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Contents

README

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SN6505DQDBVRQ1

Texas Instruments · Power Management - Specialized · SOT-23-6

SN6505DQDBVRQ1 from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D1 output Open drain output of the first power MOSFETs, typically connected to the outer terminals of the center tap transformer, with external traces kept short because large currents flow through this pin.
2 VCC power_in Device supply pin that should be bypassed with a 4.7 μF or greater, low ESR capacitor, and an internal undervoltage lockout trips and turns both outputs off when VCC ≤ 2.25 V.
3 D2 output Open drain output of the second power MOSFETs, typically connected to the outer terminals of the center tap transformer, with external traces kept short because large currents flow through this pin.
4 GND power_in Ground connected to the source of the power MOSFET switches via an internal sense circuit, which must be connected to a low-inductance quality ground plane because large currents flow through it.
5 EN input Enable pin that turns the device on or off, where grounding or leaving it floating disables all internal circuitry and it should be tied directly to VCC if unused.
6 CLK input Clock input used to run the device with an external clock, internally pulled down to GND, and the device automatically shifts to internal clock if no valid clock is detected on this pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 6 V 4
Voltage on EN, CLK EN, CLK -0.5 V max VCC + 0.5 (footnote 3: must not exceed 6 V) 4
Output switch voltage D1, D2 16 V 4
Peak output switch current I(D1)Pk, I(D2)Pk 2.4 A 4
Junction temperature TJ -40 150 °C 4
Storage temperature range Tstg -65 150 °C 4
ESD human-body model V(ESD) -6000 6000 V HBM, per AEC Q100-002 4
ESD charged-device model V(ESD) -1500 1500 V CDM, per AEC Q100-011 4
Supply voltage VCC 2.25 5.5 V 4
Output switch current, primary side ID1, ID2 0.75 A 2.25 V ≤ VCC ≤ 2.8 V 4
Output switch current, primary side ID1, ID2 1 A 2.8 V < VCC ≤ 5.5 V 4
Ambient temperature TA -40 125 °C 4
Supply current (SN6505B-Q1 and SN6505D-Q1) I(Vcc) 1.56 2.3 mA 2.8 V ≤ VCC ≤ 5.5 V; RL = 50 Ω 5
Leakage current on EN and CLK pin IIH 10 20 µA EN / CLK = VCC 5
D1, D2 average switching frequency (SN6505B-Q1 and SN6505D-Q1) FSW 363 424 517 kHz RL = 50 Ω to VCC; Refer to Figure 7-3. 5
External clock frequency on CLK pin (SN6505B-Q1 and SN6505D-Q1) F(EXT) 100 1600 kHz 5
Output switch on resistance R(ON) 0.16 0.25 Ω VCC = 4.5 V, ID1, ID2 = 1 A 5
Output switch on resistance R(ON) 0.19 0.31 Ω VCC = 2.8 V, ID1, ID2 = 1 A 5
Output switch on resistance R(ON) 0.21 0.45 Ω VCC = 2.25 V, ID1, ID2 = 0.5 A 5
Current clamp limit ILIM 1.42 1.75 2.15 A 2.8 V < VCC ≤ 5.5 V 5
Current clamp limit ILIM 0.65 1.85 A 2.25 V ≤ VCC ≤ 2.8 V 5
TSD turn on temperature TSD+ 154 168 181 °C 5
TSD turn off temperature TSD- 135 150 166 °C 5
TSD hysteresis TSD- 13 17 °C 5
Duration after which device switches to internal clock in case of invalid external clock tCLKTIMER 10 25 µs 6
Power up time (2.25 V ≤ VCC < 3 V) tPWRUP 75 160 µs From EN=1 to full drive-current available at D1 and D2; 2.25 V ≤ VCC < 3 V 6
Power up time (3 V ≤ VCC ≤ 5.5 V) tPWRUP 60 100 µs From EN=1 to full drive-current available at D1 and D2; 3 V ≤ VCC ≤ 5.5 V 6
Power down time tPWRDN 1 5 µs From EN=0 to output MOSFETs off (no current on D1 and D2) 6
Junction-to-ambient thermal resistance RθJA 137.7 °C/W 4
Junction-to-case (top) thermal resistance RθJC(top) 57.7 °C/W 4
Junction-to-board thermal resistance RθJB 46 °C/W 4
Junction-to-top characterization parameter ψJT 13.4 °C/W 4
Junction-to-board characterization parameter ψJB 44.9 °C/W 4

CAD (KiCad official)

  • Symbol: SN6505DQDBVRQ1
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: sn6505dqdbvrq1-etched.step / sn6505dqdbvrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn6505dqdbvrq1.step / sn6505dqdbvrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (40 pp, sha256 3c8af11607815139, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF