# CFS12V3T3R00

**TA I Tech** · Disposable Fuses · 1206

CFS12V3T3R00 from TA I Tech, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse; non-polarized and interchangeable with the other terminal. |
| 2 | 2 | passive | Other end terminal (Cu/Ni/Sn plated) of the 3.00A, DC 32V thin film chip fuse, with 23 mΩ typical resistance (±25%) and 50A DC32V breaking capacity. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TA I Tech |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance |  | -25 |  | 25 | % |  | 3 |
| Fusing time (open within) |  |  |  | 5 | sec | at 250% rated current | 3 |
| Resistance change, resistance to dry heat | ΔR | -20 |  | 20 | % | 105℃±5℃, 1000 hrs | 4 |
| Resistance change, resistance to solder heat | ΔR | -20 |  | 20 | % | 260℃±5℃, 10±1 second | 4 |
| Resistance change, thermal shock | ΔR |  |  | 10 | % | -20℃/+25℃/+125℃/+25℃, 10 cycles | 4 |
| Residual resistance after fusing |  | 10 |  |  | kΩ | measure DC resistance after fusing | 4 |
| Solder ability coverage |  | 95 |  |  | % | 235℃±5℃, 2±0.5 second (coverage minimum) | 4 |
| Solder ability coverage (lead free) |  | 95 |  |  | % | 245℃±5℃, 2±0.5 second (Lead Free) | 4 |
| Body temperature rise |  |  |  | 75 | ℃ | at 100% rated current, surface temperature | 3 |
| Operating temperature |  | -20 |  | 105 | ℃ | with proper derating factor | 4 |
| Rated voltage |  |  |  | 32 | V | DC | 3 |
| Breaking capacity |  |  |  | 50 | A | DC 32V | 3 |
| Rated current |  |  | 3 |  | A | carrying capacity: no fusing at rated current for 4 hr | 4 |
| Resistance (nominal) |  |  | 23 |  | mΩ | measured with less than 10% of rated current | 3 |
| Typical I2t | I2t |  | 0.933 |  | A2s | typical, measured at 10x rated current | 12 |
| Preheat zone temperature |  | 150 |  | 180 | ℃ | reflow preheat, 90±30 sec | 8 |
| Soldering zone temperature |  | 230 |  |  | ℃ | reflow soldering zone, 30±10 sec | 8 |

## CAD (KiCad official)

- Symbol: `CFS12V3T3R00`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `cfs12v3t3r00-etched.step` / `cfs12v3t3r00-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cfs12v3t3r00.step` / `cfs12v3t3r00.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TA I Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588905452625678336) (20 pp, sha256 `13678171757b8e0a`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cfs12v3t3r00-datasheet.pdf)