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Contents

README

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HGX485EIN

HGSEMI · RS-485 / RS-422 ICs · DIP-8

HGX485EIN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: when RE is low, RO is high if (A - B) is at least 200 mV and low if (A - B) is at most -200 mV.
2 RE input Receiver output enable: RO is active when RE is low and high-impedance when RE is high, and RE uses a hot-plug input structure; RE high together with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: the driver output is active when DE is high and high-impedance when DE is low, and DE uses a hot-plug input structure; RE high together with DE low puts the device into low-power shutdown.
4 DI input Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground.
6 A bidirectional Receiver non-inverting input and driver non-inverting output.
7 B bidirectional Receiver inverting input and driver inverting output.
8 VCC power_in Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; connect a 0.1 µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 6 V 3
Control input voltage (RE, DE) -0.3 6 V 3
Driver input voltage DI -0.3 6 V 3
Driver output voltage A,B -7 12 V 3
Receiver input voltage A,B -7 12 V 3
Receiver output voltage RO -0.3 V Printed as VCC+0.3 V 3
Continuous power dissipation (DIP) 725 mW TA=+70℃ 3
Storage temperature -65 150 ℃ 3
Lead temperature (soldering) TLEAD 260 ℃ soldering, 10 s 3
Operating temperature range (HGX485EI) -40 85 ℃ Industrial grade (HGX485EI) 3
Supply voltage VCC 4.5 5.5 V 4
Differential driver output voltage VOD 2.7 V 图 1,RL=100Ω(RS-422) 4
Differential driver output voltage VOD 2.1 V 图 1,RL=54Ω(RS-485) 4
Change in differential driver output voltage magnitude ΔVOD 0.2 V 图 1,RL=100Ω 或 RL=54Ω 4
Driver common-mode output voltage VOC 3 V 图 1,RL=100Ω 或 RL=54Ω 4
Change in common-mode voltage magnitude ΔVOC 0.2 V 图 1,RL=100Ω 或 RL=54Ω 4
Input high voltage VIH 2 V DE, DI, RE 4
Input low voltage VIL 0.8 V DE, DI, RE 4
Input current IIN -1 1 μA DE, DI, RE 4
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 4
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦VCC 4
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V≦VOUT≦Vcc+0.5V 4
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≦VOUT≦+1V 4
Receiver differential threshold voltage VTH -200 200 mV -7V≦VCM≦12V 4
Receiver output low voltage VOL 0.4 V IO= 4mA,VID=-200mV 4
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 4
Receiver output short-circuit current IOSR -7 95 mA 0V≦VRO≦VCC 4
Supply current (no load, RE=VCC, DE=VCC) Icc 530 900 μA 无负载,RE=VCC, DI=GND或VCC, DE=VCC 5
Supply current (no load, RE=VCC, DE=GND) Icc 475 600 μA 无负载,RE=VCC, DI=GND或VCC, DE=GND 5
Supply current (no load, RE=GND, DE=VCC) Icc 530 1000 μA 无负载,RE=GND, DI=GND或VCC, DE=VCC 5
Supply current (no load, RE=GND, DE=GND) Icc 475 800 μA 无负载,RE=GND, DI=GND或VCC, DE=GND 5
Standby mode supply current ISHDN 0.05 10 μA DE = GND,RE = VCC 5
A, B ESD protection (IEC61000-4-2 air-gap) -16 16 kV A, B pins, IEC61000-4-2 air-gap model 5
A, B ESD protection (IEC61000-4-2 contact) -8 8 kV A, B pins, IEC61000-4-2 contact model 5
ESD protection (HBM, all pins) -4 4 kV HBM model, all pins 5
Driver standby time tSHDN 50 350 700 ns 5
Receiver standby time tSHDN 50 350 700 ns 6

CAD (KiCad official)

  • Symbol: HGX485EIN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hgx485ein-etched.step / hgx485ein-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgx485ein.step / hgx485ein.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 d939f6bd855e4a9f, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF