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MAX3078EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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MAX3078EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

MAX3078EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A−B is at or above the -50mV threshold and low when A−B is at or below -200mV, and it is high-impedance when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and goes high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3 DE input Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE has a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5 GND power_in Ground.
6 A bidirectional Receiver non-inverting input and driver non-inverting output (A/Y); receiver threshold is ±200mV EIA/TIA-485 compatible with 96kΩ typical input impedance per the datasheet's receiver specification.
7 B bidirectional Receiver inverting input and driver inverting output (B/Z); receiver input impedance is 1/8 unit load (96kΩ) for common-mode range -7V to +12V.
8 VCC power_in Positive supply, 3.15V to 3.45V; decouple with a 0.1µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 3.15 3.45 V 3
Operating temperature range (industrial, MAX307_I_) TA -40 85 ℃ MAX307_I_ (industrial grade) 3
Supply voltage (absolute maximum) VCC 6 V 3
Control and driver input voltage RE, DE, DI -0.3 6 V 3
Driver output voltage A,B,Y,Z -7 12 V 3
Receiver input voltage A,B -7 12 V 3
Receiver output voltage RO -0.3 V 3
Continuous power dissipation, 8-pin SO 500 mW TA=+70℃ 3
Storage temperature -65 150 ℃ 3
Lead temperature (soldering) TLEAD 260 ℃ soldering, 10 s 3
Differential driver output voltage (RS-422 load) VOD 2 V Fig.1, RL=100Ω (RS-422) 3
Differential driver output voltage (RS-485 load) VOD 1.5 V Fig.1, RL=54Ω (RS-485) 3
Differential driver output voltage magnitude change ΔVOD 0.2 V Fig.1, RL=100Ω or RL=54Ω 3
Driver common-mode output voltage VOC 3 V Fig.1, RL=100Ω or RL=54Ω 3
Common-mode voltage magnitude change ΔVOC 0.2 V Fig.1, RL=100Ω or RL=54Ω 3
Input high voltage VIH 2 V DE, DI, RE 4
Input low voltage VIL 0.8 V DE, DI 4
Input current IIN -1 1 μA DE, DI, RE 4
Input current (A, B), VIN=12V IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Input current (A, B), VIN=-7V IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Output leakage current (Y, Z), VIN=12V IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Output leakage current (Y, Z), VIN=-7V IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 4
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦VCC 4
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V ≦VOUT ≦Vcc+0.3.3V 4
Driver short-circuit foldback output current IOSDF -20 mA -0.3.3V ≦VOUT ≦+1V 4
Receiver differential threshold voltage VTH -200 200 mV -7V≦VCM≦12V 4
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 4
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 4
Receiver input resistance RIN 96 kΩ -7V≦VCM≦12V 4
Receiver output short-circuit current IOSR 7 95 mA 0V≦VRO≦VCC 4
Supply current Icc 400 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 4
Supply current Icc 330 600 μA No load, RE=VCC, DI=GND or VCC, DE=GND 4
Supply current Icc 400 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 4
Supply current Icc 330 800 μA No load, RE=GND, DI=GND or VCC, DE=GND 4
Standby supply current (shutdown) ISHDN 0.05 10 μA DE=GND, RE=VCC 4
ESD protection, RS-485 pins (IEC61000-4-2 air-gap discharge) -16 16 kV IEC61000-4-2 air-gap discharge 4
ESD protection, RS-485 pins (IEC61000-4-2 contact discharge, half-duplex) -16 16 kV IEC61000-4-2 contact discharge, half-duplex 4
ESD protection, HBM pin to ground -16 16 kV HBM, pin to ground 4
Driver propagation delay (rise and fall) tDPLH, tDPHL 50 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Driver output skew tDSKEW 10 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Driver rise and fall time tDR, tDF 20 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Maximum data rate (driver) fMAX 16 Mbps 7
Driver enable to output high (table label: receiver enable to output low) tDZH 150 ns Fig.3 and 6, CL=100pF, S3 closed 7
Driver enable to output low (table label: receiver enable to output high) tDZL 150 ns Fig.3 and 6, CL=100pF, S2 closed 7
Driver low to disable time tDLZ 100 ns Fig.3 and 6, CL=15pF, S2 closed 7
Driver high to disable time tDHZ 100 ns Fig.3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output high tDZH(SHDN) 2200 ns Fig.3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output low tDZL(SHDN) 2200 ns Fig.3 and 6, CL=15pF, S2 closed 7
Standby time (driver table) tSHDN 50 350 700 ns 7
Receiver propagation delay tRPLH, tRPHL 50 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Receiver output skew tRSKEW 20 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Maximum data rate (receiver) fMAX 16 Mbps 7
Receiver enable to output low tRZL 50 ns Fig.4 and 9, S1=-1.3.3V, S2 to VCC 7
Receiver enable to output high tRZH 50 ns Fig.4 and 9, S1=+1.3.3V, S2 to GND 7
Receiver low to disable time tRLZ 50 ns Fig.4 and 9, S1=-1.3.3V, S2 to VCC 7
Receiver high to disable time tRHZ 50 ns Fig.4 and 9, S1=+1.3.3V, S2 to GND 7
Receiver enable from standby to output high tRZH(SHDN) 2200 ns Fig.4 and 9, S1=-1.3.3V, S2 to VCC 7
Receiver enable from standby to output low tRZL(SHDN) 2200 ns Fig.4 and 9, S1=+1.3.3V, S2 to GND 7
Standby time (receiver table) tSHDN 50 350 700 ns 7

CAD (KiCad official)

  • Symbol: MAX3078EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: max3078eim-etched.step / max3078eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3078eim.step / max3078eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (23 pp, sha256 96528bc5b794065e, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF