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LM25056APSQ

Texas Instruments · Energy Metering ICs · WQFN-24-EP(4x5)

LM25056APSQ from Texas Instruments, in a WQFN-24-EP(4x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ADR2 input SMBus address line 2 is a three-state address input that should be connected to GND, VDD, or left floating.
2 ADR1 input SMBus address line 1 is a three-state address input that should be connected to GND, VDD, or left floating.
3 ADR0 input SMBus address line 0 is a three-state address input that should be connected to GND, VDD, or left floating.
4 VDD power_out Internally sub-regulated 3.7V bias output that needs a 1 µF bypass capacitor to ground, and can alternatively be driven from an external 3V to 5.5V supply for low-voltage operation.
5 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
6 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
7 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
8 VS- power_in Negative current-sense input to the IIN sense amplifier; the voltage across the sense resistor RS is measured from VS+ to this pin.
9 VS+ power_in Positive current-sense input to the IIN sense amplifier; the voltage across the sense resistor RS is measured from this pin to VS-.
10 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
11 VIN power_in Positive supply input rated 3V to 17V operating (24V absolute maximum), with a small 0.1 µF ceramic bypass capacitor recommended close to the pin.
12 ENABLE input Enable input with a +1.2V rising threshold; lowering it below the 75 mV hysteresis point puts the device into power-down mode.
13 VAUX input Auxiliary voltage telemetry input with a full-scale input of 1.2V.
14 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
15 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
16 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
17 AGND power_in Analog ground, to be tied to DGND and then to a quiet system ground while keeping high-current return paths away from it.
18 NC unconnected No connect, not bonded to die; can be connected to the ground plane.
19 DGND power_in Digital ground, to be tied to AGND and then to a clean system ground while keeping high-current return paths away from it.
20 SDA bidirectional SMBus data line.
21 SCL input SMBus clock line.
22 SMBA output SMBus alert line, active low.
23 VREF power_out Internally generated precision 2.82V reference used for analog-to-digital conversion, which needs a 1 µF ceramic bypass capacitor to ground.
24 DIODE passive External temperature-sensing connection, to be tied to a diode-configured MMBT3904 NPN transistor.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-24-EP(4x5)
Category ADC/DAC/Data Conversion
Pins 25

CAD (KiCad official)

  • Symbol: LM25056APSQ
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x5mm_P0.5mm_EP2.65x3.65mm
  • 3D model: WQFN-24-EP(4x5) (KiCad packages3D, STEP)
  • 3D model files: lm25056apsq-etched.step / lm25056apsq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm25056apsq.step / lm25056apsq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 f097a3dedf36217b, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF