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Contents

README

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BR24G1MFJ-5AE2

ROHM Semicon · EEPROM · SOIC-8

BR24G1MFJ-5AE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 unconnected Not used as a device address; it may be connected to VCC or GND or left open.
2 A1 input Slave address setting input; connect to VCC or GND, and it has an internal pull-down so an open pin behaves as GND.
3 A2 input Slave address setting input; connect to VCC or GND, and it has an internal pull-down so an open pin behaves as GND.
4 GND power_in Reference voltage of all inputs and outputs, 0 V.
5 SDA bidirectional Serial data input/output; NMOS open drain that requires a pull-up resistor, with a maximum output low current IOLMAX of 10 mA at Ta = 25 °C.
6 SCL input Serial clock input.
7 WP input Write protect input; connect to VCC or GND or drive HIGH or LOW, and an open pin is recognized as LOW due to an internal pull-down.
8 VCC power_in Power supply pin, operating supply voltage 1.7 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6.5 V Ta = 25 °C 4
Input Voltage / Output Voltage -0.3 V Ta = 25 °C; max not over 6.5 V; min -1.0 V for pulse width 50 ns or less; max printed as VCC+1.0 4
Electro Static Discharge (Human Body Model) VESD -4000 4000 V Ta = 25 °C 4
Maximum Output Low Current (SDA) IOLMAX 10 mA Ta = 25 °C 4
Maximum Junction Temperature Tjmax 150 °C 4
Storage Temperature Range Tstg -65 150 °C 4
Supply Voltage VCC 1.7 5.5 V 5
Ambient Operating Temperature Ta -40 85 °C 5
Bypass Capacitor C 0.1 μF Connect between VCC and GND (Note 9) 5
Input/Output Capacitance (SDA) CI/O 8 pF Ta = 25 °C, f = 1 MHz; VI/O = GND 5
Input Capacitance (SCL, A0, A1, A2, WP) CIN 8 pF Ta = 25 °C, f = 1 MHz; VIN = GND 5
Input Impedance 1 ZIH 500 kΩ 0.7VCC ≤ VIN (A1, A2, WP) 5
Input Impedance 2 ZIL 30 kΩ VIN ≤ 0.3VCC (A1, A2, WP) 5
Input Low Voltage VIL -0.3 V 5
Output Low Voltage 1 VOL1 0.4 V IOL = 3.2 mA, 2.5 V ≤ VCC ≤ 5.5 V (SDA) 5
Output Low Voltage 2 VOL2 0.2 V IOL = 1.0 mA, 1.7 V ≤ VCC < 2.5 V (SDA) 5
Input Leakage Current 1 ILI1 -1 1 μA VIN = 0 V or VCC (A1, A2, WP) 5
Input Leakage Current 2 ILI2 -1 1 μA VIN = 0 V to VCC (A0, SCL) 5
Output Leakage Current ILO -1 1 μA VOUT = 0 V to VCC (SDA) 5
Supply Current (Write) ICC1 3 mA VCC = 5.5 V, fSCL = 1 MHz, tWR = 3.5 ms; Byte Write, Page Write; average value 5
Supply Current (Read) ICC2 1.5 mA VCC = 5.5 V, fSCL = 1 MHz; Random Read, Current Read, Sequential Read; average value 5
Standby Current ISB 5 μA VCC = 5.5 V, SDA, SCL = VCC; A1, A2, WP = 0 V 5
Clock Frequency fSCL 1 MHz 6
Data Clock High Period tHIGH 260 ns 6
Data Clock Low Period tLOW 500 ns 6
SDA, SCL (input) Rise Time tR 1000 ns 6
SDA, SCL (input) Fall Time tF1 1000 ns 6
SDA (output) Fall Time tF2 120 ns 6
Start Condition Hold Time tHD:STA 250 ns 6
Start Condition Setup Time tSU:STA 200 ns 6
Input Data Hold Time tHD:DAT 0 ns 6
Input Data Setup Time tSU:DAT 50 ns 6
Output Data Delay Time tPD 50 450 ns 6
Output Data Hold Time tDH 50 ns 6
Stop Condition Setup Time tSU:STO 250 ns 6
Bus Free Time tBUF 500 ns 6
Write Cycle Time tWR 3.5 ms 6
Noise Suppression Time (SCL, SDA) tI 50 ns 6
WP Hold Time tHD:WP 1 μs 6
WP Setup Time tSU:WP 0.1 μs 6
WP High Period tHIGH:WP 1 μs 6
Write Cycles 4e+06 Times Ta = 25 °C 5
Data Retention 200 Years Ta = 55 °C 5
Junction to Ambient (1s board) θJA 149.3 °C/W 1s board per JESD51-3; still air per JESD51-2A 4
Junction to Ambient (2s2p board) θJA 76.9 °C/W 2s2p board per JESD51-7; still air per JESD51-2A 4
Junction to Top Characterization Parameter (1s board) ΨJT 18 °C/W 1s board per JESD51-3 4
Junction to Top Characterization Parameter (2s2p board) ΨJT 11 °C/W 2s2p board per JESD51-7 4

CAD (KiCad official)

  • Symbol: BR24G1MFJ-5AE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: br24g1mfj-5ae2-etched.step / br24g1mfj-5ae2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br24g1mfj-5ae2.step / br24g1mfj-5ae2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (37 pp, sha256 1e3b2bedd23845d1, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF