component
LM25056APSQ
Public Made by Adomby adom
Texas Instruments Energy Metering ICs, WQFN-24-EP(4x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM25056APSQ
Texas Instruments · Energy Metering ICs · WQFN-24-EP(4x5)
LM25056APSQ from Texas Instruments, in a WQFN-24-EP(4x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ADR2 | input | SMBus address line 2 is a three-state address input that should be connected to GND, VDD, or left floating. |
| 2 | ADR1 | input | SMBus address line 1 is a three-state address input that should be connected to GND, VDD, or left floating. |
| 3 | ADR0 | input | SMBus address line 0 is a three-state address input that should be connected to GND, VDD, or left floating. |
| 4 | VDD | power_out | Internally sub-regulated 3.7V bias output that needs a 1 µF bypass capacitor to ground, and can alternatively be driven from an external 3V to 5.5V supply for low-voltage operation. |
| 5 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 6 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 7 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 8 | VS- | power_in | Negative current-sense input to the IIN sense amplifier; the voltage across the sense resistor RS is measured from VS+ to this pin. |
| 9 | VS+ | power_in | Positive current-sense input to the IIN sense amplifier; the voltage across the sense resistor RS is measured from this pin to VS-. |
| 10 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 11 | VIN | power_in | Positive supply input rated 3V to 17V operating (24V absolute maximum), with a small 0.1 µF ceramic bypass capacitor recommended close to the pin. |
| 12 | ENABLE | input | Enable input with a +1.2V rising threshold; lowering it below the 75 mV hysteresis point puts the device into power-down mode. |
| 13 | VAUX | input | Auxiliary voltage telemetry input with a full-scale input of 1.2V. |
| 14 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 15 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 16 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 17 | AGND | power_in | Analog ground, to be tied to DGND and then to a quiet system ground while keeping high-current return paths away from it. |
| 18 | NC | unconnected | No connect, not bonded to die; can be connected to the ground plane. |
| 19 | DGND | power_in | Digital ground, to be tied to AGND and then to a clean system ground while keeping high-current return paths away from it. |
| 20 | SDA | bidirectional | SMBus data line. |
| 21 | SCL | input | SMBus clock line. |
| 22 | SMBA | output | SMBus alert line, active low. |
| 23 | VREF | power_out | Internally generated precision 2.82V reference used for analog-to-digital conversion, which needs a 1 µF ceramic bypass capacitor to ground. |
| 24 | DIODE | passive | External temperature-sensing connection, to be tied to a diode-configured MMBT3904 NPN transistor. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-24-EP(4x5) |
| Category | ADC/DAC/Data Conversion |
| Pins | 25 |
CAD (KiCad official)
- Symbol:
LM25056APSQ - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x5mm_P0.5mm_EP2.65x3.65mm - 3D model: WQFN-24-EP(4x5) (KiCad packages3D, STEP)
- 3D model files:
lm25056apsq-etched.step/lm25056apsq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm25056apsq.step/lm25056apsq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (38 pp, sha256
f097a3dedf36217b, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).