component
WNM7002-3
Public Made by Adomby adom
WILLSEMI Will Semicon MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownWNM7002-3
WILLSEMI Will Semicon · MOSFETs · SOT-23
WNM7002-3 from WILLSEMI Will Semicon, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET; the datasheet gives VGS absolute maximum of ±20 V and a gate threshold voltage VGS(TH) of 1.0 V to 2.0 V at VGS = VDS, ID = 250 µA. |
| 2 | S | passive | Source of the N-channel MOSFET; the body diode forward voltage VSD is 0.8 V typical and 1.2 V maximum at VGS = 0 V, IS = 200 mA. |
| 3 | D | passive | Drain of the N-channel MOSFET; the datasheet gives drain-source voltage VDS of 60 V maximum and continuous drain current ID of 0.30 A at TA = 25°C (1 in² pad, 10 s). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WILLSEMI Will Semicon |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | 2 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 2 | ||
| Continuous Drain Current (a, TA=25°C, 10 s) | ID | 0.3 | A | Surface mounted on FR4, 1 sq in pad, 1oz Cu; t≤10 s; TA=25°C | 2 | ||
| Continuous Drain Current (a, TA=25°C, steady state) | ID | 0.28 | A | Surface mounted on FR4, 1 sq in pad, 1oz Cu; steady state; TA=25°C | 2 | ||
| Continuous Drain Current (a, TA=70°C, 10 s) | ID | 0.24 | A | Surface mounted on FR4, 1 sq in pad, 1oz Cu; t≤10 s; TA=70°C | 2 | ||
| Continuous Drain Current (a, TA=70°C, steady state) | ID | 0.22 | A | Surface mounted on FR4, 1 sq in pad, 1oz Cu; steady state; TA=70°C | 2 | ||
| Maximum Power Dissipation (a, TA=25°C, 10 s) | PD | 0.96 | W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; t≤10 s; TA=25°C | 2 | ||
| Maximum Power Dissipation (a, TA=25°C, steady state) | PD | 0.83 | W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; steady state; TA=25°C | 2 | ||
| Maximum Power Dissipation (a, TA=70°C, 10 s) | PD | 0.61 | W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; t≤10 s; TA=70°C | 2 | ||
| Maximum Power Dissipation (a, TA=70°C, steady state) | PD | 0.53 | W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; steady state; TA=70°C | 2 | ||
| Continuous Drain Current (b, TA=25°C, 10 s) | ID | 0.26 | A | Surface mounted on FR4, minimum pad, 1oz Cu; t≤10 s; TA=25°C | 2 | ||
| Continuous Drain Current (b, TA=25°C, steady state) | ID | 0.25 | A | Surface mounted on FR4, minimum pad, 1oz Cu; steady state; TA=25°C | 2 | ||
| Continuous Drain Current (b, TA=70°C, 10 s) | ID | 0.21 | A | Surface mounted on FR4, minimum pad, 1oz Cu; t≤10 s; TA=70°C | 2 | ||
| Continuous Drain Current (b, TA=70°C, steady state) | ID | 0.2 | A | Surface mounted on FR4, minimum pad, 1oz Cu; steady state; TA=70°C | 2 | ||
| Maximum Power Dissipation (b, TA=25°C, 10 s) | PD | 0.78 | W | Surface mounted on FR4, minimum pad, 1oz Cu; t≤10 s; TA=25°C | 2 | ||
| Maximum Power Dissipation (b, TA=25°C, steady state) | PD | 0.66 | W | Surface mounted on FR4, minimum pad, 1oz Cu; steady state; TA=25°C | 2 | ||
| Maximum Power Dissipation (b, TA=70°C, 10 s) | PD | 0.5 | W | Surface mounted on FR4, minimum pad, 1oz Cu; t≤10 s; TA=70°C | 2 | ||
| Maximum Power Dissipation (b, TA=70°C, steady state) | PD | 0.42 | W | Surface mounted on FR4, minimum pad, 1oz Cu; steady state; TA=70°C | 2 | ||
| Pulsed Drain Current | IDM | 1.2 | A | Repetitive rating, pulse width limited by junction temperature, tp=10µs, Duty Cycle=1% | 2 | ||
| Operating Junction Temperature | TJ | -55 | 150 | °C | 2 | ||
| Lead Temperature | TL | 260 | °C | 2 | |||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 2 | ||
| Junction-to-Ambient Thermal Resistance (a, t≤10 s) | RθJA | 105 | 130 | °C/W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; t≤10 s | 2 | |
| Junction-to-Ambient Thermal Resistance (a, steady state) | RθJA | 130 | 150 | °C/W | Surface mounted on FR4, 1 sq in pad, 1oz Cu; steady state | 2 | |
| Junction-to-Ambient Thermal Resistance (b, t≤10 s) | RθJA | 130 | 160 | °C/W | Surface mounted on FR4, minimum pad, 1oz Cu; t≤10 s | 2 | |
| Junction-to-Ambient Thermal Resistance (b, steady state) | RθJA | 145 | 190 | °C/W | Surface mounted on FR4, minimum pad, 1oz Cu; steady state | 2 | |
| Junction-to-Case Thermal Resistance | RθJC | 40 | 60 | °C/W | Steady state | 2 | |
| Drain-to-Source Breakdown Voltage | BVDSS | 60 | V | VGS = 0 V, ID = 250uA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS = 48V, VGS = 0V | 3 | ||
| Gate-to-source Leakage Current | IGSS | -5 | 5 | uA | VDS = 0 V, VGS = ±20V | 3 | |
| Gate Threshold Voltage | VGS(TH) | 1 | 1.4 | 2 | V | VGS = VDS, ID = 250uA | 3 |
| Drain-to-source On-resistance (VGS=10V) | RDS(on) | 3.7 | 4.7 | Ω | VGS = 10V, ID = 0.3A | 3 | |
| Drain-to-source On-resistance (VGS=4.5V) | RDS(on) | 3.8 | 5.6 | Ω | VGS = 4.5V, ID = 0.2A | 3 | |
| Forward Voltage | VSD | 0.8 | 1.2 | V | VGS = 0 V, IS = 200mA | 3 |
CAD (KiCad official)
- Symbol:
WNM7002-3 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
wnm7002-3-etched.step/wnm7002-3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);wnm7002-3.step/wnm7002-3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WILLSEMI Will Semicon datasheet (8 pp, sha256
7e1279b7a5d7e2e4, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).