component
OPA177CN
Public Made by Adomby adom
HGSEMI Operational Amplifier, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownOPA177CN
HGSEMI · Operational Amplifier · DIP-8
OPA177CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Offset Trim | passive | Offset voltage trim pin; an optional external 20k potentiometer connects here to adjust offset by about ±3mV. |
| 2 | -In | input | Inverting input, protected by 500Ω series resistors and diode clamps, withstanding ±30V differential input. |
| 3 | +In | input | Non-inverting input, protected by 500Ω series resistors and diode clamps, withstanding ±30V differential input. |
| 4 | V- | power_in | Negative power supply; supply voltage absolute maximum is ±22V. |
| 5 | NC | unconnected | No internal connection. |
| 6 | VO | output | Amplifier output, with continuous short-circuit protection to the supplies. |
| 7 | V+ | power_in | Positive power supply; supply voltage absolute maximum is ±22V. |
| 8 | Offset Trim | passive | Offset voltage trim pin; an optional external 20k potentiometer connects here to adjust offset by about ±3mV. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage (absolute maximum) | -22 | 22 | V | 3 | |||
| Differential Input Voltage | -30 | 30 | V | 3 | |||
| Operating Temperature | -40 | 85 | °C | Plastic DIP8, SOP8 | 3 | ||
| Thermal Resistance Junction-to-Ambient | θJA | 100 | °C/W | DIP8 package | 3 | ||
| Storage Temperature | -65 | 125 | °C | Plastic DIP8, SOP8 | 3 | ||
| Junction Temperature | 150 | °C | 3 | ||||
| Soldering Temperature (3s) | 260 | °C | N package, soldering 3s | 3 | |||
| Lead Temperature (Soldering 10 s) | 245 | °C | 3 | ||||
| Input Offset Voltage | 20 | 60 | µV | VS = ±15V, TA = +25°C | 4 | ||
| Offset Adjustment Range | -3 | 3 | mV | RP = 20k | 4 | ||
| Power Supply Rejection Ratio | 110 | 120 | dB | VS = ±3V to ±18V | 4 | ||
| Input Offset Current | 0.3 | 2.8 | nA | 4 | |||
| Input Bias Current | 0.5 | 2.8 | nA | 4 | |||
| Input Noise Voltage | 85 | 150 | nVrms | 1Hz to 100Hz | 4 | ||
| Input Resistance | 18.5 | 45 | MΩ | Differential Mode | 4 | ||
| Common-Mode Input Range | -13 | 14 | 13 | V | 4 | ||
| Common-Mode Rejection | 115 | 140 | dB | VCM = ±13V | 4 | ||
| Large Signal Voltage Gain | 200 | 6000 | V/mV | RL≥2KΩ, VO=±10V | 4 | ||
| Output Voltage Swing | -13.5 | 14 | 13.5 | V | RL≥10kΩ | 4 | |
| Output Voltage Swing | -12.5 | 13 | 12.5 | V | RL≥2kΩ | 4 | |
| Output Voltage Swing | -12 | 12.5 | 12 | V | RL≥1kΩ | 4 | |
| Slew Rate | 0.1 | 0.3 | V/µs | RL≥2kΩ | 4 | ||
| Closed-Loop Bandwidth | 0.4 | 0.6 | MHz | G=+1 | 4 | ||
| Power Consumption | 40 | 60 | mW | VS = ±15V, No Load | 4 | ||
| Power Consumption | 3.5 | 4.5 | mW | VS = ±3V, No Load | 4 | ||
| Supply Current | 1.3 | 2 | mW | VS = ±15V, No Load | 4 | ||
| Input Offset Voltage | 20 | 100 | µV | 5 | |||
| Average Input Offset Voltage Drift | 0.7 | 1.2 | µv/°C | 5 | |||
| Power Supply Rejection Ratio | 106 | 115 | dB | VS = ±3 to ±18V | 5 | ||
| Input Offset Current | 0.5 | 4.5 | nA | 5 | |||
| Average Input Offset Current Drift | 1.5 | 85 | Pa/°C | 5 | |||
| Input Bias Current | -6 | 0.5 | 6 | nA | 5 | ||
| Average Input Bias Current Drift | 15 | 60 | Pa/°C | 5 | |||
| Common-Mode Input Range | -13 | 13.5 | 13 | V | 5 | ||
| Common-Mode Rejection | 110 | 140 | dB | VCM = ±13V | 5 | ||
| Large Signal Voltage Gain | 1000 | 4000 | V/mV | RL≥2KΩ,VO=±10V | 5 | ||
| Output Voltage Swing | -12 | 13 | 12 | V | RL≥2KΩ | 5 | |
| Power Consumption | 60 | 75 | mW | VS = ±15V, No Load | 5 | ||
| Supply Current | 2 | 25 | mA | VS = ±15V, No Load | 5 |
CAD (KiCad official)
- Symbol:
OPA177CN - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
opa177cn-etched.step/opa177cn-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa177cn.step/opa177cn.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (14 pp, sha256
4d2c5c019e2a0560, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).