component
CFS12V3T3R00
Public Made by Adomby adom
TA I Tech Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 7d ago |
| viewers | 7d ago |
| cfs12v3t3r00-etched.glb | 7d ago |
| cfs12v3t3r00-etched.step | 7d ago |
| cfs12v3t3r00-hero.glb | 7d ago |
| cfs12v3t3r00-hero.overlay.json | 7d ago |
| cfs12v3t3r00.glb | 7d ago |
| cfs12v3t3r00.kicad_mod | 7d ago |
| cfs12v3t3r00.kicad_sym | 7d ago |
| cfs12v3t3r00.lbr | 7d ago |
| cfs12v3t3r00.step | 7d ago |
| package.json | 7d ago |
| page.json | 7d ago |
| README.md | 7d ago |
CFS12V3T3R00
TA I Tech · Disposable Fuses · 1206
CFS12V3T3R00 from TA I Tech, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse; non-polarized and interchangeable with the other terminal. |
| 2 | 2 | passive | Other end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse, with 23 mΩ typical resistance (±25%) and 50A DC32V breaking capacity. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TA I Tech |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance | -25 | 25 | % | 3 | |||
| Fusing time (open within) | 5 | sec | at 250% rated current | 3 | |||
| Resistance change, resistance to dry heat | ΔR | -20 | 20 | % | 105℃±5℃, 1000 hrs | 4 | |
| Resistance change, resistance to solder heat | ΔR | -20 | 20 | % | 260℃±5℃, 10±1 second | 4 | |
| Resistance change, thermal shock | ΔR | 10 | % | -20℃/+25℃/+125℃/+25℃, 10 cycles | 4 | ||
| Residual resistance after fusing | 10 | kΩ | measure DC resistance after fusing | 4 | |||
| Solder ability coverage | 95 | % | 235℃±5℃, 2±0.5 second (coverage minimum) | 4 | |||
| Solder ability coverage (lead free) | 95 | % | 245℃±5℃, 2±0.5 second (Lead Free) | 4 | |||
| Body temperature rise | 75 | ℃ | at 100% rated current, surface temperature | 3 | |||
| Operating temperature | -20 | 105 | ℃ | with proper derating factor | 4 | ||
| Rated voltage | 32 | V | DC | 3 | |||
| Breaking capacity | 50 | A | DC 32V | 3 | |||
| Rated current | 3 | A | carrying capacity: no fusing at rated current for 4 hr | 4 | |||
| Resistance (nominal) | 23 | mΩ | measured with less than 10% of rated current | 3 | |||
| Typical I2t | I2t | 0.933 | A2s | typical, measured at 10x rated current | 12 | ||
| Preheat zone temperature | 150 | 180 | ℃ | reflow preheat, 90±30 sec | 8 | ||
| Soldering zone temperature | 230 | ℃ | reflow soldering zone, 30±10 sec | 8 |
CAD (KiCad official)
- Symbol:
CFS12V3T3R00 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
cfs12v3t3r00-etched.step/cfs12v3t3r00-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cfs12v3t3r00.step/cfs12v3t3r00.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TA I Tech datasheet (20 pp, sha256
13678171757b8e0a, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).