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Contents

README

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XL2596HVP-3.3E1

XLSEMI · DC-DC Converters · SOP-8-EP

XL2596HVP-3.3E1 from XLSEMI, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power input pin supporting a wide DC 4.5V~50V operating range; an electrolytic capacitor must be connected between VIN and GND to remove noise.
2 SW output Power switch output pin, which is the switching node of the output power stage.
3 FB input Feedback pin that senses the output voltage for regulation (via an external resistor divider on the ADJ version, whose reference voltage is 1.23V); the 3.3V fixed version has the divider built in.
4 EN input Enable pin, active low: low level operates, high level shuts down (high threshold 1.4V, low threshold 0.8V), and it reads as low when left floating.
5 GND power_in Ground pin (pins 5~8 are GND).
6 GND power_in Ground pin (pins 5~8 are GND).
7 GND power_in Ground pin (pins 5~8 are GND).
8 GND power_in Ground pin (pins 5~8 are GND).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (3.3V version) VOUT 3.25 3.3 3.35 V TA=25°C, VIN=12V, IOUT=0.5A 4
Efficiency (3.3V version) η 77.3 % VIN=12V, VOUT=3.3V, IOUT=1.5A 4
Operating voltage VIN 4.5 50 V TA=25°C, VEN=0V 5
Shutdown current IS 46 100 uA VEN=2V 5
Quiescent current IQ 1.3 2 mA Note 2: VFB=10V for 3.3V version 5
Oscillation frequency FOSC 135 150 165 KHz 5
Switch current limit IL 3 A VFB=0V 5
EN threshold high (shutdown) VEN_H 1.4 V 5
EN threshold low (on) VEN_L 0.8 V 5
EN pin current IEN 5 uA VEN=2.0V 5
Saturation voltage drop VCE 1.1 1.3 V VFB=0V, IOUT=2A 5
Maximum duty cycle DMAX 100 % VFB=0V 5
Thermal shutdown temperature TSD 180 °C 5
Thermal shutdown hysteresis TD 50 °C 5
Input voltage VIN -0.3 60 V 3
Feedback pin voltage VFB -0.3 20 V 3
Enable pin voltage VEN -0.3 7 V 3
Output switch pin voltage VSW -0.3 V max printed as VIN 3
Operating junction temperature TJ -40 150 °C 3
Storage temperature range TSTG -65 150 °C 3
Lead temperature TLEAD 260 °C soldering 10 seconds 3
ESD (HBM) ESD 8000 V printed as >8000 3
Thermal resistance junction to ambient (SOP8-EP) RJA 60 °C/W no external heat sink 3

CAD (KiCad official)

  • Symbol: XL2596HVP-3.3E1
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: xl2596hvp-3-3e1-etched.step / xl2596hvp-3-3e1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xl2596hvp-3-3e1.step / xl2596hvp-3-3e1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (17 pp, sha256 5a6d81fc8b895f6d, retrieved 2026-10-23, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF