component

TPA1517NE

Public Made by Adom

by adom

Texas Instruments Audio Power OpAmps, PDIP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentoperational amplifier-comparatortpa1517nefactory-2.0.0extractor-text

Verified TPA1517NE

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 20 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: TPA1517NE · PDIP-20 · 20 pins
  • ✓copper: 20 copper pads, none touching another net
  • ✓datasheet: all 20 pin names found in the 24-page datasheet
  • ✓distributor: lcsc C2860570, digikey 2156-TPA1517NE-ND, mouser 595-TPA1517NE
  • ✓family: DIP-20_W7.62mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-8qr3nnaj/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 20 pins = 20 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 20 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ tpa1517ne.kicad_sym✓ tpa1517ne.kicad_mod✓ tpa1517ne.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 6d ago
viewers tpa1517ne: viewers · Ray 6d ago
package.json Publish 0.1.0 · Ray 6d ago
page.json Set visibility: public · Ray 6d ago
README.md Publish 0.1.0 · Ray 6d ago
tpa1517ne-etched.glb Publish 0.1.0 · Ray 6d ago
tpa1517ne-etched.step tpa1517ne: factory component page (tier=mfr) · Ray 6d ago
tpa1517ne-hero.glb tpa1517ne: hero GLB from the etched model (keeps the MPN mark) · Ray 6d ago
tpa1517ne-hero.overlay.json Publish 0.1.0 · Ray 6d ago
tpa1517ne.glb Publish 0.1.0 · Ray 6d ago
tpa1517ne.kicad_mod Publish 0.1.0 · Ray 6d ago
tpa1517ne.kicad_sym Publish 0.1.0 · Ray 6d ago
tpa1517ne.lbr Publish 0.1.0 · Ray 6d ago
tpa1517ne.step Publish 0.1.0 · Ray 6d ago
verification.json Verified: Published by the parts factory: tier mfr, 20 pins · Ray 6d ago

TPA1517NE

Texas Instruments · Audio Power OpAmps · PDIP-20

TPA1517NE from Texas Instruments, in a PDIP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN1 input IN1 is the audio input for channel 1, and the audio inputs are biased to 2.1 V, so they must be ac coupled through a series capacitor.
2 SGND power_in SGND is the input signal ground reference for the amplifier inputs.
3 SVRR passive SVRR is the midrail bypass node, and its capacitor needs low leakage (below 1 µA) because it sits at 3 V to 7 V.
4 OUT1 output OUT1 is the audio output for channel 1, biased to a midrail voltage and connected to the speaker through a series capacitor.
5 PGND power_in PGND is the power ground reference.
6 OUT2 output OUT2 is the audio output for channel 2, biased to a midrail voltage and connected to the speaker through a series capacitor.
7 VCC power_in VCC is the supply voltage input, with a recommended range of 9.5 V to 18 V and an absolute maximum of 22 V.
8 M/SB input M/SB is the mute/standby enable: below 2 V selects standby, 3.5 V to 8.2 V selects mute, and above 9.3 V gives normal operation, with the 8.2 V to 9.3 V band undefined.
9 IN2 input IN2 is the audio input for channel 2, and like IN1 it should be ac coupled because the input is biased to 2.1 V.
10 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
11 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
12 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
13 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
14 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
15 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
16 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
17 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
18 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
19 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.
20 GND/HS power_in GND/HS is a ground and heatsink connection, directly connected to the mount pad for thermal-enhanced operation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package PDIP-20
Category Operational Amplifier/Comparator
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 22 V Over operating free-air temperature range 2
Input voltage (IN1, IN2) VI 22 V 2
Operating free-air temperature range TA -40 85 °C 2
Operating junction temperature range TJ -40 150 °C 2
Storage temperature range Tstg -65 85 °C As printed in the Absolute Maximum Ratings table 2
Supply voltage VCC 9.5 18 V 2
Operating free-air temperature TA -40 85 °C 2
Supply current ICC 45 80 mA VCC = 12 V, TA = 25°C 3
Supply current in standby mode ICC(SB) 7 100 µA VCC = 12 V, TA = 25°C 3
Gain Gain 18.5 20 21 dB VCC = 12 V, RL = 4 Ω, f = 1 kHz, TA = 25°C 3
Channel balance 0.1 1 dB VCC = 12 V, RL = 4 Ω, f = 1 kHz, TA = 25°C 3
Supply current ICC 50 90 mA VCC = 14.5 V, TA = 25°C 3
Gain Gain 18.5 20 21 dB VCC = 14.5 V, RL = 4 Ω, f = 1 kHz, TA = 25°C 4
Channel balance 0.1 1 dB VCC = 14.5 V, RL = 4 Ω, f = 1 kHz, TA = 25°C 4
Thermal resistance junction-to-ambient (NE package) θJA 43.9 °C/W NE package, 0 CFM, 7 in² copper area (value as printed in text) 16
Derating factor (NE package) 22.8 mW/°C NE package, TA above 25°C, 7 in² copper area 2
Power dissipation rating (NE package) PD 2.85 W NE package, TA ≤ 25°C 2
Power dissipation rating (NE package) PD 1.82 W NE package, TA = 70°C 2
Power dissipation rating (NE package) PD 1.48 W NE package, TA = 85°C 2

CAD (KiCad official)

  • Symbol: TPA1517NE
  • Footprint: Package_DIP:DIP-20_W7.62mm
  • 3D model: PDIP-20 (KiCad packages3D, STEP)
  • 3D model files: tpa1517ne-etched.step / tpa1517ne-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa1517ne.step / tpa1517ne.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (24 pp, sha256 db63a7d9966e14b9, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF