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OPA177CN

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HGSEMI Operational Amplifier, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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OPA177CN

HGSEMI · Operational Amplifier · DIP-8

OPA177CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Offset Trim passive Offset voltage trim pin; an optional external 20k potentiometer connects here to adjust offset by about ±3mV.
2 -In input Inverting input, protected by 500Ω series resistors and diode clamps, withstanding ±30V differential input.
3 +In input Non-inverting input, protected by 500Ω series resistors and diode clamps, withstanding ±30V differential input.
4 V- power_in Negative power supply; supply voltage absolute maximum is ±22V.
5 NC unconnected No internal connection.
6 VO output Amplifier output, with continuous short-circuit protection to the supplies.
7 V+ power_in Positive power supply; supply voltage absolute maximum is ±22V.
8 Offset Trim passive Offset voltage trim pin; an optional external 20k potentiometer connects here to adjust offset by about ±3mV.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Voltage (absolute maximum) -22 22 V 3
Differential Input Voltage -30 30 V 3
Operating Temperature -40 85 °C Plastic DIP8, SOP8 3
Thermal Resistance Junction-to-Ambient θJA 100 °C/W DIP8 package 3
Storage Temperature -65 125 °C Plastic DIP8, SOP8 3
Junction Temperature 150 °C 3
Soldering Temperature (3s) 260 °C N package, soldering 3s 3
Lead Temperature (Soldering 10 s) 245 °C 3
Input Offset Voltage 20 60 µV VS = ±15V, TA = +25°C 4
Offset Adjustment Range -3 3 mV RP = 20k 4
Power Supply Rejection Ratio 110 120 dB VS = ±3V to ±18V 4
Input Offset Current 0.3 2.8 nA 4
Input Bias Current 0.5 2.8 nA 4
Input Noise Voltage 85 150 nVrms 1Hz to 100Hz 4
Input Resistance 18.5 45 MΩ Differential Mode 4
Common-Mode Input Range -13 14 13 V 4
Common-Mode Rejection 115 140 dB VCM = ±13V 4
Large Signal Voltage Gain 200 6000 V/mV RL≥2KΩ, VO=±10V 4
Output Voltage Swing -13.5 14 13.5 V RL≥10kΩ 4
Output Voltage Swing -12.5 13 12.5 V RL≥2kΩ 4
Output Voltage Swing -12 12.5 12 V RL≥1kΩ 4
Slew Rate 0.1 0.3 V/µs RL≥2kΩ 4
Closed-Loop Bandwidth 0.4 0.6 MHz G=+1 4
Power Consumption 40 60 mW VS = ±15V, No Load 4
Power Consumption 3.5 4.5 mW VS = ±3V, No Load 4
Supply Current 1.3 2 mW VS = ±15V, No Load 4
Input Offset Voltage 20 100 µV 5
Average Input Offset Voltage Drift 0.7 1.2 µv/°C 5
Power Supply Rejection Ratio 106 115 dB VS = ±3 to ±18V 5
Input Offset Current 0.5 4.5 nA 5
Average Input Offset Current Drift 1.5 85 Pa/°C 5
Input Bias Current -6 0.5 6 nA 5
Average Input Bias Current Drift 15 60 Pa/°C 5
Common-Mode Input Range -13 13.5 13 V 5
Common-Mode Rejection 110 140 dB VCM = ±13V 5
Large Signal Voltage Gain 1000 4000 V/mV RL≥2KΩ,VO=±10V 5
Output Voltage Swing -12 13 12 V RL≥2KΩ 5
Power Consumption 60 75 mW VS = ±15V, No Load 5
Supply Current 2 25 mA VS = ±15V, No Load 5

CAD (KiCad official)

  • Symbol: OPA177CN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: opa177cn-etched.step / opa177cn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); opa177cn.step / opa177cn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 4d2c5c019e2a0560, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF