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HGX485EIN
Public Made by Adomby adom
HGSEMI RS-485 / RS-422 ICs, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGX485EIN
HGSEMI · RS-485 / RS-422 ICs · DIP-8
HGX485EIN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: when RE is low, RO is high if (A - B) is at least 200 mV and low if (A - B) is at most -200 mV. |
| 2 | RE | input | Receiver output enable: RO is active when RE is low and high-impedance when RE is high, and RE uses a hot-plug input structure; RE high together with DE low puts the device into low-power shutdown. |
| 3 | DE | input | Driver output enable: the driver output is active when DE is high and high-impedance when DE is low, and DE uses a hot-plug input structure; RE high together with DE low puts the device into low-power shutdown. |
| 4 | DI | input | Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Receiver non-inverting input and driver non-inverting output. |
| 7 | B | bidirectional | Receiver inverting input and driver inverting output. |
| 8 | VCC | power_in | Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; connect a 0.1 µF capacitor to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 6 | V | 3 | |||
| Control input voltage (RE, DE) | -0.3 | 6 | V | 3 | |||
| Driver input voltage | DI | -0.3 | 6 | V | 3 | ||
| Driver output voltage | A,B | -7 | 12 | V | 3 | ||
| Receiver input voltage | A,B | -7 | 12 | V | 3 | ||
| Receiver output voltage | RO | -0.3 | V | Printed as VCC+0.3 V | 3 | ||
| Continuous power dissipation (DIP) | 725 | mW | TA=+70℃ | 3 | |||
| Storage temperature | -65 | 150 | ℃ | 3 | |||
| Lead temperature (soldering) | TLEAD | 260 | ℃ | soldering, 10 s | 3 | ||
| Operating temperature range (HGX485EI) | -40 | 85 | ℃ | Industrial grade (HGX485EI) | 3 | ||
| Supply voltage | VCC | 4.5 | 5.5 | V | 4 | ||
| Differential driver output voltage | VOD | 2.7 | V | 图 1,RL=100Ω(RS-422) | 4 | ||
| Differential driver output voltage | VOD | 2.1 | V | 图 1,RL=54Ω(RS-485) | 4 | ||
| Change in differential driver output voltage magnitude | ΔVOD | 0.2 | V | 图 1,RL=100Ω 或 RL=54Ω | 4 | ||
| Driver common-mode output voltage | VOC | 3 | V | 图 1,RL=100Ω 或 RL=54Ω | 4 | ||
| Change in common-mode voltage magnitude | ΔVOC | 0.2 | V | 图 1,RL=100Ω 或 RL=54Ω | 4 | ||
| Input high voltage | VIH | 2 | V | DE, DI, RE | 4 | ||
| Input low voltage | VIL | 0.8 | V | DE, DI, RE | 4 | ||
| Input current | IIN | -1 | 1 | μA | DE, DI, RE | 4 | |
| Driver short-circuit output current | IOSD | 250 | mA | 0≦VOUT≦12V | 4 | ||
| Driver short-circuit output current | IOSD | -250 | mA | -7≦VOUT≦VCC | 4 | ||
| Driver short-circuit foldback output current | IOSDF | 20 | mA | Vcc-1V≦VOUT≦Vcc+0.5V | 4 | ||
| Driver short-circuit foldback output current | IOSDF | -20 | mA | -0.5V≦VOUT≦+1V | 4 | ||
| Receiver differential threshold voltage | VTH | -200 | 200 | mV | -7V≦VCM≦12V | 4 | |
| Receiver output low voltage | VOL | 0.4 | V | IO= 4mA,VID=-200mV | 4 | ||
| Receiver tri-state output current | IOZR | -1 | 1 | μA | 0≦VO≦VCC | 4 | |
| Receiver output short-circuit current | IOSR | -7 | 95 | mA | 0V≦VRO≦VCC | 4 | |
| Supply current (no load, RE=VCC, DE=VCC) | Icc | 530 | 900 | μA | 无负载,RE=VCC, DI=GND或VCC, DE=VCC | 5 | |
| Supply current (no load, RE=VCC, DE=GND) | Icc | 475 | 600 | μA | 无负载,RE=VCC, DI=GND或VCC, DE=GND | 5 | |
| Supply current (no load, RE=GND, DE=VCC) | Icc | 530 | 1000 | μA | 无负载,RE=GND, DI=GND或VCC, DE=VCC | 5 | |
| Supply current (no load, RE=GND, DE=GND) | Icc | 475 | 800 | μA | 无负载,RE=GND, DI=GND或VCC, DE=GND | 5 | |
| Standby mode supply current | ISHDN | 0.05 | 10 | μA | DE = GND,RE = VCC | 5 | |
| A, B ESD protection (IEC61000-4-2 air-gap) | -16 | 16 | kV | A, B pins, IEC61000-4-2 air-gap model | 5 | ||
| A, B ESD protection (IEC61000-4-2 contact) | -8 | 8 | kV | A, B pins, IEC61000-4-2 contact model | 5 | ||
| ESD protection (HBM, all pins) | -4 | 4 | kV | HBM model, all pins | 5 | ||
| Driver standby time | tSHDN | 50 | 350 | 700 | ns | 5 | |
| Receiver standby time | tSHDN | 50 | 350 | 700 | ns | 6 |
CAD (KiCad official)
- Symbol:
HGX485EIN - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
hgx485ein-etched.step/hgx485ein-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgx485ein.step/hgx485ein.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (17 pp, sha256
d939f6bd855e4a9f, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).