TPA1517NE from Texas Instruments, in a PDIP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN1	input	IN1 is the audio input for channel 1, and the audio inputs are biased to 2.1 V, so they must be ac coupled through a series capacitor.
2	SGND	power_in	SGND is the input signal ground reference for the amplifier inputs.
3	SVRR	passive	SVRR is the midrail bypass node, and its capacitor needs low leakage (below 1 µA) because it sits at 3 V to 7 V.
4	OUT1	output	OUT1 is the audio output for channel 1, biased to a midrail voltage and connected to the speaker through a series capacitor.
5	PGND	power_in	PGND is the power ground reference.
6	OUT2	output	OUT2 is the audio output for channel 2, biased to a midrail voltage and connected to the speaker through a series capacitor.
7	VCC	power_in	VCC is the supply voltage input, with a recommended range of 9.5 V to 18 V and an absolute maximum of 22 V.
8	M/SB	input	M/SB is the mute/standby enable: below 2 V selects standby, 3.5 V to 8.2 V selects mute, and above 9.3 V gives normal operation, with the 8.2 V to 9.3 V band undefined.
9	IN2	input	IN2 is the audio input for channel 2, and like IN1 it should be ac coupled because the input is biased to 2.1 V.
10	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
11	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
12	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
13	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
14	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
15	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
16	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
17	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
18	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
19	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
20	GND/HS	power_in	GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	PDIP-20
Category	Operational Amplifier/Comparator
Pins	20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage	VCC			22	V	Over operating free-air temperature range	2
Input voltage (IN1, IN2)	VI			22	V		2
Operating free-air temperature range	TA	-40		85	°C		2
Operating junction temperature range	TJ	-40		150	°C		2
Storage temperature range	Tstg	-65		85	°C	As printed in the Absolute Maximum Ratings table	2
Supply voltage	VCC	9.5		18	V		2
Operating free-air temperature	TA	-40		85	°C		2
Supply current	ICC		45	80	mA	VCC = 12 V, TA = 25°C	3
Supply current in standby mode	ICC(SB)		7	100	µA	VCC = 12 V, TA = 25°C	3
Gain	Gain	18.5	20	21	dB	VCC = 12 V, RL = 4 Ω, f = 1 kHz, TA = 25°C	3
Channel balance			0.1	1	dB	VCC = 12 V, RL = 4 Ω, f = 1 kHz, TA = 25°C	3
Supply current	ICC		50	90	mA	VCC = 14.5 V, TA = 25°C	3
Gain	Gain	18.5	20	21	dB	VCC = 14.5 V, RL = 4 Ω, f = 1 kHz, TA = 25°C	4
Channel balance			0.1	1	dB	VCC = 14.5 V, RL = 4 Ω, f = 1 kHz, TA = 25°C	4
Thermal resistance junction-to-ambient (NE package)	θJA		43.9		°C/W	NE package, 0 CFM, 7 in² copper area (value as printed in text)	16
Derating factor (NE package)				22.8	mW/°C	NE package, TA above 25°C, 7 in² copper area	2
Power dissipation rating (NE package)	PD			2.85	W	NE package, TA ≤ 25°C	2
Power dissipation rating (NE package)	PD			1.82	W	NE package, TA = 70°C	2
Power dissipation rating (NE package)	PD			1.48	W	NE package, TA = 85°C	2

CAD (KiCad official)

Symbol: TPA1517NE
Footprint: Package_DIP:DIP-20_W7.62mm
3D model: PDIP-20 (KiCad packages3D, STEP)
3D model files: tpa1517ne-etched.step / tpa1517ne-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa1517ne.step / tpa1517ne.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (24 pp, sha256 db63a7d9966e14b9, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

TPA1517NE

Verified TPA1517NE

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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