjusted Error (TUE) TUE -0.075 0.02 0.075 % FSR A Version; TA = 25°C 4
Relative Accuracy (INL) INL -0.006 0.0012 0.006 % FSR 0 V to 5 V, 0 V to 10 V, ±5 V, ±10 V ranges 4
Differential Nonlinearity (DNL) DNL -1 1 LSB Guaranteed monotonic 4
Zero-Scale Error -0.03 0.002 0.03 % FSR 4
Zero-Scale TC -2 2 ppm FSR/°C 4
Bipolar Zero Error -0.03 0.002 0.03 % FSR 4
Bipolar Zero TC -1 1 ppm FSR/°C 4
Offset Error -0.03 0.002 0.03 % FSR 4
Offset TC -2 2 ppm FSR/°C 4
Gain Error -0.03 0.004 0.03 % FSR 4
Gain TC -3 3 ppm FSR/°C 4
Full-Scale Error -0.03 0.002 0.03 % FSR 4
Full-Scale TC -2 2 ppm FSR/°C 4
Total Unadjusted Error (TUE) TUE -0.2 0.04 0.2 % FSR A Version; External RSET 5
Relative Accuracy (INL) INL -0.006 0.006 % FSR External RSET 5
Offset Error -0.05 0.005 0.05 % FSR External RSET 5
Offset Error Drift -4 4 ppm FSR/°C External RSET 5
Gain Error -0.05 0.004 0.05 % FSR External RSET 5
Gain TC -3 3 ppm FSR/°C External RSET 5
Full-Scale Error -0.05 0.008 0.05 % FSR External RSET 5
Full-Scale TC -5 5 ppm FSR/°C External RSET 5
Total Unadjusted Error (TUE) TUE -0.35 0.35 % FSR A Version; Internal RSET 5
Offset Error -0.05 0.05 % FSR Internal RSET 5
Offset Error Drift -6 6 ppm FSR/°C Internal RSET 5
Gain Error -0.12 0.12 % FSR Internal RSET 5
Gain TC -9 9 ppm FSR/°C Internal RSET 5
Full-Scale Error -0.14 0.14 % FSR Internal RSET 5
Full-Scale TC -14 14 ppm FSR/°C Internal RSET 5
Reference Input Voltage REFIN 4.95 5 5.05 V For specified performance 6
DC Input Impedance 45 150 MΩ 6
Reference Output Voltage REFOUT 4.995 5 5.005 V TA = 25°C 6
Reference TC -10 5 10 ppm/°C 6
Oscillator Frequency 11.5 13 14.5 MHz This oscillator is divided down to give the dc-to-dc converter switching frequency 6
VIH, Input High Voltage VIH 2 V JEDEC compliant 6
VIL, Input Low Voltage VIL 0.8 V JEDEC compliant 6
Input Current -1 1 µA Per pin 6
VOL, Output Low Voltage (SDO, ALERT) VOL 0.4 V Sinking 200 µA 6
AVDD AVDD 9 33 V 6
AVSS AVSS -26.4 -10.8 V 6
DVDD DVDD 2.7 5.5 V 6
AVCC AVCC 4.5 5.5 V 6
AIDD AIDD 8.6 10.5 mA Voltage output mode on all channels, output unloaded, over supplies 6
AISS AISS -11 -8.8 mA Voltage output mode on all channels, output unloaded, over supplies 6
DICC DICC 9.2 11 mA VIH = DVDD, VIL = DGND, internal oscillator running, over supplies 7
AVDD, VBOOST_x to AGND, DGND AVDD, VBOOST_x -0.3 33 V TA = 25°C, unless otherwise noted 11
AVSS to AGND, DGND AVSS -28 0.3 V TA = 25°C, unless otherwise noted 11
AVDD to AVSS AVDD, AVSS -0.3 60 V TA = 25°C, unless otherwise noted 11
AVCC to AGND AVCC -0.3 7 V TA = 25°C, unless otherwise noted 11
DVDD to DGND DVDD -0.3 7 V TA = 25°C, unless otherwise noted 11
Digital Inputs to DGND -0.3 V Max is DVDD + 0.3 V or +7 V, whichever is less 11
Digital Outputs to DGND -0.3 V Max is DVDD + 0.3 V or +7 V, whichever is less 11
REFIN, REFOUT to AGND REFIN, REFOUT -0.3 V Max is AVDD + 0.3 V or +7 V, whichever is less 11
SWx to AGND SWx -0.3 33 V TA = 25°C, unless otherwise noted 11
AGND, GNDSWx to DGND AGND, GNDSWx -0.3 0.3 V TA = 25°C, unless otherwise noted 11
Operating Temperature Range (TA), Industrial TA -40 105 °C 11
Junction Temperature (TJ max) TJ 125 °C 11
θJA Thermal Impedance θJA 28 °C/W 64-Lead LFCSP, based on JEDEC 4-layer test board 11

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper EPAD Exposed Pad. This exposed pad should be connected to the potential of the AVSS pin, or, alternatively, it can be left electrically unconnected. It is recommended that the pad be thermally connect 14

CAD (KiCad official)

  • Symbol: AD5755ACPZ
  • Footprint: Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm
  • 3D model: LFCSP-64(9x9) (KiCad packages3D, STEP)
  • 3D model files: ad5755acpz-etched.step / ad5755acpz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5755acpz.step / ad5755acpz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (50 pp, sha256 ab1187019b9c588e, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF