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Contents

README

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CFS12V3T3R00

TA I Tech · Disposable Fuses · 1206

CFS12V3T3R00 from TA I Tech, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse; non-polarized and interchangeable with the other terminal.
2 2 passive Other end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse, with 23 mΩ typical resistance (±25%) and 50A DC32V breaking capacity.

Key specifications

Parameter Value
Manufacturer TA I Tech
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance tolerance -25 25 % 3
Fusing time (open within) 5 sec at 250% rated current 3
Resistance change, resistance to dry heat ΔR -20 20 % 105℃±5℃, 1000 hrs 4
Resistance change, resistance to solder heat ΔR -20 20 % 260℃±5℃, 10±1 second 4
Resistance change, thermal shock ΔR 10 % -20℃/+25℃/+125℃/+25℃, 10 cycles 4
Residual resistance after fusing 10 kΩ measure DC resistance after fusing 4
Solder ability coverage 95 % 235℃±5℃, 2±0.5 second (coverage minimum) 4
Solder ability coverage (lead free) 95 % 245℃±5℃, 2±0.5 second (Lead Free) 4
Body temperature rise 75 ℃ at 100% rated current, surface temperature 3
Operating temperature -20 105 ℃ with proper derating factor 4
Rated voltage 32 V DC 3
Breaking capacity 50 A DC 32V 3
Rated current 3 A carrying capacity: no fusing at rated current for 4 hr 4
Resistance (nominal) 23 mΩ measured with less than 10% of rated current 3
Typical I2t I2t 0.933 A2s typical, measured at 10x rated current 12
Preheat zone temperature 150 180 ℃ reflow preheat, 90±30 sec 8
Soldering zone temperature 230 ℃ reflow soldering zone, 30±10 sec 8

CAD (KiCad official)

  • Symbol: CFS12V3T3R00
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: cfs12v3t3r00-etched.step / cfs12v3t3r00-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cfs12v3t3r00.step / cfs12v3t3r00.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TA I Tech datasheet (20 pp, sha256 13678171757b8e0a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF